ST’s IPD process is able to integrate high-quality passive elements (resistors, inductors, capacitors) on glass sand high resistivity silicon substrates and in various design configurations. Available IPs are baluns, RF couplers, combiners, filters, diplexers, triplexers, and impedance matching. Today’s standard product offering includes baluns, RF couplers, filters and diplexers.
The IPD technology is able to cover all RF applications with a frequency range from 168 MHz and above, such as Sub-Giga, WLAN, Bluetooth, ZigBee, WiMax, UWB, UMTS, LTE and more. The key benefits of this technology are a competitive cost structure, a small form factor, and reduced power losses.
ST’s IPD products are compatible with different assembly modes including CSP, microbumping and wirebonding, to be mounted either on the main PWB or inside a complete RF module.