Replacing the traditional alu-
minum interconnect technology 
with one based on copper brings 
higher speed and lower power 
consumption for digital applica-
tions and specific RF devices. 
Yield is up significantly, high-
lighting the capabilities of 
copper interconnect.

Image transfer on silicon is made 
with light provided by an excimer 
laser working in deep UV range. 
The 0.18 micron generation uses 
step and scan techniques with a 
248 nm light wavelength, and the 
0.12 micron generation based on 
193 nm light wavelength will pave 
the way for further generations.