ST at a glance

ST has two kinds of manufacturing sites: Front-end and Back-end

The Front-end sites produce transistors and integrated circuits on silicon ‘wafers’ through a series of complex processes that enable the silicon to control and elaborate electronic signals. The thin slices of silicon range from 5 to 12 inches in diameter, with more advanced technology being required to produce the larger diameters.

Back-end sites perform assembly, packaging and testing functions. The individual silicon ‘die’ or rectangles are cut from the wafers and the die are then sealed with wire connections into the ‘package’ or box that connects the chips to an electronic device. The chips are then tested to ensure quality and proper performance.