Ion implantation is extensively 
used in VLSI circuitry with line 
dimensions that are often mea-
sured in fractions of a micron. 
The use of ion implantation 
allows for greater precision and 
greater flexibility in the manu-
facturing process.

Development teams at ST’s 
manufacturing plants keep the 
Company at the forefront of chip 
packaging technology. Recent 
successes include the develop-
ment of Pb-free Ball Grid Array 
and micro-BGA packages as part 
of ST’s commitment to achieve 
total environmental neutrality.

The electrical wafer sort equip-
ment shown here can test 2,400 
chips every hour, ensuring that 
high manufacturing throughput is 
achieved without compromising 
quality.

ST continues to invest in its 
powerful manufacturing machine 
and plans are already under way 
for the state-of-the-art, 12-inch 
wafer fab in Crolles, near 
Grenoble in France.