High-performance access line, ARM Cortex-M4 core with DSP and FPU, 1,5 MByte Flash, 100 MHz CPU, ART Accelerator, DFSDM, AES

The STM32F423xH devices are based on the high-performance ARM® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F423xH devices belong to the STM32F423xH access product lines (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.

The STM32F423xH devices incorporate high-speed embedded memories (1.5 Mbytes of Flash memory, 320 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer a 12-bit ADC, two 12-bit DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timer for motor control, two general-purpose 32-bit timers and a low power timer.

They also feature standard and advanced communication interfaces.

Key Features

  • Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode)
    • 1.7 V to 3.6 V power supply
    • -40 °C to 85/105/125 °C temperature range
  • Core: ARM® 32-bit Cortex® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • 1.5 Mbytes of Flash memory
    • 320 Kbytes of SRAM
    • Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
    • Dual mode Quad-SPI interface
  • LCD parallel interface, 8080/6800 modes
  • Clock, reset and supply management
    • 1.7 to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 112 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C
    • Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C
    • Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C
    • VBAT supply for RTC: 1 μA @25 °C
  • 2x12-bit D/A converters
  • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
  • 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support
  • General-purpose DMA: 16-stream DMA
  • Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer
  • Debug mode
    • Serial wire debug (SWD) & JTAG
    • Cortex® -M4 Embedded Trace Macrocell™
  • Up to 114 I/O ports with interrupt capability
    • Up to 109 fast I/Os up to 100 MHz
    • Up to 114 five V-tolerant I/Os
  • Up to 24 communication interfaces
    • Up to 4x I2 C interfaces (SMBus/PMBus)
    • Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
    • Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces
    • SDIO interface (SD/MMC/eMMC)
    • Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY
    • 3x CAN (2.0B Active)
    • 1xSAI
  • True random number generator
  • CRC calculation unit
  • 96-bit unique ID
  • RTC: subsecond accuracy, hardware calendar
  • 128/256-bit hardware encryption accelerator (AES)
  • All packages are ECOPACK® 2

Circuit Diagram

bd_stm32f423xh_1-5mb.jpg

Design

Quality & Reliability

Product Certifications
Description Version Size
STM32 CAN conformance test authentication sheet 1.0 182 KB

Publications and Collaterals

Flyers
Description Version Size
Get ready for the largest IoT development ecosystem 17.02 741 KB
STM32 GUI solutions - Advanced HMI now achievable on embedded systems 1.0 1 MB
STM32 Nucleo boards 18.0 1 MB
STM32 for makers Releasing your creativity 16.09 1 MB
STM32F401/10/11/12/13 - High-performance Access lines 17.04 1 MB
Brochures
Description Version Size
STM32™ 32-bit MCU family - Leading supplier of ARM® Cortex®-M microcontrollers 18.0 1 MB

HW Model & CAD Libraries

HW Model & CAD Libraries
Description Version Size
STM32F4 CAD Symbol and Footprint files 1.0 2 MB
STM32F413/423 Boundary Scan Decription Language (BSDL) files 1.0 39 KB
STM32F413/423 IBIS models 1.1 14 MB

Presentations & Training Material

Presentations
Description Version Size
STM32 - 32-bit ARM Cortex-M MCUs 3.0 1 MB
STM32 Embedded Software overview 2.3.0 777 KB
STM32 and STM8 Functional Safety Packages 2 1 MB
STM32 and STM8 embedded software solutions 2.0 2 MB

Technical Documentation

Product Specifications
Description Version Size
DS11580 DS11580: ARM®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs, AES 5.0 3 MB
Technical Notes & Articles
Description Version Size
TN1163 TN1163: Description of WLCSP for microcontrollers and recommendations for its use 4.0 1 MB
TN0830 TN0830: How to use EWARM 6.2x with projects built with EWARM 6.1 and previous versions 1.2 97 KB
TN0516 TN0516: Overview of the STM32F0x/F100xx/F103xx and STM32F2xx/F30x/F4xx MCUs PMSM single/dual FOC SDK V4.0 4.1 284 KB
TN1204 TN1204: Tape and reel shipping media for STM32 microcontrollers in BGA packages 2.1 745 KB
TN1205 TN1205: Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages 3.0 753 KB
TN1206 TN1206: Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages 3.0 830 KB
TN1207 TN1207: Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages 1.0 755 KB
TN1208 TN1208: Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages 1.0 743 KB
Reference Manuals
Description Version Size
RM0430 RM0430: STM32F413/423 advanced ARM® - based 32-bit MCUs 4.0 14 MB
Programming Manuals
Description Version Size
PM0214 PM0214: STM32F3, STM32F4 and STM32L4 Series Cortex®-M4 programming manual 5.0 3 MB
Errata Sheets
Description Version Size
ES0372 ES0372: STM32F413xG/xH and STM32F423xH device limitations 2.0 369 KB

Tools and Software

Development Tools
Embedded Software
Evaluation Tools
Hardware Development Tools
Software Development Tools
MCUs Embedded Software
Product Evaluation Tools
Support & Community


Sample & Buy

Part Number Package Packing Type Operating Temperature (°C) (min) Operating Temperature (°C) (max) Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
STM32F423ZHJ6 UFBGA 10X10 144L P 0.8 MM Tray -40 85 Active 6.879 10000 5A002A1A 5A002A1A PHILIPPINES MORE INFO
STM32F423ZHT6 LQFP 144 20x20x1.4 Tray -40 85 Active 6.81 10000 5A002A1A 5A002A1A PHILIPPINES MORE INFO
STM32F423ZHT3 LQFP 144 20x20x1.4 Tray -40 125 Active 7.831 10000 5A002A1A 5A002A1A PHILIPPINES MORE INFO
STM32F423ZHJ3 UFBGA 10X10 144L P 0.8 MM - -40 125 Proposal - - - - - MORE INFO
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32F423ZHJ6 ActiveUFBGA 10X10 144L P 0.8 MMIndustrialEcopack2
STM32F423ZHT6 ActiveLQFP 144 20x20x1.4IndustrialEcopack2
STM32F423ZHT3 ActiveLQFP 144 20x20x1.4IndustrialEcopack2
STM32F423ZHJ3 ProposalUFBGA 10X10 144L P 0.8 MMIndustrial -
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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