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EMI Filtering & Signal Conditioning
Micro QFN Packages
The introduction of multimedia services in 3G phones is driving the increase in resolution of graphics displays and cameras. These higher resolutions require high frequency data transmission that generates EMI interference and cross talk. Thus, high-frequency interfaces are susceptible to RFI interference.
Moreover, the highly-integrated and compact environment also brings space constraints which is an additional key issue that must be taken into consideration when designers develop mobile devices.
To solve these challenges, STMicroelectronics provides an advanced family of 4, 6 and 8 line low capacitance integrated passive and active devices. They offer higher integration and are housed in tiny micro QFN packages for ultra low space consumption.
 
Base Band IPAD Families
Base Band IPAD
 
Features and benefits
EMI asymmetrical (I/O) low-pass filter
4, 6 and 8 line protection
Integrated pull-up
High-efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
High-efficiency in EMI filtering
Very low PCB space consumption: from 1.7 mm x 1.5 mm to 3.3 mm x 1.5 mm
Very thin package: 0.6 mm max.
High reliability offered by monolithic integration
Greatly reduced parasitic elements through integration and wafer level packaging
 
High attenuation EMIF0x-1005xx series
4, 6 and 8 line EMI filtering and ESD protection
High attenuation level: > 35 dB from 1 GHz to 2 GHz
Low line capacitance: 45 pF (typ. @ 0 V)
Space and cost saving with high integration
Very low PCB space consuming: from 2.5 mm² min. to 5 mm² max.
 
EMIF0x-1005xx series typical application
Low capacitance EMIF0x-1502xx series
4, 6 and 8 line EMI filtering and ESD protection
Very low line capacitance 14 pF (typ. @ 2.5 V): compatible with up to 52 MHz clock frequency
High attenuation level: > 30 dB from 1 GHz to 1.8 GHz
Space and cost saving with high integration
Very low PCB space consuming: from 2.5 mm² min. to 5 mm² max.
 
EMIF0x-1502xx series typical application
 

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