STMicroelectronics at a Glance
 
A world leader in providing the semiconductor solutions that help our customers improve quality of life for everyone, both today and in the future

     Among the world’s largest semiconductor companies
     A leading Integrated Device Manufacturer serving all electronics segments
     A leading technology innovator ( around 12,000 researchers, ~21,500 patents)
     Key strengths in Multimedia Convergence, Power Applications and Sensors
     Rich, balanced portfolio (ASICs, Application-Specific Standard Products and
   Multi-Segment Products)
     A pioneer and visionary leader in sustainability

Bullet President and CEO: Carlo Bozotti
Bullet 2011 revenue: $9.73 billion
Bullet Approximately 50,000 employees including ST-Ericsson (December 31, 2011)
Bullet Advanced research and development centers in 10 countries
Bullet 12 main manufacturing sites
Bullet Corporate Headquarters: Geneva, Switzerland
Bullet Global presence with sales offices all around the world
Bullet Public since 1994 - shares traded on New York Stock Exchange (NYSE: STM), Euronext Paris, and Borsa Italiana
Bullet Created as SGS-THOMSON Microelectronics in June 1987, from merger of SGS Microelettronica (Italy) and Thomson Semiconducteurs (France)
Bullet Renamed STMicroelectronics in May 1998

  
ST is Everywhere
 
Our semiconductor products and technologies add benefits to every aspect of daily life

ST Everywhere

Company Organization by Business Segments
 
ST focuses on the industry's fastest growing sectors

Company Organization by Business Segment

 

Client Base
 
Our World-Class Client Base includes market leaders across the world and in all our targeted markets
 
Top 10 OEM Customers (2011)
Apple, Bosch, Cisco, Continental, HP, Nokia,
Research in Motion, Samsung, Seagate, Sony/Sony Ericsson
(listed alphabetically)

  

Manufacturing Strength
 
To provide its customers with an independent, secure and cost-effective manufacturing machine, ST operates a worldwide network of front-end (wafer fabrication) and back-end (assembly and test and packaging) plants and also has relationships with leading-edge foundries
 

Manufacturing

An Unwavering Commitment to R&D
 
From state-of-the-art process development to advanced assembly and packaging technologies, from new system architectures to advanced product design. In the whole of 2011, ST spent about 24% of its revenue on R&D, including the R&D activities related to ST-Ericsson,
as consolidated by ST.

 

Leading-edge technologies   

  • Advanced CMOS, mixed-signal, analog, power and MEMS silicon technologies
  • A partner in the International Semiconductor Development Alliance (ISDA) for the development of next-generation CMOS technologies
  • Value-added variations of industry-standard CMOS technology
  • 3D integration and packaging
  • Advanced system architectures and design platforms


    Wafer

Further information on the Company can be found in the Company Presentation and Company Profile.

Updated January 2012