MEMS digital output motion sensor: ultra low-power high performance 3-axes nano accelerometer

The LIS3DSH is an ultra-low-power high-performance three-axis linear accelerometer belonging to the “nano” family with an embedded state machine that can be programmed to implement autonomous applications.

The LIS3DSH has dynamically selectable full scales of ±2g/±4g/±6g/±8g/±16g and is capable of measuring accelerations with output data rates from 3.125 Hz to 1.6 kHz.

The self-test capability allows the user to check the functioning of the sensor in the final application.

The device can be configured to generate interrupt signals activated by user-defined motion patterns.

The LIS3DSH has an integrated first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor.

The LIS3DSH is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

Key Features

  • Wide supply voltage, 1.71 V to 3.6 V
  • Independent IOs supply (1.8 V) and supply voltage compatible
  • Ultra-low power consumption
  • ±2g/±4g/±6g/±8g/±16g dynamically selectable full scale
  • I2 C/SPI digital output interface
  • 16-bit data output
  • Programmable embedded state machines
  • Embedded temperature sensor
  • Embedded self-test
  • Embedded FIFO
  • 10000 g high shock survivability
  • ECOPACK® , RoHS and “Green” compliant



Description Version Size
DS8721 DS8721: MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer 2.0 1 MB
Description Version Size
AN2328 AN2328: HID device coding example 1.1 54 KB
AN4156 AN4156: Hardware abstraction layer for Android 1.0 369 KB
AN3393 AN3393: LIS3DSH: 3-axis digital output accelerometer 4.0 2 MB
AN4508 AN4508: Parameters and calibration of a low-g 3-axis accelerometer 1.0 303 KB
AN4509 AN4509: Tilt measurement using a low-g 3-axis accelerometer 1.0 250 KB
Technical Notes & Articles
Description Version Size
TN0018 TN0018: Surface mounting guidelines for MEMS sensors in an LGA package 5.0 218 KB
Design Notes & Tips
Description Version Size
DT0053 DT0053: 6-point tumble sensor calibration 1.0 464 KB
DT0011 DT0011: Benefits in using FIFO buffer embedded in ST MEMS sensors 1.0 618 KB


Description Version Size
3-axis digital accelerometers for smarter, easier-to-use and energy-efficient portable devices 2.0 891 KB
Description Version Size
MEMS and Sensors, Smart solutions for IoT and enhanced user experience 1 MB
Peripheral semiconductors for set-top box applications 4.3 633 KB


MEMS and Sensors Software
Product Evaluation Tools


型号 Package Packing Type Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
LIS3DSHTR LLGA 16 3x3x1.0 Tape And Reel Active 0.832 1000 NEC EAR99 - MORE INFO 获取样片 Add to cart DISTRIBUTOR AVAILABILITY

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors


型号 Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
LIS3DSHTR ActiveLLGA 16 3x3x1.0IndustrialEcopack2 0 0

(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.