Automotive 8-bit ultra-low-power MCU with 32 Kbytes Flash, LIN, RTC, LCD, data EEPROM, timers, USARTs, I2C, SPIs, ADC, DAC, COMPs

The medium-density STM8AL313x/4x/6x and STM8AL3L4x/6x devices are members of the STM8AL automotive ultra-low-power 8-bit family. The medium-density STM8AL3xxx family operates from 1.8 V to 3.6 V (down to 1.65 V at power down) and is available in the -40 to +85°C and -40 to +125°C temperature ranges.

The medium-density STM8AL3xxx ultra-low-power family features the enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture for low power operations.

The family includes an integrated debug module with a hardware interface (SWIM) which allows non-intrusive In-Application debugging and ultrafast Flash programming.

All medium-density STM8AL3xxx microcontrollers feature embedded data EEPROM and low power low-voltage single-supply program Flash memory.

They incorporate an extensive range of enhanced I/Os and peripherals.

The modular design of the peripheral set allows the same peripherals to be found in different ST microcontroller families including 32-bit families. This makes any transition to a different family very easy, and simplified even more by the use of a common set of development tools.

Two different packages are proposed which include 32 and 48 pins. Depending on the device chosen, different sets of peripherals are included.

All STM8AL3xxx ultra-low-power products are based on the same architecture with the same memory mapping and a coherent pinout

Key Features

  • AEC-Q100 qualified
  • Operating conditions
    • Operating power supply range 1.8 V to 3.6 V (down to 1.65 V at power down)
    • Temperature range: - 40 °C to 85 or 125 °C
  • Low power features
    • Five low-power modes: Wait, low-power run (5.1 μA), low-power wait (3 μA), active-halt with full RTC (1.3 μA), halt with PDR (400 nA)
    • Run from Flash: 195 μA/MHz + 440 μA
    • Run from RAM: 90 μA/MHz + 400 μA
    • Ultra-low leakage per I/0: 50 nA
    • Fast wakeup from Halt: 4.7 μs
  • Advanced STM8 core
    • Harvard architecture and 3-stage pipeline
    • Max freq. 16 MHz, 16 CISC MIPS peak
    • Up to 40 external interrupt sources
  • Reset and supply management
    • Low power, ultra safe BOR reset with 5 selectable thresholds
    • Ultra-low power POR/PDR
    • Programmable voltage detector (PVD)
  • Clock management
    • 1 to 16 MHz crystal oscillator
    • 32 kHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • Internal 38 kHz low consumption RC
    • Clock security system
  • Low power RTC
    • BCD calendar with alarm interrupt
    • Auto-wakeup from Halt (0.95 ppm resolution) w/ periodic interrupt
  • LCD: up to 4x28 segments w/ step-up converter
  • Memories
    • Program memory: up to 32 Kbyte Flash program; data retention 20 years at 55 °C
    • Data memory: up to 1 Kbyte true data EEPROM; endurance 300 kcycle
    • RAM: up to 2 Kbyte
  • DMA
    • Four channels; supported peripherals: ADC, DAC, SPI, I2C, USART, timers
    • One channel for memory-to-memory
  • 12-bit DAC with output buffer
  • 12-bit ADC up to 1 Mbps/25 channels
    • Temp sensor and internal reference voltage
  • Two ultra-low-power comparators
    • One with fixed threshold and one rail to rail
    • Wakeup capability
  • Timers
    • Two 16-bit timers with two channels (used as IC, OC, PWM), quadrature encoder
    • One 16-bit advanced control timer with three channels, supporting motor control
    • One 8-bit timer with 7-bit prescaler
    • Two watchdogs: one window, one independent
    • Beeper timer with 1-, 2- or 4 kHz frequencies
  • Communication interfaces
    • Synchronous serial interface (SPI)
    • Fast I2C 400 kHz SMBus and PMBus
    • USART (ISO 7816 interface, IrDA, LIN 1.3, LIN 2.0)
  • Up to 41 I/Os, all mappable on interrupt vectors
  • Development support
    • Fast on-chip programming and non intrusive debugging with SWIM
    • Bootloader using USART
  • 96-bit unique ID




Description バージョン サイズ
DS7106 DS7106: Automotive 8-bit ultra-low-power MCU, up to 32 Kbyte Flash, RTC, data EEPROM, LCD, timers, USART, I2C, SPI, ADC, DAC, COMPs 8.0 2 MB
Description バージョン サイズ
AN3137 AN3137: Analog-to-digital converter on STM8L and STM8AL devices: description and precision improvement techniques 3.1 691 KB
AN1709 AN1709: EMC design guide for ST microcontrollers 2.0 843 KB
AN2860 AN2860: EMC guidelines for STM8 microcontrollers 5.1 262 KB
AN3960 AN3960: ESD considerations for touch sensing applications on MCUs 2.0 353 KB
AN1181 AN1181: Electrostatic discharge sensitivity measurement 1.6 49 KB
AN3029 AN3029: Getting started with STM8L and STM8AL 5.1 1 MB
AN4312 AN4312: Guidelines for designing touch sensing applications with surface sensors 3.0 1 MB
AN3236 AN3236: Guidelines to increase the number of touch sensing touchkeys 4.0 300 KB
AN3114 AN3114: How to use the STM8AL3Lxx, STM8L152xx and STM8L162xx LCD controllers 3.1 711 KB
AN4101 AN4101: LIN communication with STM8A-DISCOVERY 1.1 182 KB
AN2867 AN2867: Oscillator design guide for STM8AF/AL/S and STM32 microcontrollers 11.0 2 MB
AN3147 AN3147: Power management in STM8L and STM8AL 3.1 370 KB
AN3101 AN3101: STM8L05xxx/15xxx, STM8L162xx and STM8AL31xx/3Lxx internal RC oscillator calibration 6.0 429 KB
AN4310 AN4310: Sampling capacitor selection guide for MCU based touch sensing applications 3.0 208 KB
AN4316 AN4316: Tuning a STMTouch-based application 3.0 783 KB
AN3117 AN3117: Using the STM8L05xxx/15xxx, STM8L162xx, STM8AL31xx/3Lxx DMA controller 4.1 415 KB
AN3133 AN3133: Using the STM8L05xxx/STM8L101xx/STM8L15xxx/STM8L162xx/STM8AL31xx/STM8AL3Lxx real-time clock 5.2 600 KB
Technical Notes & Articles
Description バージョン サイズ
TN1163 TN1163: Description of WLCSP for microcontrollers and recommendations for its use 4.0 1 MB
TN0189 TN0189: STM8 bootloader frequently asked questions 2.4 320 KB
TN1205 TN1205: Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages 3.0 753 KB
TN1206 TN1206: Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages 3.0 830 KB
TN1207 TN1207: Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages 1.0 755 KB
TN1208 TN1208: Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages 1.0 743 KB
Description バージョン サイズ
RM0031 RM0031: STM8L 15xおよび STM8L 16x マイクロコントローラファミリ 14.0 7 MB
Description バージョン サイズ
PM0054 PM0054: How to program STM8L and STM8AL Flash program memory and data EEPROM 9.1 240 KB
PM0051 PM0051: How to program STM8S and STM8A Flash program memory and data EEPROM 3.4 191 KB
PM0044 PM0044: STM8 CPU programming manual 3.4 899 KB
Errata Sheets
Description バージョン サイズ
ES019 ES019: STM8AL31xx, STM8AL3Lxx, STM8L052C6, STM8L151xx4/6 and STM8L152xx4/6 device limitations 15.0 402 KB

HW Model, CAD Libraries & SVD

HW Model, CAD Libraries & SVD
Description バージョン サイズ
STM8AL CAD Symbol and Footprint files 1.0 1 MB

プレゼンテーション & トレーニング資料

Description バージョン サイズ
STM32 and STM8 Functional Safety Packages 2 1 MB
STM32 and STM8 embedded software solutions 4.0 3 MB

Publications and Collaterals

Description バージョン サイズ
Get ready for the largest IoT development ecosystem 17.02 653 KB
STM8CubeMX eases STM8 configuration 17.03 319 KB
Description バージョン サイズ
STM8 8-bit MCU family 17.03 899 KB

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サンプル & 購入

製品型番 パッケージ Packing Type Operating Temperature (°C) (min) Operating Temperature (°C) (max) Marketing Status Unit Price (US$) * 数量 ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
STM8AL3L66TAY LQFP 32 7x7x1.4 Tray -40 85 Active 1.133 10000 NEC EAR99 MALAYSIA MORE INFO No availability reported, please contact our Sales office

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

品質 & 信頼性

製品型番 Marketing Status パッケージ Grade RoHS Compliance Grade Material Declaration**
STM8AL3L66TCY アクティブLQFP 32 7x7x1.4自動車Ecopack2
STM8AL3L66TAY アクティブLQFP 32 7x7x1.4自動車Ecopack2 0 0

(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.