iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital gyroscope.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.

The LSM330 has a user-selectable full-scale acceleration range of ±2/±4/±6/±8/±16 g and an angular rate range of ±250/±500/±2000 dps. The accelerometer and gyroscope sensors can be either activated or separately put in power-down / sleep mode for applications optimized for power saving.

The LSM330 is available in a plastic land grid array (LGA) package.

Key Features

  • Analog supply voltage: 2.4 V to 3.6 V
  • Digital supply voltage IOs: 1.8 V
  • Power-down and sleep modes
  • 2 embedded programmable state machines
  • 3 independent acceleration channels and 3 angular rate channels
  • ±2/±4/±6/±8/±16 g selectable full scale
  • ±250/±500/±2000 dps selectable full scale
  • SPI/I2 C serial interface
  • Embedded temperature sensor
  • Embedded FIFO
  • ECOPACK® RoHS and “Green” compliant

Design

Technical Documentation

Product Specifications
Description Version Size
DS9160 DS9160: iNEMO inertial module: 3D accelerometer and 3D gyroscope 3.0 1 MB
Technical Notes & Articles
Description Version Size
TN0018 TN0018: Surface mounting guidelines for MEMS sensors in an LGA package 5.0 218 KB
Design Notes & Tips
Description Version Size
DT0060 DT0060: Exploiting the gyroscope to update tilt measure and e-compass 1.0 226 KB
DT0047 DT0047: How to install and run the osxMotionAR Activity Recognition library 1.1 273 KB
DT0064 DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0 616 KB

Tools and Software

Embedded Software
Evaluation Tools
MEMS and Sensors Software
Product Evaluation Tools

Sample & Buy

Part Number Package Packing Type Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
LSM330TR TFLGA 3.5X3X1 24L Tape And Reel Active 2.228 1000 NEC EAR99 - MORE INFO DISTRIBUTOR AVAILABILITY
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
LSM330TR ActiveTFLGA 3.5X3X1 24LIndustrialEcopack2 0 0
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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