Analog and DSP with FPU ARM Cortex-M4 MCU with 256 Kbytes Flash, 72 MHz CPU, MPU, CCM, 12-bit ADC 5 MSPS, PGA, comparators

The STM32F303xB/STM32F303xC family is based on the high-performance ARM®Cortex®-M4 32-bit RISC core with FPU operating at a frequency of up to 72 MHz, and embedding a floating point unit (FPU), a memory protection unit (MPU) and an embedded trace macrocell (ETM). The family incorporates high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 40 Kbytes of SRAM) and an extensive range of enhanced I/Os and peripherals connected to two APB buses.

The devices offer up to four fast 12-bit ADCs (5 Msps), seven comparators, four operational amplifiers, up to two DAC channels, a low-power RTC, up to five general-purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor control. They also feature standard and advanced communication interfaces: up to two I2Cs, up to three SPIs (two SPIs are with multiplexed full-duplex I2Ss), three USARTs, up to two UARTs, CAN and USB. To achieve audio class accuracy, the I2S peripherals can be clocked via an external PLL.

The STM32F303xB/STM32F303xC family operates in the -40 to +85 °C and -40 to +105 °C temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

The STM32F303xB/STM32F303xC family offers devices in three packages ranging from 48 pins to 100 pins.

The set of included peripherals changes with the device chosen.

Key Features

  • Core: ARM® Cortex® -M4 32-bit CPU with FPU (72 MHz max), single-cycle multiplication and HW division, 90 DMIPS (from CCM), DSP instruction and MPU (memory protection unit)
  • Operating conditions:
    • VDD , VDDA voltage range: 2.0 V to 3.6 V
  • Memories
    • 128 to 256 Kbytes of Flash memory
    • Up to 40 Kbytes of SRAM, with HW parity check implemented on the first 16 Kbytes.
    • Routine booster: 8 Kbytes of SRAM on instruction and data bus, with HW parity check (CCM)
  • CRC calculation unit
  • Reset and supply management
    • Power-on/Power-down reset (POR/PDR)
    • Programmable voltage detector (PVD)
    • Low-power modes: Sleep, Stop and Standby
    • VBAT supply for RTC and backup registers
  • Clock management
    • 4 to 32 MHz crystal oscillator
    • 32 kHz oscillator for RTC with calibration
    • Internal 8 MHz RC with x 16 PLL option
    • Internal 40 kHz oscillator
  • Up to 87 fast I/Os
    • All mappable on external interrupt vectors
    • Several 5 V-tolerant
  • Interconnect matrix
  • 12-channel DMA controller
  • Four ADCs 0.20 μS (up to 39 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 V conversion range, single ended/differential input, separate analog supply from 2 to 3.6 V
  • Two 12-bit DAC channels with analog supply from 2.4 to 3.6 V
  • Seven fast rail-to-rail analog comparators with analog supply from 2 to 3.6 V
  • Four operational amplifiers that can be used in PGA mode, all terminals accessible with analog supply from 2.4 to 3.6 V
  • Up to 24 capacitive sensing channels supporting touchkey, linear and rotary touch sensors
  • Up to 13 timers
    • One 32-bit timer and two 16-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
    • Two 16-bit 6-channel advanced-control timers, with up to 6 PWM channels, deadtime generation and emergency stop
    • One 16-bit timer with 2 IC/OCs, 1 OCN/PWM, deadtime generation and emergency stop
    • Two 16-bit timers with IC/OC/OCN/PWM, deadtime generation and emergency stop
    • Two watchdog timers (independent, window)
    • SysTick timer: 24-bit downcounter
    • Two 16-bit basic timers to drive the DAC
  • Calendar RTC with Alarm, periodic wakeup from Stop/Standby
  • Communication interfaces
    • CAN interface (2.0B Active)
    • Two I2 C Fast mode plus (1 Mbit/s) with 20 mA current sink, SMBus/PMBus, wakeup from STOP
    • Up to five USART/UARTs (ISO 7816 interface, LIN, IrDA, modem control)
    • Up to three SPIs, two with multiplexed half/full duplex I2S interface, 4 to 16 programmable bit frames
    • USB 2.0 full speed interface
    • Infrared transmitter
  • Serial wire debug, Cortex® -M4 with FPU ETM, JTAG
  • 96-bit unique ID

回路ダイアグラム

bd_stm32f303xc_256k

デザイン

技術文書

製品スペック
Description バージョン サイズ
DS9118 DS9118: ARM®-based Cortex®-M4 32b MCU+FPU, up to 256KB Flash+ 48KB SRAM, 4 ADCs, 2 DAC ch., 7 comp, 4 PGA, timers, 2.0-3.6 V 13.0 2 MB
アプリケーションノート
Description バージョン サイズ
AN3126 AN3126: Audio and waveform generation using the DAC in STM32 microcontrollers 2.0 829 KB
AN4775 AN4775: Basics and low-cost solution proposals to move from legacy USB2.0 connector to USB Type-C™ connector with STM32 devices 1.0 443 KB
AN1709 AN1709: EMC design guide for ST microcontrollers 2.0 843 KB
AN3960 AN3960: ESD considerations for touch sensing applications on MCUs 2.0 353 KB
AN1181 AN1181: Electrostatic discharge sensitivity measurement 1.6 49 KB
AN4566 AN4566: Extending the DAC performance of STM32 microcontrollers 2.0 365 KB
AN4776 AN4776: General-purpose timer cookbook 1.0 1 MB
AN4206 AN4206: Getting started with STM32F3 series hardware development 4.0 763 KB
AN4232 AN4232: Getting started with analog comparators for STM32F3 series 2.0 452 KB
AN4312 AN4312: Guidelines for designing touch sensing applications with surface sensors 1.1 972 KB
AN4299 AN4299: Guidelines to improve conducted noise robustness on STM32F0/F3, STM32L0/L4 series touch sensing applications 3.0 613 KB
AN3236 AN3236: Guidelines to increase the number of touch sensing touchkeys 4.0 300 KB
AN4750 AN4750: Handling of soft errors in STM32 applications 2.1 410 KB
AN4803 AN4803: High-speed SI simulations using IBIS and board-level simulations using HyperLynx SI on STM32 32-bit ARM® Cortex® MCUs 1.1 2 MB
AN2834 AN2834: How to get the best ADC accuracy in STM32Fx Series and STM32L1 Series devices 2.1 845 KB
AN4229 AN4229: How to implement a vocoder solution using STM32 microcontrollers 1.0 466 KB
AN4221 AN4221: I2C protocol used in the STM32 bootloader 3.0 683 KB
AN4099 AN4099: Implementation of transmitters and receivers for infrared remote control protocols with MCUs of the STM32F0 and STM32F3 Series 3.0 750 KB
AN4838 AN4838: Managing memory protection unit (MPU) in STM32 MCUs 1.0 284 KB
AN4807 AN4807: Migrating between STM32F303 and STM32F302 line products 1.0 1 MB
AN4228 AN4228: Migrating from STM32F1 to STM32F3 microcontrollers 5.0 835 KB
AN4832 AN4832: Migrating from STM32F303 line to STM32L4 Series microcontrollers 1.0 754 KB
AN2867 AN2867: Oscillator design guide for STM8S, STM8A and STM32 microcontrollers 10.0 2 MB
AN4296 AN4296: Overview and tips for using STM32F303/328/334/358xx CCM RAM with IAR EWARM, Keil MDK-ARM and GNU-based toolchains 3.0 1 MB
AN4538 AN4538: Power consumption optimization with STM32F3xx microcontrollers 1.0 807 KB
AN4013 AN4013: STM32 cross-series timer overview 5.0 553 KB
AN2606 AN2606: STM32 microcontroller system memory boot mode 27.0 3 MB
AN4734 AN4734: STM32Cube firmware examples for STM32F3 Series 5.0 514 KB
AN4045 AN4045: STM32F3 series in-application programming (IAP) using the USART 2.0 386 KB
AN4651 AN4651: STM32F3 series peripheral interconnect matrix 1.0 379 KB
AN4195 AN4195: STM32F30x ADC modes and application 1.1 725 KB
AN4310 AN4310: Sampling capacitor selection guide for MCU based touch sensing applications 3.0 208 KB
AN4316 AN4316: Tuning a STMTouch-based application 3.0 783 KB
AN4076 AN4076: Two or three shunt resistor based current sensing circuit design in 3-phase inverters 1.6 1 MB
AN3155 AN3155: USART protocol used in the STM32 bootloader 6.1 1 MB
AN3156 AN3156: USB DFU protocol used in the STM32 bootloader 4.0 394 KB
AN4277 AN4277: Using STM32 device PWM shut-down features for motor control and digital power conversion 4.0 834 KB
AN3371 AN3371: Using the hardware real-time clock (RTC) in STM32 F0, F2, F3, F4 and L1 series of MCUs 5.1 421 KB
AN4655 AN4655: Virtually increasing the number of serial communication peripherals in STM32 applications 1.1 338 KB
Technical Notes & Articles
Description バージョン サイズ
TN1163 TN1163: Description of WLCSP for microcontrollers and recommendations for its use 3.0 1 MB
TN0830 TN0830: How to use EWARM 6.2x with projects built with EWARM 6.1 and previous versions 1.2 97 KB
TN0516 TN0516: Overview of the STM32F0x/F100xx/F103xx and STM32F2xx/F30x/F4xx MCUs PMSM single/dual FOC SDK V4.0 4.0 285 KB
TN1204 TN1204: Tape and reel shipping media for STM32 microcontrollers in BGA packages 2.1 745 KB
TN1205 TN1205: Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages 3.0 753 KB
TN1206 TN1206: Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages 3.0 830 KB
TN1207 TN1207: Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages 1.0 755 KB
TN1208 TN1208: Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages 1.0 743 KB
リファレンスマニュアル
Description バージョン サイズ
RM0316 RM0316: STM32F303xB/C/D/E, STM32F303x6/8, STM32F328x8, STM32F358xC, STM32F398xE advanced ARM®-based MCUs 7.0 12 MB
プログラミングマニュアル
Description バージョン サイズ
PM0214 PM0214: STM32F3, STM32F4 and STM32L4 Series Cortex®-M4 programming manual 5.0 3 MB
Errata Sheets
Description バージョン サイズ
ES0204 ES0204: STM32F303xB/C Rev Z and Y device limitations 9.0 426 KB

HW Model & CAD Libraries

HW Model & CAD Libraries
Description バージョン サイズ
STM32F3 Boundary Scan Description Language (BSDL) files 1.0 132 KB

プレゼンテーション & トレーニング資料

プレゼンテーション
Description バージョン サイズ
STM32 Embedded Software overview 2.3.0 777 KB
STM32 PMSM FOC SDK 4.2 Hands-on workshop with hardware tools 1.5 5 MB
STM32 and STM8 Functional Safety Packages 2.0 1 MB
STM32 and STM8 embedded software solutions 2.0 2 MB
STM32ファミリ開発環境のご紹介 1.0 2 MB

Publications and Collaterals

フライヤー
Description バージョン サイズ
STM32 Nucleo boards 16.02 871 KB
STM32 for makers Releasing your creativity 15.10 333 KB
パンフレット
Description バージョン サイズ
STM32 32-bit MCU family - Leading supplier of ARM® Cortex®-M microcontrollers 16.02 1 MB
STM32F3 series - Mainstream 32-bit MCUs 15.11 1 MB

品質 & 信頼性

Product Certifications
Description バージョン サイズ
STM32 CAN conformance test authentication sheet 1.0 182 KB

ツール & ソフトウェア

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ソフトウェア製品
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Software Development Tools
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サンプル & 購入

製品型番 パッケージ Packing Type Operating Temperature (°C) (min) Operating Temperature (°C) (max) Marketing Status Unit Price (US$) * 数量 ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
STM32F303VCT6 LQFP 100 14x14x1.4 Tray -40 85 Active 3.171 10000 NEC 3A991A2 PHILIPPINES MORE INFO DISTRIBUTOR AVAILABILITY
STM32F303VCT6TR LQFP 100 14x14x1.4 Tape And Reel -40 85 Active 3.171 10000 NEC 3A991A2 PHILIPPINES MORE INFO DISTRIBUTOR AVAILABILITY
STM32F303VCY6TR WLCSP 100L P 0.4 MM DIE 422 Tape And Reel -40 85 Active 3.171 10000 NEC 3A991A2 SINGAPORE MORE INFO
STM32F303VCT7 LQFP 100 14x14x1.4 Tray -40 105 Active 3.393 10000 NEC 3A991A2 PHILIPPINES MORE INFO DISTRIBUTOR AVAILABILITY
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

品質 & 信頼性

製品型番 Marketing Status パッケージ Grade RoHS Compliance Grade Material Declaration**
STM32F303VCT6 アクティブLQFP 100 14x14x1.4IndustrialEcopack2 0 0
STM32F303VCT6TR アクティブLQFP 100 14x14x1.4IndustrialEcopack2 0 0
STM32F303VCY6TR アクティブWLCSP 100L P 0.4 MM DIE 422IndustrialEcopack2 0 0
STM32F303VCT7 アクティブLQFP 100 14x14x1.4IndustrialEcopack2 0 0
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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