ST's ultra-small silicon pressure sensors use innovative MEMS technology to provide extremely high pressure resolution, in ultra-compact and thin packages. The devices are designed using ST’s VENSENS technology, allowing the fabrication of pressure sensor on a monolithic silicon chip, eliminating wafer-to-wafer bonding and maximizing reliability.

Key technical features of ST’s pressure sensor family include enhanced temperature compensation that allows apps to perform consistently in changing environments, an absolute pressure range from 260 to 1260 hPa that covers all possible user altitudes (from the deepest mines to the top of Mount Everest), low power consumption less than 4μA, and pressure noise lower than 1Pa RMS.

ST’s pressure sensors are increasingly being used in smartphones, tablets and wearable technology such as sports watches, smart watches, and fitness bands, enabling accurate floor detection and enhanced location-based services, allowing more accurate dead-reckoning calculations, and opening the door to new smartphone apps such as weather analyzers, health and sports monitors.

High performances in the first 2x2mm absolute pressure sensor in the market

With a package of 2x2x0.75 mm, the  LPS22HB is not only the world’s smallest pressure sensor, but also the only one offered in a full-molded package that provides the best thermal and mechanical robustness (high shock survivability > 20,000 g) while boosting the performance and offering the best trade-off between current consumption (down to 3uA) and noise (0.0075 hPa RMS). 

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