iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM6DSL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DSL supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DSL has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DSL the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DSL is available in a plastic land grid array (LGA) package.

Key Features

  • Power consumption: 0.4 mA in combo normal mode and 0.65 mA in combo high-performance mode
  • “Always-on” experience with low power consumption for both accelerometer and gyroscope
  • Smart FIFO up to 4 kbyte based on features set
  • Compliant with Android K, L, and M
  • Hard, soft ironing for external magnetic sensor corrections
  • ±2/±4/±8/±16 g full scale
  • ±125/±245/±500/±1000/±2000 dps full scale
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IOs supply (1.62 V)
  • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
  • SPI & I2 C serial interface with main processor data synchronization feature
  • Pedometer, step detector and step counter
  • Significant motion and tilt function
  • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
  • Embedded temperature sensor
  • ECOPACK® , RoHS and “Green” compliant

Design

Technical Documentation

Product Specifications
Description Version Size
DS11325 DS11325: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope 4.0 1 MB
Technical Notes & Articles
Description Version Size
TN0018 TN0018: Surface mounting guidelines for MEMS sensors in an LGA package 5.0 218 KB
Design Notes & Tips
Description Version Size
DT0047 DT0047: How to install and run the osxMotionAR Activity Recognition library 1.1 273 KB
DT0064 DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0 616 KB

Publications and Collaterals

Brochures
Description Version Size
MEMS and Sensors, Smart solutions for IoT and enhanced user experience 1 MB
Support & Community



Sample & Buy

Part Number Package Packing Type Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
LSM6DSLTR VFLGA 2.5X3X0.86 14L Tape And Reel Active - 1000 NEC EAR99 - MORE INFO DISTRIBUTOR AVAILABILITY
LSM6DSL VFLGA 2.5X3X0.86 14L Tray Preview - 1000 NEC EAR99 - MORE INFO
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
LSM6DSLTR ActiveVFLGA 2.5X3X0.86 14LIndustrialEcopack2 (**) 0 0
LSM6DSL PreviewVFLGA 2.5X3X0.86 14LIndustrialEcopack2 0 0
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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