ST Life.augmented
sense_power

压力传感器

意法半导体的超小型硅压力传感器采用超小型薄型封装,利用创新型MEMS技术实现了分辨率极高的压力和高度测量。 该器件采用意法半导体’的VENSENS技术设计而成,让压力传感器能够利用单片式硅芯片构造而成,因此消除了晶圆-晶圆键合,并且还将可靠性提至了最高水平。 与传统的硅微机加工膜相比,膜非常小,并且能够通过内置式机械塞保护其免遭破坏。

测定高度时,噪声对系统精度有很大影响。 意法半导体已将传感器的噪声降至最低水平。 这样就能够检测出几厘米的高度差异。

意法半导体’的压力传感器旨在加强用于户内与户外导航的GPS以便精确测量高度,或者充当智能手机、平板电脑、运动手表、气象站和汽车与工业应用领域内的气压计。

Ultra-thin pressure sensor, dust-free and water resistant

The LPS25HB is offered in a fully molded package that provides the best thermal and mechanical robustness (high shock survivability > 10,000 g) while boosting performance and offering best trade-off between current consumption and noise. The device is built using ST’s new MEMS technology that allows the use of fully molded HLGA (Holed Land Grid Array) packages. Measuring just 2.5x2.5 mm and reaching thinness below 0.8mm, this revolutionary technology eliminates the need for a metallic or plastic cap.
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