Common mode filter with ESD protection for high speed serial interface

The ECMF02-2BF3 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI, USB 2.0 and HDMI.

The ECMF02-2BF3 can protect and filter one differential lane.

Key Features

  • Very large differential bandwidth above 5 GHz
  • High common mode attenuation:
    • - 23 dB at 900 MHz.
  • High common mode attenuation:
    • - 20 dB between 800 MHz and 2.2 GHz.
  • Very low PCB space consumption: <1.1mm2
  • Thin package: 0.50 mm max. after reflow
  • Lead-free package
  • High reduction of parasitic elements through integration
  • Complies with the following standard:
    • IEC 61000-4-2 level 4 input and output pins:
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)



Description Version Size
DS7161 DS7161: Dual line IPAD™, common mode filter with ESD protection for high speed serial interface 2.0 426 KB
DB1549 DB1549: Dual line IPAD™, common mode filter with ESD protection for high speed serial interface 1.0 43 KB
Description Version Size
AN4356 AN4356: Antenna desense on handheld equipment 1.2 1 MB
AN4511 AN4511: Common mode filters 2.0 969 KB
AN3353 AN3353: IEC 61000-4-2 standard testing 1.2 171 KB
AN4540 AN4540: MHL link filtering and protection 1.1 2 MB
Technical Notes & Articles
Description Version Size
TN1173 TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches 5.0 1 MB

HW Model, CAD Libraries & SVD

HW Model, CAD Libraries & SVD
Description Version Size
ECMF02-2BF3 S-parameter model (.sxp) 1.0 353 KB


Description Version Size
ECMF™series portfolio overview : common-mode filters embedding ESD protection 1.0 875 KB
USB 2.0 protection and IPAD™ solutions presentation 2.0 707 KB
USB type-C Power Delivery advanced protection fundamentals 1.0 396 KB
USB type-C™ advanced protection solutions quick start guide 2.0 1 MB
USB type-C™ datalines and 'alternate mode' advanced protection fundamentals 1.0 657 KB


Description Version Size
Semiconductor solutions for healthcare applications 1.0 665 KB
Description Version Size
EMI/EMC and Co-existence simulation methodology for high performance digital, mixed signal and RF wireless products 1.0 1 MB


型号 Marketing Status Quantity Unit Price (US$) * Package Packing Type Operating Temperature (°C) (min) Operating Temperature (°C) (max) ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
ECMF02-2BF3 Active 100 0.127 Chip Scale Package 0.4mm pitch Tape And Reel - - NEC EAR99 CHINA MORE INFO 获取样片 Add to cart DISTRIBUTOR AVAILABILITY

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors


型号 Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
ECMF02-2BF3 ActiveChip Scale Package 0.4mm pitchIndustrialEcopack2 0 0

(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.