Failure mode
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Generally this refers to device failure detected at the customer, in the field application or during qualification,such as: open, short, leakage, functional and parametric failure, write/erase, data retention, etc.
In the knowledge matrix, this refers to the element failure under consideration: gate short, metal open, bond-off. |
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Failure mechanism
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Physical failure causing the element failure mode that can induce a failure mode at the customer, in the field application or during qualification; the relevant acceleration model is generally identified.
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Intrinsic failure
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Structural failure linked to product/process design parameter and material characteristics.
It can be characterized by a small sample of test devices stressed to failure.
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Extrinsic failure |
These are random in nature and a large sample size is needed to characterize the critical part of the distribution, mainly dominated by manufacturing performance (process spread, accidents, defects).
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Mission profile |
A mission profile is a representation of the conditions (thermal, electrical, mechanical, etc.) to which a production device/product is exposed in its application throughout its full life cycle. Life cycle is defined as the time period between the completion of the manufacturing process of the semiconductor component and the end of life of the vehicle. The mission profile includes transport, storage, processing and operations in the intended application. Each of the above profile items can occur more than once. |
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Life cycle |
| Service lifetime
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The total lifetime of the car. |
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The total number of miles/kilometres that the car is assumed to cover during its service life. |
Engine on-time |
The amount of time that the engine and component is switched on (key-on time) and operational during the service lifetime. |
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The amount of time that the engine is switched off while several applications are running (such as the radio on)
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The amount of time remaining by subtracting engine-on and engine-off time from the total service lifetime. |
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