iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM6DS3US is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3US supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.

The LSM6DS3US gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3US has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3US the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3US is available in a plastic land grid array (LGA) package.

Key Features

  • Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
  • “Always-on” experience with low power consumption for both accelerometer and gyroscope
  • Interface flexibility: selectable SPI (3/4-wire) or I2 C with the main processor
  • Auxiliary SPI (3-wire) to support OIS applications
  • EIS/OIS support
  • Accelerometer ODR up to 6.66 kHz
  • Gyroscope ODR up to 3.33 kHz
  • Smart FIFO
  • ±2/±4/±8/±16 g full scale
  • ±125/±250/±500/±1000/±2000 dps full scale
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IOs supply (1.62 V)
  • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
  • SPI/I2 C serial interface data synchronization feature
  • Embedded temperature sensor
  • ECOPACK® , RoHS and “Green” compliant

Resources

Technical Documentation

Product Specifications
Description Version Size
DS11326 DS11326: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope 5.0 1 MB
Application Notes
Description Version Size
AN4889 AN4889: LSM6DS3US: always-on 3D accelerometer and 3D gyroscope 2.0 2 MB
Technical Notes & Articles
Description Version Size
TN0018 TN0018: Surface mounting guidelines for MEMS sensors in an LGA package 6.0 214 KB
Design Notes & Tips
Description Version Size
DT0047 DT0047: How to install and run the osxMotionAR Activity Recognition library 1.2 275 KB
DT0064 DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0 616 KB

Publications and Collaterals

Flyers
Description Version Size
ISM330DLC iNEMO® 6-axis inertial module for Industry 4.0 1.0 741 KB
Brochures
Description Version Size
MEMS and Sensors, Smart solutions for IoT and enhanced user experience 1 MB
Support & Community


Sample & Buy

Part Number Package Packing Type Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
LSM6DS3USTR VFLGA 2.5X3X0.86 14L Tape And Reel Active - 1000 NEC EAR99 - MORE INFO DISTRIBUTOR AVAILABILITY
LSM6DS3US VFLGA 2.5X3X0.86 14L Tray Preview - - NEC EAR99 - MORE INFO No availability reported, please contact our Sales office
test

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
LSM6DS3USTR ActiveVFLGA 2.5X3X0.86 14LIndustrialEcopack2 0 0
LSM6DS3US PreviewVFLGA 2.5X3X0.86 14LIndustrialEcopack2 0 0
test

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

×