ST Life.augmented

H3LIS331DL

MEMS motion sensor: low power high g 3-axis digital accelerometer
  • active Active

The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.

The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.

The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.

The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

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Errata Sheet
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Datasheet

Key Features

  • Wide supply voltage, 2.16 V to 3.6 V
  • Low-voltage compatible IOs, 1.8 V
  • Ultra-low power consumption down to 10 μA in low-power mode
  • ±100g/±200g/±400g dynamically selectable full scales
  • I2C/SPI digital output interface
  • 16-bit data output
  • Sleep-to-wakeup function
  • 10000 g high-shock survivability
  • ECOPACK®, RoHS and “Green” compliant

Design Resources

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Technical Documentation

Product Specifications

Description Version Size
pdf
DS9012: MEMS motion sensor: low-power high-g 3-axis digital accelerometer
3.0 805 KB

Application Notes

Description Version Size
pdf
AN2328: HID device coding example
1.1 54 KB
pdf
AN4156: Hardware abstraction layer for Android
1.0 370 KB

Technical Notes & Articles

Description Version Size
pdf
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Related Tools and Software

Related Tools and Software

Part Number Description
iNEMOEngine_PAAP PAAP engine PRO - Android Platform
iNEMOEngine_PI3P PI3P engine PRO - platform independent
iNEMOEngine_PW8 PW8 engine PRO - supports Win8 sensors

Publications and Collaterals

Brochure

Description Version Size
pdf
MEMS motion sensors
3,928 KB

Magazine

Description Version Size
pdf
AUTO - International Journal of THE FIA, March 2013: Size matters. ST’s high-g accelerometer revolutionizes crash safety in Formula One racing
378 KB

White Paper

Description Version Size
pdf
Mechanical characterization and simulation of fracture processes in polysilicon MEMS
1.0 9,933 KB
pdf
Physical Sensors Drive MEMS Consumerization Waves
1.0 886 KB

Sample & Buy

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Part Number Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
H3LIS331DLActiveLLGA 16 3x3x1.0Tray_-Distributor reported inventory date: 2014-10-20
Distributor NameRegionStockMin. order
ANGLIA LiveOrder NowEUROPE2949490
ARROWOrder NowEUROPE3920
Farnell Element14Order NowEUROPE4061
Ecopack2PDF
XML
H3LIS331DLTRActiveLLGA 16 3x3x1.0Tape And Reel_-Distributor reported inventory date: 2014-10-20
Distributor NameRegionStockMin. order
ARROWOrder NowAMERICA233424000
MOUSEROrder NowWORLDWIDE10511
Ecopack2PDF
XML

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
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