Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function.

Our wide range of integrated baluns includes companion-chips to ST’s latest transceivers, such as:

Both these – as well as other baluns designed for various transceivers from other manufacturers – significantly help reduce RF complexity and provide an optimized link budget.