DSILC6-4xx
ESD Protection for high speed interface
Main applications
Where transient over-voltage protection in ESD sensitive equipment is required, such as:
I/O3 VCC I/O4 I/O2 GND I/O1
Computers Printers Communication systems Cell phone handsets and accessories Video equipment
SOT-666 DSILC6-4P6
Flip-Chip DSILC6-4F2
Functional diagram
Description
The DSILC6-4xx is a monolithic application specific discrete dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet, display and camera serial interfaces (LVDS).
I/O4
VCC
I/O3
I/O1
VCC
I/O2
I/O4
I/O1 GND I/O2
GND
I/O3
The device is ideal for applications where both reduced printed circuit board space and power absorption capability are required.
SOT-666 Top-side view
F l i p - Ch i p Top-side view
Features
Diode array topology
I/O1 I/O4
VCC GND
I/O2 I/O3
4 line protection 5 V VCC protection Very low capacitance: 1 pF typ. Lead-free pacakge RoHS compliant
Flip-Chip Top-side view
Order Code
Part Number DSILC6-4P6 DSILC6-4F2 Marking G EI
Benefits
Very low capacitance between lines to GND for optimized data integrity Low PCB space consumption: 2.9 mm² max for SOT-666 and 1.5 mm² max for Flip-Chip Cut-off frequency > 2 GHz High reliability offered by monolithic integration MDDI, SMIA, MIPI specification compliant
Complies with the following standards:
IEC 61000-4-2 level 4: 8 kV (contact discharge) 15 kV (air discharge) MIL STD 883G-Method 3015-7: class 3B
May 2007
Rev 3
1/11
www.st.com 11
Characteristics
DSILC6-4xx
1
Table 1.
Symbol VPP IPP PPP Tstg Tj TL
Characteristics
Absolute ratings
Parameter Peak pulse voltage Peak pulse current Peak pulse power Storage temperature range Maximum junction temperature Lead solder temperature (10 seconds duration) IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge SOT-666 I/O to GND Pulse waveform = 8/20 s SOT-666 Flip-Chip Flip-Chip Value 8 15 5 7 90 120 -55 to +150 125 260 Unit kV A W C C C
Table 2.
Symbol VRM IRM VBR VF VCL IPP
Electrical characteristics (Tamb = 25 C)
Parameter Reverse stand-off voltage Leakage current Breakdown voltage Forward voltage Clamping voltage Peak pulse current
Value Symbol IRM VBR VF Parameter Leakage current VRM = 5 V 6 1 SOT-666 Flip-Chip SOT-666 Flip-Chip SOT-666 Flip-Chip SOT-666 Flip-Chip 2 2.5 1.5 1.8 1.0 1.25 0.75 0.9 2.5 3 1.8 2.0 1.25 1.5 0.9 1.20 0.06 0.05 pF Test Conditions Min Typ Max 0.5 A V V Unit
Breakdown voltage I = 1 mA between VBUS and GND R Forward voltage IF = 10 mA VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 1.65 V, VCC = 4.3 V, F = 1 MHz, VOSC = 400 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 1.65 V, VCC = 4.3 V, F = 1 MHz, VOSC = 400 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV VI/O = 0 V, F = 1 MHz, VOSC = 30 mV
Capacitance between Ci/o-GND I/O and GND
Ci/o-i/o
Capacitance between I/O
Ci/o-GND Ci/o-i/o
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DSILC6-4xx
Characteristics
Figure 1.
Relative variation of leakage current versus junction temperature - SOT-666 (typical values)
Figure 2.
Relative variation of leakage current versus junction temperature Flip-Chip (typical values)
IRM[Tj] / IRM[Tj=25C]
100
VR = 5V
100
IRM[Tj] / IRM[Tj=25C]
VR = 5V
10
10
Tj(C)
1 25 50 75 100 125
1 25 50
Tj(C)
75 100 125
Figure 3.
Remaining voltage after Figure 4. DSILC6-4P6 during ESD 15 kV positive surge (air discharge)
10 V/div
Remaining voltage after DSILC6-4F2 during ESD 15 kV positive surge (air discharge)
10 V/div
50 ns/div
50 ns/div
Figure 5.
Remaining voltage after Figure 6. DSILC6-4P6 during ESD 15 kV negative surge (air discharge)
5 V/div
Remaining voltage after DSILC6-4F2 during ESD 15 kV negative surge (air discharge)
5 V/div
50 ns/div
50 ns/div
3/11
Characteristics
DSILC6-4xx
Figure 7.
Frequency responses of all lines DSILC6-4P6
S21(dB)
Figure 8.
Frequency response of all lines DSILC6-4F2
S21 (dB)
0.00
0.00
- 5.00
- 5.00
- 10.00
- 10.00
- 15.00
- 15.00
- 20.00
F(Hz)
- 20.00 100.0k
- 25.00
F (Hz)
100.0M Line 2 Line 4 1.0G
1.0M 3.0M 10.0M 30.0M 100.0M 300.0M Line 2 Line 4 1.0G 3.0G
1.0M Line 1 Line 3
10.0M
Line 1 Line 3
Figure 9.
Crosstalk results for lines 1/2 and 1/3 DSILC6-4P6
S21(dB)
Figure 10. Crosstalk results for lines 1/2 and 1/3 DSILC6-4F2
0.00
0.00 - 20.00 - 40.00 - 60.00 - 80.00 - 100.00 - 120.00
S21 (dB)
- 20.00
- 40.00
- 60.00
- 80.00
- 100.00
- 120.00
F(Hz)
- 140.00 100.0k
- 140.00
F (Hz)
1.0G
1.0M Xtalk 3.0M 1/2 10.0M 30.0M 100.0M 300.0M Xtalk 1/3 1.0G 3.0G
1.0M Xtalk 1/2
10.0M
100.0M Xtalk 1/3
4/11
DSILC6-4xx
Application examples
2
2.1
Application examples
MDDI
Lower Clamshell Upper Clamshell
Hinge
Analog Earpiece Audio
Power Data+ DataStrobe+ Strobe-
Power
DSILC6-4xx
MDDI Data (Host)
MDDI Strobe (Host)
Base band IC
GND
GND
MDDI Client & LCD Controller Chip (With Frame Buffer)
PRIMARY LCD
SECONDARY LCD
2.2
SMIA
DATA1+ DATA1-
DSILC6-4xx
CLOCK+ CLOCK-
SMIA device
SCL SDA ESDALC6V1P3
5/11
Application examples
DSILC6-4xx
2.3
Ethernet 1 Gb
+5V
SMP75-8
BI_DA+ BI_DA-
SMP75-8
BI_DB+ BI_DBDSILC6-4xx +5V DSILC6-4xx
DATA TRANSCEIVER
SMP75-8
BI_DC+ BI_DC-
SMP75-8
BI_DD+ BI_DD-
2.4
USB 2.0
+ 3.3V DEVICEUPSTREAM RPU TRANSCEIVER
SW2
VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS GND TX LS/FS + TX LS/FS -
+ 5V
USB connector
Protecting Bus Switch
HUBDOWNSTREAM TRANSCEIVER
SW1
VBUS D+
DRS RS RPD
USBLC6-2SC6
VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS -
GND
RS RS RPD
GND TX LS/FS + TX LS/FS -
+ 3.3V DEVICEUPSTREAM RPU TRANSCEIVER
SW2
VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS GND TX LS/FS + TX LS/FS -
SW1
USB connector
VBUS D+
DRS RS
USBLC6-2P6
RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS -
GND
RS
GND TX LS/FS +
DSILC6-4xx
RPD
RS RPD
TX LS/FS -
Mode Low Speed LS Full Speed FS High Speed HS
SW1 Open Closed
SW2 Closed Open
Closed then open Open
6/11
DSILC6-4xx
Ordering information scheme
3
Ordering information scheme
DSI
Product Designation Low capacitance Breakdown Voltage 6 = 6 Volts Number of lines protected 4 = 4 lines Packages P6 = SOT-666 F2 = Flip-Chip
LC
6-4
xx
7/11
Package information
DSILC6-4xx
4
Package information
Epoxy meets UL94, V0 SOT-666 Dimensions
Dimensions
b1 L1
Table 3.
Ref.
Millimeters Min. Typ. Max. Min.
Inches Typ. Max. 0.024 0.007 0.013
L3 b
A A3 b
D E1
0.45 0.08 0.17 0.19 1.50 1.50 1.10 0.50 0.19 0.10 0.10 0.27
0.60 0.018 0.18 0.003 0.34 0.007
b1 D
0.34 0.007 0.011 0.013 1.70 0.059 1.70 0.059 1.30 0.043 0.020 0.007 0.30 0.004 0.004 0.012 0.067 0.067 0.051
A
E
L2 E A3
E1 e L1 L2
e
L3
Figure 11. SOT-666 footprint
0.50
Figure 12. SOT-666 marking
0.62
2.60
G
0.99
0.30
8/11
DSILC6-4xx Figure 13. Flip-Chip Dimensions
650 m 65 500 m 50
Package information
500 m 50
1.1 mm 50 m
315 m 50
Figure 14. Flip-Chip footprint
Copper pad Diameter : 220m recommended Solder stencil opening : 330m recommended
1.57 mm 50m
Figure 15. Flip-Chip marking
Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week)
E
Solder mask opening recommendation : 300m recommended
xxz y ww
Figure 16. Flip-Chip tape and reel specifications
Dot identifying Pin A1 location 4 +/- 0.1 Ø 1.5 +/- 0.1
1.75 +/- 0.1 3.5 +/- 0.1
0.73 +/- 0.05
All dimensions in mm
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
8 +/- 0.3
ST E
ST E
ST E
xxz yww
User direction of unreeling
xxz yww
xxz yww
4 +/- 0.1
9/11
Ordering information
DSILC6-4xx
5
Ordering information
Ordering code DSILC6-4P6 DSILC6-4F2 Marking G EI Package SOT-666 Flip-Chip Weight 2.9 mg 2.22 mg Base qty 3000 5000 Delivery mode Tape and reel Tape and reel
6
Revision history
Date 10-Aug-2006 04-Jan-2007 Revision 1 2 Initial release. Added Flip-Chip package. Added applications examples for SMIA, Ethernet 1 Gb, and USB. Updated Tj max to 150. Added VRM line in Table 2. Modified MDDI example figure. Modified Functional diagram on page 1 to show Top side view instead of Bump side view of DSILC64F2. Removed VRM line in Table 2. Added characteristic curves specific to each package for ESD, Frequency response and Crosstalk Description of Changes
28-May-2007
3
10/11
DSILC6-4xx
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