MoCA v.2 chip set - power amplifier / low-noise amplifier

The STiC2BB and STiC2PA companion chips connect ST back-end devices to the home MoCA network as defined by the MoCA standard specification v2.0. The chip set is fully backward compatible with MoCA v1.1 standard (ST device STVMOCA).

STiC2BB is interfaced via RGMII to ST back-end devices such as STiD128 or STiH410.

The chip set comes with a complete firmware and software suite included in a product design kit.

Key Features

  • Baseband/RF IC
    • MoCA v2.0 device with backwards compatibility to MoCA v1.x
    • Wide frequency range covering all MoCA 2 bands
    • Turbo mode capable
    • Reduced Gigabit MII (RGMII)
    • I2 C bus control
    • 3.3-V, 2.5-V and 1.2-V supplies
    • VQFPN 13 x 13 mm2 dual row packagewith exposed pad down
    • Temperature range 0 to 70 °C
    • Channel 3/4 A/V modulator
    • I2 S digital audio input
    • Digital video input (DVI)
    • Channel 3/4 RF output
  • Power/low-noise amplifiers IC
    • Supports the MoCA v1.x and v2.0 standards
    • Frequency range 400 to 1675 MHz
    • Common input/output of LNA and PA
    • High speed LNA/PA gain control interface
    • Low external component count
    • Single 3.3-V DC supply
    • Low power consumption
    • VFQFPN-24 4x4x1mm3 with exposed pad down (EPD) for heat dissipation
    • Temperature range 0 to 70 °C


Technical Documentation

Product Specifications
Description Version Size
DB1962 DB1962: MoCA® v2.0 chip set 2.0 50 KB