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LDMOS in PowerFLAT
New Leadless SMD RF Power Transistors
PD5xxxxL Series
PD5xxxxL Product Selector

Although the new PowerFLAT packages are thinner and lighter than the standard SO-8, they can house substantially bigger die. This in turn translates into a remarkable board space reduction. The leads are accommodated into the plastic body in such a way that a perfect coplanarity is assured. Also a better thermal impedance is achieved by means of the exposed pad that provides a thermal path from the die attach copper frame directly to the PCB. These features are exactly what people demand in making their designs increasingly more efficient		 LDMOS in PowerFLAT
The introduction of the PD5xxxxL series in PowerFLAT represents a major step for ST in the RF market for automotive (12V), portable equipment (7V), private mobile radio applications and also for digital cellular pico and micro BTS.

Various Benefits
PowerFLAT offers concrete improvements of many critical parameters in the RF design.
Height reduction (total thickness < 1mm)
Weight reduction
Board space reduction
Superior thermal features featuring large exposed pad
50% lower parasitic inductance / capacitance when compared to leaded packages

Full Product Range
PowerFLAT features extremely low height profile With the introduction of the PD5xxxxL series, ST widens its portfolio and gives more flexibility to the designer.
The former introduction of LDMOS in PowerSO-10RF has revolutioned the RF world, combining the rugged ST LDMOS technology with an innovative cost effective plastic package.
PowerFLAT features extremely low height profile  

The introduction of the PowerFLAT package means we now have a full plastic line-up, featuring the best RF performance while saving size and weight.
PD5xxxxL series covers VHF/UHF private mobile radio (mobile and portable) and cellular 900MHz micro BTS applications and capable of delivering an output power from 2W up to 8W.

New PD5xxxxL Product Portfolio
The table below summarizes the main features of the new PD5xxxxL series. All devices are housed in the 5x5mm version of the package.
P / N
Application
Pout
(W)
VDD
(V)
PD54003L
Portable PMR
3
7
PD54008L
8
PD55003L
Mobile PMR
3
12
PD55008L
8
 

PD55003L Broadband Data
Characterization made using a broadband UHF amplifier shows that PD55003L is capable of delivering 3W Pout with 15dB minimum gain in the whole frequency band. Performance is aligned to those measured on the PD55003 in PowerSO-10RF.

Typical performance of PD55003
Typical performance of PD55003

Magnification of LDMOS top layer
Magnification of LDMOS top layer

Full Plastic Line-Up

Complete line-up for different applications using ST's LDMOS plastic transistors
Complete line-up for different applications using ST's LDMOS plastic transistors

PowerFLAT Footprint

PowerFLAT footprintPower dissipation in plastic SMD packages is through an exposed thermal pad. The large area of about 13mm2 available in the PowerFLAT package accommodates a large number of vias, providing an effective thermal path to the heatsink below.
 

Related Topics
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