Mainstream Mixed signals MCUs ARM Cortex-M4 core with DSP and FPU, 512 Kbytes Flash, 72 MHz CPU, MPU, 12-bit ADC 5 MSPS, PGA, comparators

The STM32F302xD/E family is based on the high-performance ARM®Cortex®-M4 32-bit RISC core with FPU operating at a frequency of 72 MHz, and embedding a floating point unit (FPU), a memory protection unit (MPU) and an embedded trace macrocell (ETM). The family incorporates high-speed embedded memories (512-Kbyte Flash memory, 64-Kbyte SRAM), a flexible memory controller (FSMC) for static memories (SRAM, PSRAM, NOR and NAND), and an extensive range of enhanced I/Os and peripherals connected to an AHB and two APB buses.

The devices offer two fast 12-bit ADCs (5 Msps), four comparators, two operational amplifiers, one DAC channel, a low-power RTC, up to two general-purpose 16-bit timers, one general-purpose 32-bit timer, and one timer dedicated to motor control. They also feature standard and advanced communication interfaces: up to three I2Cs, up to four SPIs (two SPIs are with multiplexed full-duplex I2Ss), three USARTs, up to two UARTs, CAN and USB. To achieve audio class accuracy, the I2S peripherals can be clocked via an external PLL.

The STM32F302xD/E family operates in the -40 to +85°C and -40 to +105°C temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

The STM32F302xD/E family offers devices in different packages ranging from 64 to 144 pins.

Depending on the device chosen, different sets of peripherals are included.

Key Features

  • Core: ARM® Cortex® -M4 32-bit CPU with 72 MHz FPU, single-cycle multiplication and HW division, DSP instruction and MPU (memory protection unit)
  • Operating conditions:
    • VDD , VDDA voltage range: 2.0 V to 3.6 V
  • Memories
    • Up to 512 Kbytes of Flash memory
    • 64 Kbytes of SRAM, with HW parity check implemented on the first 32 Kbytes.
    • Flexible memory controller (FSMC) for static memories, with four Chip Select
  • CRC calculation unit
  • Reset and supply management
    • Power-on/Power-down reset (POR/PDR)
    • Programmable voltage detector (PVD)
    • Low-power modes: Sleep, Stop and Standby
    • VBAT supply for RTC and backup registers
  • Clock management
    • 4 to 32 MHz crystal oscillator
    • 32 kHz oscillator for RTC with calibration
    • Internal 8 MHz RC with x 16 PLL option
    • Internal 40 kHz oscillator
  • Up to 115 fast I/Os
    • All mappable on external interrupt vectors
    • Several 5 V-tolerant
  • Interconnect matrix
  • 12-channel DMA controller
  • Two ADCs 0.20 μs (up to 18 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 V conversion range, separate analog supply from 2.0 to 3.6 V
  • One 12-bit DAC channels with analog supply from 2.4 to 3.6 V
  • Four ultra-fast rail-to-rail analog comparators with analog supply from 2.0 to 3.6 V
  • Two operational amplifiers that can be used in PGA mode, all terminals accessible with analog supply from 2.4 to 3.6 V
  • Up to 24 capacitive sensing channels supporting touchkey, linear and rotary touch sensors
  • Up to 11 timers:
    • One 32-bit timer and two 16-bit timers with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
    • One 16-bit 6-channel advanced-control timers, with up to six PWM channels, deadtime generation and emergency stop
    • One 16-bit timer with two IC/OCs, one OCN/PWM, deadtime generation and emergency stop
    • Two 16-bit timers with IC/OC/OCN/PWM, deadtime generation and emergency stop
    • Two watchdog timers (independent, window)
    • One SysTick timer: 24-bit downcounter
    • One 16-bit basic timers to drive the DAC
  • Calendar RTC with Alarm, periodic wakeup from Stop/Standby
  • Communication interfaces
    • CAN interface (2.0B Active)
    • Three I2 C Fast mode plus (1 Mbit/s) with 20 mA current sink, SMBus/PMBus, wakeup from STOP
    • Up to five USART/UARTs (ISO 7816 interface, LIN, IrDA, modem control)
    • Up to four SPIs, 4 to 16 programmable bit frames, two with multiplexed half/full duplex I2 S interface
    • USB 2.0 full-speed interface with LPM support
    • Infrared transmitter
  • SWD, Cortex® -M4 with FPU ETM, JTAG
  • 96-bit unique ID

Design

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Product Certifications
Description Version Size
STM32 CAN conformance test authentication sheet 1.0 182 KB

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Get ready for the largest IoT development ecosystem 17.02 741 KB
STM32 GUI solutions - Advanced HMI now achievable on embedded systems 1.0 1 MB
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STM32 for makers Releasing your creativity 16.09 1 MB
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HW Model & CAD Libraries
Description Version Size
STM32F3 Boundary Scan Description Language (BSDL) files 1.0 132 KB
STM32F3 CAD Symbol and Footprint files 1.0 1 MB

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Presentations
Description Version Size
STM32 Embedded Software overview 2.3.0 777 KB
STM32 PMSM FOC SDK Getting Started 1.6 5 MB
STM32 and STM8 Functional Safety Packages 2 1 MB
STM32 and STM8 embedded software solutions 2.0 2 MB

Technical Documentation

Product Specifications
Description Version Size
DS10592 DS10592: ARM® Cortex®-M4 32b MCU+FPU, up to 512KB Flash, 64KB SRAM, FSMC, 2 ADCs, 1 DAC ch., 4 comp, 2 Op-Amp, 2.0-3.6 V 4.0 2 MB
Technical Notes & Articles
Description Version Size
TN1163 TN1163: Description of WLCSP for microcontrollers and recommendations for its use 4.0 1 MB
TN0830 TN0830: How to use EWARM 6.2x with projects built with EWARM 6.1 and previous versions 1.2 97 KB
TN1204 TN1204: Tape and reel shipping media for STM32 microcontrollers in BGA packages 2.1 745 KB
TN1205 TN1205: Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages 3.0 753 KB
TN1206 TN1206: Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages 3.0 830 KB
TN1207 TN1207: Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages 1.0 755 KB
TN1208 TN1208: Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages 1.0 743 KB
Reference Manuals
Description Version Size
RM0365 RM0365: STM32F302xB/C/D/E and STM32F302x6/8 advanced ARM®-based 32-bit MCUs 7.0 11 MB
Programming Manuals
Description Version Size
PM0214 PM0214: STM32F3, STM32F4 and STM32L4 Series Cortex®-M4 programming manual 5.0 3 MB
Errata Sheets
Description Version Size
ES0284 ES0284: STM32F302xD and STM32F302xE Rev Y device limitations 4.0 347 KB

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Sample & Buy

Part Number Package Packing Type Operating Temperature (°C) (min) Operating Temperature (°C) (max) Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
STM32F302VDT6 LQFP 100 14x14x1.4 Tray -40 85 Active 3.217 10000 NEC 3A991A2 PHILIPPINES MORE INFO DISTRIBUTOR AVAILABILITY
STM32F302VDT6TR LQFP 100 14x14x1.4 Tape And Reel -40 85 Active 3.217 10000 NEC 3A991A2 PHILIPPINES MORE INFO
STM32F302VDH6 UFBGA 100 7x7x0.6 Tray -40 85 Active 3.217 10000 NEC 3A991A2 PHILIPPINES MORE INFO
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32F302VDT6 ActiveLQFP 100 14x14x1.4IndustrialEcopack2 0 0
STM32F302VDT6TR ActiveLQFP 100 14x14x1.4IndustrialEcopack2 0 0
STM32F302VDH6 ActiveUFBGA 100 7x7x0.6IndustrialEcopack2
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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