Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function.

ST's latest baluns - the less than 3 mm² footprint BALF-112X-01D3 and the less than 3.7 mm² BALF-112X-02D3 - are customized for TI CC1120, CC1125, CC1175 and CC1200 transceivers, reducing RF complexity and providing optimized link budget.

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