32-bit Power Architecture MCU for Automotive Applications

This family of MCUs targets automotive powertrain controller applications for four-cylinder gasoline and diesel engines, chassis control applications, transmission control applications, steering and braking applications, as well as low-end hybrid applications.

Many of the applications are considered to be functionally safe and the family is designed to achieve ISO26262 ASIL-D compliance.

Key Features

  • Two main 32-bit Power Architecture® VLE compliant CPU core (e200z4), dual issue, running in lockstep
    • Single-precision floating point operations
    • 16 KB local instruction SRAM and 64 KB local data SRAM
    • 4 KB I-Cache and 2 KB D-Cache
  • One 32-bit Power Architecture® VLE compliant I/O processor core (e200z2)
    • Single-precision floating point operations
    • Lightweight Signal Processing Auxiliary Processing Unit (LSP APU) instruction support for digital signal processing (DSP)
    • 16 KB local instruction SRAM and 48 KB local data SRAM
  • 2624 KB on-chip flash memory
    • Supporting EEPROM emulation (64 KB)
  • 64 KB on-chip general-purpose SRAM (+112 KB data RAM included in the CPUs)
  • Multi-channel direct memory access controller (eDMA) with 32 channels
  • Dual interrupt controller (INTC)
  • Dual phase-locked loops, including one Frequency-modulated
  • System integration unit lite (SIUL)
  • Boot Assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
  • Generic timer module (GTM122)
    • Intelligent complex timer module
    • 88 channels (24 input and 64 output)
    • 3 programmable fine grain multi-threaded cores
    • 26 KB of dedicated SRAM
    • Hardware support for engine control, motor control and safety related applications
  • Enhanced analog-to-digital converter system with:
    • 1 supervisor 12-bit SAR analog converter
    • 4 separate fast 12-bit SAR analog converters
    • 2 separate 16-bit Sigma-Delta analog converters
  • 5 Deserial Serial Peripheral Interface (DSPI) modules
  • 5 LIN and UART communication interface (LINFlexD) modules
  • 3 MCAN interfaces with advanced shared memory scheme, two supporting ISO CAN-FD and one supporting TTCAN
  • One Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
  • Dual-channel FlexRay controller
  • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with partial support for 2010 standard
  • Device and board test support per Joint Test Action Group (JTAG) (IEEE 1149.1)
  • Single 5 V +/-10% Power supply supporting cold start conditions (down to 3.0 V)
  • Designed for eTQFP144 and eLQFP176



Description バージョン サイズ
DS9223 DS9223: 32-bit Power Architecture® based MCU for automotive applications 6.0 4 MB
Description バージョン サイズ
AN4684 AN4684: How to split self-test (Key-On & Key-Off) 1.0 1 MB
AN4557 AN4557: Introduction to the usage of TDM peripheral SPC57xx devices 1.0 717 KB
AN4623 AN4623: Memory monitoring using JDC module 1.0 2 MB
AN4389 AN4389: SPC574K72/SPC57EM80 Getting Started 2.0 773 KB
AN4446 AN4446: SPC574K72xx safety manual 1.0 2 MB
AN4413 AN4413: SPC57xx ADC device 1.0 1 MB
AN4353 AN4353: SPC57xx/SPC58xx: Debug over CAN 3.0 966 KB
AN4898 AN4898: Self–test performances 2.0 441 KB
AN4688 AN4688: Sensorless BLDC Motor Control using SPC574K72xx 1.0 498 KB
AN4344 AN4344: Software routine for safe usage the interrupt controller SPC57EM80x/SPC574K72x according to ISO26262 2.0 448 KB
Technical Notes & Articles
Description バージョン サイズ
TN1233 TN1233: SENT demo driver for the SPC57xx/SPC58xx microcontroller families 2.0 407 KB
TN1234 TN1234: TDM: SW Tamper Region override 1.0 400 KB
Description バージョン サイズ
UM1618 UM1618: Standard software driver for C55 Flash 4.0 764 KB
UM0438 UM0438: Variable-Length Encoding (VLE) extension -programming interface manual 1.3 421 KB
UM1886 UM1886: uTester 1.0 2 MB
Description バージョン サイズ
RM0361 RM0361: Generic Timer Module specification revision 1.0 10 MB
RM0004 RM0004: Programmer's reference manual for Book E processors 2.0 24 MB
Errata Sheets
Description バージョン サイズ
ES0273 ES0273: SPC574K70x, SPC574K72x device errata JTAG_ID = 0x0AF07041 2.0 2 MB
ES0329 ES0329: SPC574K70x, SPC574K72x device errata JTAG_ID = 0x3AF07041 1.0 2 MB
ES0210 ES0210: SPC574K72E5, SPC574K72E7 device errata JTAG_ID = 0x0AF06041 3.0 2 MB
ES0408 ES0408: SPC574K72x devices errata JTAG_ID=0x4AF0_7041 2.0 328 KB

プレゼンテーション & トレーニング資料

Description バージョン サイズ
SPC5 32-bit microcontroller Series featuring Power Architecture 2 MB
SPC5 Family Overview October 2015 2 MB

Publications and Collaterals

Description バージョン サイズ
Driving Electromobility 1.0 1 MB

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サンプル & 購入

製品型番 Marketing Status Packing Type CPU Clock Frequency (MHz) (max) FLASH Size (kB) (Data) Features set Operating Temperature (°C) (min) Operating Temperature (°C) (max) Unit Price (US$) * 数量 ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
SPC574K72E7C6FAR Active Tape And Reel 160 64 ASILD/SIL3,Flexray -40 125 - - NEC 3A991A2 - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C60AR Proposal Tape And Reel 160 64 - -40 125 - - - - - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C68AR Proposal Tape And Reel 160 64 - -40 125 - - - - - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C6FAY Active Tray 160 64 ASILD/SIL3,Flexray -40 125 - - NEC 3A991A2 - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C61AR Proposal Tape And Reel 160 64 ASILD/SIL3 -40 125 - - - - - MORE INFO No availability reported, please contact our Sales office

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

品質 & 信頼性

製品型番 Marketing Status パッケージ Grade RoHS Compliance Grade Material Declaration**
SPC574K72E7C6FAR アクティブLQFP 176 24x24x1.4自動車Ecopack2 0 0
SPC574K72E7C60AR Proposal - IndustrialEcopack2
SPC574K72E7C68AR Proposal - IndustrialEcopack2
SPC574K72E7C6FAY アクティブLQFP 176 24x24x1.4自動車Ecopack2 0 0
SPC574K72E7C61AR ProposalLQFP 176 24x24x1.4IndustrialEcopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.