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STP90NS04ZC & STP70NS04ZC
New fully clamped SAFeFETTM Power MOSFETs
for automotive applications

STP90NS04ZC Product Page
STP70NS04ZC Product Page

Based on the well proven Mesh Overlay Strip process, the latest versions of fully clamped SAFeFET devices show exceptionally high performance in terms of ESD ruggedness and electrical behavior. This result is due to the continuous improvements made to the technology and processes. For this new SAFeFET series, two separate pads have been used: one for the gate (Gp) and one for the zener diode termination (Gz). The use of these two electrically isolated pads during wafer testing allows the gate oxide integrity (Igss) of the Power MOSFET to be checked without the presence of the G-S zener diode. When the devices are assembled, they have only one gate pin.



Features

Electrical layout of the clamped devices

Electrical layout of the clamped devices

High current switching
175°C operating temperature
Fully protected device
Standard VGS(th) values
100% Avalanche tested
8kV ESD proof at HBM
Automotive graded device
Improved RDS(on) x area
Clamped voltage extremely stable over the whole
temperature range

Applications

A.B.S. solenoid drivers
Linear mode operation proof
Motor control

 

Assembly layout showing the two separate gates
Assembly layout showing the two separate gates

Applications


Thanks to the built-in gate-to-source and gate-to-drain zener diodes, the devices can withstand repetitive inductive switching currents, avoiding operation in breakdown mode. Since the devices are under no stress their reliability and the entire lifecycle of the whole application is improved. The exceptional stability of the BVDSS vs. temperature ensures a very stable behavior of the zener diodes over the whole temperature range.

Part number
BVDSS
Clamped
[V]
RDS(on)@
10V
[mOhm]
RTHjc
[°C/W]
Package
STP90NS04ZC
33
6.0
0.53
TO-220
STP70NS04ZC
62
11.0
0.83


Automotive Qualification

Both the STP90NS04ZC, as well as the STP70NS04ZC respect the stringent criteria for automotive grade qualification.

Compliance with AEC guidelines Q101
Compliance with AEC Q003 for product characterization
Compliance with AEC Q001 guideline for Statistical Yield Analysis (SYA) and AEC Q002 for Part Average Test (PAT) at wafer level (EWS)
Production Parts Approval Process (PPAP) document according to the AEC Q101