2 G / 5 G WLAN diplexer

This diplexer targets the use of dual band 2.4 GHz and 5 GHz. The DIP2450-01D3 is a diplexer dedicated to the WLAN/BT application.

It is designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance.

Key Features

  • Low insertion loss in pass band
  • High attenuation levels
  • High rejection of out-of-band frequencies
  • Small footprint: < 1.4 mm2
  • Benefits
    • Very low profile (<600 μm after reflow)
    • High Q, low loss
    • High RF performance
    • Tight tolerance
    • Bill of materials and area reduction

Design

Publications and Collaterals

Brochures
Description Version Size
Semiconductor solutions for healthcare applications 1.0 665 KB

Technical Documentation

Product Specifications
Description Version Size
DS9039 DS9039: 2 G / 5 G WLAN diplexer 2.0 268 KB
Technical Notes & Articles
Description Version Size
TN1173 TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches 5.0 1 MB
Support & Community


Sample & Buy

Part Number Package Packing Type Minimum Sellable Quantity Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
DIP2450-01D3 Chip Scale Package 0.4mm pitch Tape And Reel 5000 NRND 0.1235 1000 NEC EAR99 - MORE INFO DISTRIBUTOR AVAILABILITY
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
DIP2450-01D3 NRNDChip Scale Package 0.4mm pitchIndustrialEcopack2 0 0
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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