32-bit Power Architecture MCU for Automotive Chassis and Safety Applications

The SPC56XL70 series microcontrollers are system-on-chip devices that are built on Power Architecture technology and contain enhancements that improve the architecture’s fit in embedded applications, include additional instruction support for digital signal processing (DSP) and integrate technologies such as an enhanced time processor unit, enhanced queued analog-to-digital converter, Controller Area Network, and an enhanced modular input-output system.

The SPC56XL70 family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding range of automotive-focused products designed to address electrical hydraulic power steering (EHPS), electric power steering (EPS) and airbag applications. The advanced and cost-efficient host processor core of the SPC56XL70 automotive controller family complies with the Power Architecture embedded category. It operates at speeds as high as 120 MHz and offers high-performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users’ implementations.

Key Features

  • High-performance e200z4d dual core
    • 32-bit Power Architecture® technology CPU
    • Core frequency as high as 120 MHz
    • Dual issue five-stage pipeline core
    • Variable Length Encoding (VLE)
    • Memory Management Unit (MMU)
    • 4 KB instruction cache with error detection code
    • Signal Processing Engine (SPE)
  • Memory available
    • 2 MB flash memory with ECC
    • 192 KB on-chip SRAM with ECC
    • Built-in RWW capabilities for EEPROM emulation
  • SIL3/ASILD innovative safety concept: Lock step mode and Fail-safe protection
    • Sphere of Replication (SoR) for key components (such as CPU core, eDMA, crossbar switch)
    • Fault Collection and Control Unit (FCCU)
    • Redundancy Control and Checker Unit (RCCU) on outputs of the SoR connected to FCCU
    • Boot-time Built-In Self-Test for Memory (MBIST) and Logic (LBIST) triggered by hardware
    • Boot-time Built-In Self-Test for ADC and flash memory triggered by software
    • Replicated safety enhanced watchdog
    • Replicated junction temperature sensor
    • Non Maskable Interrupt (NMI)
    • 16-region Memory Protection Unit (MPU)
    • Clock Monitoring Units (CMU)
    • Power Management Unit (PMU)
    • Cyclic Redundancy Check (CRC) unit
  • Decoupled Parallel mode for high performance use of replicated cores
  • Nexus Class 3+ interface
  • Interrupts
    • Replicated 16-priority controller
    • Replicated 16-channel eDMA controller
  • GPIOs individually programmable as input, output or special function
  • Three 6-channel general-purpose eTimer units
  • 2 FlexPWM units: Four 16-bit channels per module
  • Communications interfaces
    • 2 LINFlexD channels
    • 3 DSPI channels with automatic chip select generation
    • 3 FlexCAN interfaces (2.0B Active) with 32 message objects
    • FlexRay module (V2.1 Rev. A) with 2 channels, 64 message buffers and data rates up to 10 Mbit/s
  • Two 12-bit Analog-to-digital Converters (ADC)
    • 16 input channels
    • Programmable Cross Triggering Unit (CTU) to synchronize ADCs conversion with timer and PWM
  • Sine wave generator (D/A with low pass filter)
  • On-chip CAN/UART/FlexRay Bootstrap loader
  • Single 3.0 V to 3.6 V voltage supply
  • Ambient temperature range –40 °C to 125 °C
  • Junction temperature range –40 °C to 150 °C

リソース

技術文書

製品スペック
Description バージョン サイズ
32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications 5.0 2 MB
アプリケーションノート
Description バージョン サイズ
Hardware design guideline power supply and voltage measurement 3.0 1 MB
RPC56xx and SPC56xx C90FL Flash recovery in case of brownout during Flash erase operation 2.0 165 KB
SPC564Lx device startup flow 2.1 1 MB
SPC56EL60xx/RPC56EL60xx/SPC56xL70xx/RPC56xL70xx device exception handling 2.0 244 KB
Safety application guide for SPC56xL70xx/RPC56xL70xx family 3.0 1 MB
Technical Notes & Articles
Description バージョン サイズ
Safety application guide for SPC56xL70xx/RPC56xL70xx family reference manual addendum 3.0 130 KB
ユーザマニュアル
Description バージョン サイズ
SPC5xx Flasher 1.0 207 KB
Standard software driver for C90FL2 Flash 2.2 1 MB
Variable-Length Encoding (VLE) extension -programming interface manual 1.3 421 KB
uFlasher 1.0 1 MB
uTester 1.0 2 MB
リファレンスマニュアル
Description バージョン サイズ
Programmer's reference manual for Book E processors 2.0 24 MB
SPC56XL70xx 32-bit MCU family built on the embedded Power Architecture® 3.0 20 MB
Errata Sheets
Description バージョン サイズ
SPC56EL70xx,SPC564L70xx devices errata JTAG_ID = 0X0AEA_9041 5.0 272 KB

プレゼンテーション & トレーニング資料

プレゼンテーション
Description バージョン サイズ
SPC5 32-bit microcontroller Series featuring Power Architecture 2 MB
SPC5 Family Overview October 2015 2 MB

Publications and Collaterals

パンフレット
Description バージョン サイズ
All you need to drive SPC56 32-bit power architecture MCUs 1.0 2 MB
Driving Electromobility 1.0 1 MB
Driving innovation 2.1 348 KB

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サンプル & 購入

製品型番 Marketing Status Packing Type CPU Clock Frequency (MHz) (max) FLASH Size (kB) (Data) Features set Operating Temperature (°C) (min) Operating Temperature (°C) (max) Unit Price (US$) * 数量 ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
SPC564L70L5BBOSR Active Tape And Reel 120 - - -40 105 - - NEC 3A991A2 MALTA MORE INFO No availability reported, please contact our Sales office
SPC564L70L5BBOSY Active Tray 120 - - -40 105 - - NEC 3A991A2 MALTA MORE INFO No availability reported, please contact our Sales office
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

品質 & 信頼性

製品型番 Marketing Status パッケージ Grade RoHS Compliance Grade Material Declaration**
SPC564L70L5BBOSR アクティブLQFP 144 20x20x1.4自動車Ecopack2
SPC564L70L5BBOSY アクティブLQFP 144 20x20x1.4自動車Ecopack2
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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