JEDEC - IPC Standards for Soldering Temperature
Resistance
JEDEC standards can be downloaded from Jedec web site : www.jedec.org
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JEDEC IPC J-STD020B published in July 2002
Include 4 soldering profiles:
- Large packages for Tin-lead soldering : with Peak temperature of
225°C (same as in previous J-STD020A publication)
- Small packages for Tin-lead soldering : with Peak temperature of
240°C (same as in previous J-STD020A publication)
- Large packages for Lead-free soldering : with Peak temperature of
245°C .
- Small packages for Lead-free soldering : with Peak temperature
of 250°C .
- Small packages are defined with Body volume of 350mm3 maximum Body
volume is excluding connections
JEDEC J-STD020C : published in July 2004
Encloses 260°C peak temperature profile for small and for thin
packages, and includes new classification of packages by body volume
and body thickness.
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