VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
HIGH SIDE DRIVER
TYPE VN820 VN820SP VN820-B5 VN820SO VN820PT
RDS(on)
IOUT
V CC
10
40 m
9A
36 V
1
PowerSO-10TM
P 2 P AK
PPAK
CMOS COMPATIBLE INPUT ON STATE OPEN LOAD DETECTION s OFF STATE OPEN LOAD DETECTION s SHORTED LOAD PROTECTION s UNDERVOLTAGE AND OVERVOLTAGE SHUTDOWN s PROTECTION AGAINST LOSS OF GROUND s VERY LOW STAND-BY CURRENT
s s s
PENTAWATT
PACKAGE PENTAWATT TUBE
S O- 1 6 L
T&R
ORDER CODES V N 820 V N 820S P V N 820-B 5 V N 820S O V N820P T VN820SP13TR VN820-B513TR V N 8 2 0 S O1 3 T R VN820PT13TR
REVERSE BATTERY PROTECTION (*)
P owerS O-10TM P2PAK S O- 1 6 L PPAK
DESCRIPTION The VN820, VN820SP, VN820-B5, VN820SO, VN820PT are monolithic devices made by using STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to ground. Active V CC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient B LOCK DIAGRAM
compatibility table). Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device detects open load condition both is on and off state. Output shorted to VCC is detected in the off state. Device automatically turns off in case of ground pin disconnection.
VCC
VCC CLAM P
OV ERVOLTA GE DETECTION UNDERV OLTAGE DETECTION
GND Power CLAMP
INP UT LOGIC
DRIVE R OUTPUT CURRENT LIMITER
STATUS
ON STATE OPENLOAD DETECTION OVERTE MPERATURE DETECTION
OFF STATE OPENLOAD AND OUTPUT SHORTED TO V CC DE TE CTION
(*) See application schematic at page 9
Rev. 1 1/35
July 2004
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
ABSOLUTE MAXIMUM RATING
Symbol VCC - VCC - IGND IOUT - I O UT IIN ISTAT Parameter DC Supply Voltage Reverse DC Supply Voltage DC Reverse Ground Pin Current DC Output Current Reverse DC Output Current DC Input Current DC Status Current Electrostatic Discharge (Human Body Model: R=1.5K; C=100pF) VESD - INPUT - STATUS - OUTPUT - V CC Maximum Switching Energy (L=4mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Maximum Switching Energy (L=3.7mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Maximum Switching Energy (L=4.48mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=13A) Power Dissipation TC=25C Junction Operating Temperature Case Operating Temperature Storage Temperature 4000 4000 5000 5000 481 481 438 526 65.8 65.8 65.8 Internally Limited - 40 to 150 - 55 to 150 8.3 65.8 V V V V mJ mJ mJ W C C C Value PowerSO-10TM PENTAWATT P2PAK SO-16L PPAK 41 - 0.3 - 200 Internally Limited -9 +/- 10 +/- 10 Unit V V mA A A mA mA
EMAX EMAX EMAX Ptot Tj Tc Tstg
CONFIGURATION DIAGRAM (TOP VIEW) & SUGGESTED CONNECTIONS FOR UNUSED AND N.C. PINS
GROUND INPUT ST TUS A N.C. N.C.
6 7 8 9 10 11 5 4 3 2 1
OUTPUT OUTPUT N.C. OUTPUT OUTPUT
VCC N.C. GND INPUT STATUS N.C. N.C. VCC
1
16
VCC OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT
VCC
PowerSO-10TM
PPAK / P2PAK / PENTAWATT
N.C. X X Output X Input X Through 10K resistor
Connection / Pin Status Floating X To Ground
8
9
VCC
SO-16L
CURRENT AND VOLTAGE CONVENTIONS
IS
VF
IIN INPUT ISTAT STATUS
VCC
IOUT OUTPUT GND VCC
VIN VSTAT IGND
VOUT
2/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
THERMAL DATA
Symbol Rthj-case Rthj-lead Rthj-amb Rthj-amb
(1) (2)
Parameter Thermal Resistance Junction-case Thermal Resistance Junction-lead Thermal Resistance Junction-ambient Thermal Resistance Junction-ambient Max Max Max Max
Value Unit PowerSO-10 PENTAWATT P2PAK SO-16L PPAK 1.9 1.9 1.9 1.9 C/W 15 C/W 51.9 (1) 61.9 (1) 51.9 (1) 65 (2) 76.9 (1) C/W (3) 37 37 (3) 48 (4) 45 (3) C/W
When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). When mounted on FR4 printed circuit board with 0.5cm2 of Cu (at least 35 thick) connected to all VCC pins. (3) When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35m thick). (4) When mounted on FR4 printed circuit board with 6cm2 of Cu (at least 35 thick) connected to all V CC pins.
ELECTRICAL CHARACTERISTICS (8VSymbol VCC VUSD VUSDhyst VOV RO N Parameter Operating Supply Voltage Undervoltage Shut-down Undervoltage Shut-down hysteresis Overvoltage Shut-down On State Resistance Test Conditions Min 5.5 3 Typ 13 4 0.5 36 IOUT=3A; Tj=25C; VCC>8V IOUT=3A; VCC>8V Off State; VCC=13V; VIN=VOUT=0V Off State; VCC=13V; VIN=VOUT=0V; Tj=25 C On State; VCC=13V; VIN=5V; IOUT=0A IL(off1) IL(off2) IL(off3) IL(off4) Off Off Off Off State State State State Output Current Output Current Output Current Output Current VIN=VOUT=0V VIN=0V; VOUT =3.5V VIN=VOUT=0V; Vcc=13V; Tj =125C VIN=VOUT=0V; Vcc=13V; Tj =25C 0 -75 10 10 2 40 80 25 20 3.5 50 0 5 3 Max 36 5.5 Unit V V V V m m A A mA A A A A
IS
Supply Current
SW ITCHIN G (V CC=13V)
Symbol td(on) td(off) Parameter Turn-on Delay Time Turn-off Delay Time Test Conditions RL=4.3 from VIN rising edge to VOUT =1.3V RL=4.3 from VIN falling edge to VOUT =11.7V RL=4.3 from VOUT =1.3 to VOUT =10.4V RL=4.3 from VOUT =11.7 to VOUT =1.3V Min Typ 30 30 See relative diagram See relative diagram Max Unit s s V/s
dVOUT/dt(on) Turn-on Voltage Slope
dVOUT/dt(off) Turn-off Voltage Slope
V/s
3/35
1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
ELECTRICAL CHARACTERISTICS (continued) INPUT PIN
Symbol VIL IIL VIH IIH VI(hyst) VICL Parameter Input Low Level Low Level Input Current Input High Level High Level Input Current Input Hysteresis Voltage Input Clamp Voltage Test Conditions VIN=1.25V VIN=3.25V IIN=1mA IIN=-1mA 0.5 6 6.8 -0.7 Min 1 3.25 10 8 Typ Max 1.25 Unit V A V A V V V
VCC - OUTPUT DIODE
Symbol VF Parameter Forward on Voltage Test Conditions -IOUT=2A; Tj=150C Min Typ Max 0.6 Unit V
STATUS PIN
Symbol VSTAT ILSTAT CSTAT VSCL Parameter Test Conditions Status Low Output Voltage ISTAT =1.6mA Status Leakage Current Normal Operation VSTAT=5V Status Pin Input Normal Operation VSTAT=5V Capacitance ISTAT =1mA Status Clamp Voltage ISTAT =-1mA Min Typ Max 0.5 10 100 6 6.8 -0.7 8 Unit V A pF V V
PROTECTIONS (see note 1)
Symbol TTSD TR Thyst tSDL Ilim Vdemag Parameter Shut-down Temperature Reset Temperature Thermal Hysteresis Status delay in overload condition Current limitation Turn-off Output Clamp Voltage Test Conditions Min 150 135 7 Typ 175 15 20 9 5.5V
Tj>TTSD
Note 1: To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles
OPENLOAD DETECTION
Symbol IOL tDOL(on) Parameter Openload ON State Detection Threshold Openload ON State Detection Delay Openload OFF State Voltage Detection Threshold Openload Detection Delay at Turn Off Test Conditions VIN=5V IOUT =0A Min 70 Typ 150 Max 300 200 Unit mA s
VOL tDOL(off)
VIN=0V
1.5
2.5
3.5
V s
1000
4/35
2
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
OPEN LOAD STATUS TIMING (with external pull-up)
VOUT > VOL VIN IOUT< I OL
OVERTEMP STATUS TIMING Tj > TTSD VIN
VSTAT
VSTAT
tDOL(off)
tDOL(on)
tSDL
tSDL
SW ITCHIN G TIME WAVEFORMS
VOUT 90% 80%
dVOUT/dt(on)
dVOUT/dt(off)
10%
t
VIN td(on) td(off)
t TRUTH TABLE
CONDITIONS Normal Operation Current Limitation Overtemperature Undervoltage Overvoltage Output Voltage > VOL Output Current < IOL INPUT L H L H H L H L H L H L H L H OUTPUT L H L X X L L L L L L H H L H STATUS H H H (Tj < TTSD) H (Tj > TTSD) L H L X X H H L H H L
5/35
1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
OPEN LOAD DETECTION IN OFF STATE
Off state open load detection requires an external pull-up resistor (RPU) connected between OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the microprocessor. The external resistor has to be selected according to the following requirements: 1) no false open load indication when load is connected: in this case we have to avoid VOUT to be higher than VOlmin; this results in the following condition VOUT=(VPU/(RL+RPU))RL
Open Load detection in off state
V batt.
VPU
VCC RPU INPUT DRIVER + LOGIC OUT + R STATUS VOL RL IL(off2)
GROUND
6/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
ELECTRICAL TRANSIENT REQUIREMENTS ON VCC PIN
ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 CLASS C E TEST LEVELS III -75 V +75 V -100 V +75 V -6 V +66.5 V TEST LEVELS RESULTS II III C C C C C C C C C C E E
I -25 V +25 V -25 V +25 V -4 V +26.5 V
II -50 V +50 V -50 V +50 V -5 V +46.5 V
IV -100 V +100 V -150 V +100 V -7 V +86.5 V
Delays and Impedance 2 ms 10 0.2 ms 10 0.1 s 50 0.1 s 50 100 ms, 0.01 400 ms, 2
I C C C C C C
IV C C C C C E
CONTENTS All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
7/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
Figure 1: Waveforms
NORMAL OPERATION INPUT LOAD VOLTAGE STATUS UNDERVOLTAGE V CC VUSD INPUT LOAD VOLTAGE STATUS undefined VUSDhyst
OVERVOLTAGE VCCVOL VOL VCC>VOV
OPEN LOAD without external pull-up INPUT LOAD VOLTAGE STATUS
Tj INPUT LOAD CURRENT STATUS
TT S D TR
OVERTEMPERATURE
8/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
APPLICATION SCHEMATIC
+5V
+5V
Rprot STATUS
VCC
Dld C Rprot INPUT OUTPUT
GND
VGND
RGND
DGND
GND PROTECTION REVERSE BATTERY
NETWORK
AGAINST
Solution 1: Resistor in the ground line (RGND only). This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1) RGND 600mV / (IS(on)max). 2) RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device's datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on many devices are ON in the case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see below). Solution 2: A diode (DGND) in the ground line. A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load.
This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
LOAD DUMP PROTECTION
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds VCC max DC rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO T/R 7637/1 table.
C I/Os PROTECTION:
If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended Rprot value is 10k. 9/35
1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
Off State Output Current
IL(off1) (A)
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 - 50 - 25 0 25 50 75 100 125 150 175
High Level Input Current
Iih (uA)
5
Off state Vcc= 36V Vin= Vout=0V
4.5
Vin=3.25V
4 3.5 3 2.5 2 1.5 1 0.5 0 - 50 - 25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Input Clamp Voltage
Vicl (V)
8 7.8
Input High Level
Vih (V)
3.6 3.4 3.2
Iin=1mA
7.6 7.4 7.2 7 6.8 6.6
3 2.8 2.6 2.4
6.4 6.2 6 - 50 - 25 0 25 50 75 100 125 150 175 2.2 2 - 50 - 25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Input Low Level
Vil (V)
2.6 2.4 2.2
Input Hysteresis Voltage
Vhyst (V)
1. 5 1. 4 1. 3 1. 2
2 1.8 1.6 1.4
1.1 1 0. 9 0. 8 0. 7
1.2 1 - 50 - 25 0 25 50 75 100 125 150 175
0. 6 0. 5 - 50 - 25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
10/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
Overvoltage Shutdown
Vov (V)
50 48 46 44 42 40 38 36 34 32 30 -50 -25 0 25 50 75 100 125 150 175
ILIM Vs Tcase
Ilim (A)
25 22.5
Vcc=13V
20 17.5 15 12.5 10 7.5 5 2.5 0 - 50 - 25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Turn-on Voltage Slope
dVout/dt(on) (V/ms)
1000 900 800 700 600 500 400 300 200 100 0 - 50 - 25 0 25 50 75 100 125 150 175
Turn-off Voltage Slope
dVout/dt(off) (V/ms)
1000 900
Vcc=13V Rl=4.3Ohm
800 700 600 500 400 300 200 100 0 -50
Vcc=13V Rl=4.3Ohm
-25
0
25
50
75
100
125
150
175
Tc (C)
Tc (C)
On State Resistance Vs Tcase
Ron (mOhm)
100 90 80 70 60 50 40 30 20 10 0 - 50 -25 0 25 50 75 100 125 150 175
On State Resistance Vs V CC
Ron (mOhm)
100 90
Iout=3A Vcc= 8V; 13V; 36V
80
Tc= 150C
70 60 50 40 30 20 10 0 5 10 15 20 25 30 35 40
Tc= 25C
Tc= - 40C
Tc (C)
Vcc (V)
11/35
1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
Status Clamp Voltage
Vscl (V)
8 7. 8
Status Leakage Current
Ilstat (uA)
0.05
Istat=1mA
7. 6 7. 4 7. 2 7 6. 8 6. 6 6. 4 6. 2 6 - 50 - 25 0 25 50 75 100 125 150 175 0 -50 - 25 0 25 50 75 100 125 150 175 0.01 0. 02 0.03 0.04
Vstat=5V
Tc (C)
Tc (C)
Status Low Output Voltage
Vstat (V)
0.8 0.7
Open Load Off State Voltage Detection Threshold
Vol (V)
5 4.5
Istat=1.6mA
0.6
Vin=0V
4 3.5
0.5 0.4 0.3 0.2
3 2.5 2 1.5 1
0. 1 0 - 50 - 25 0 25 50 75 100 125 150 175
0.5 0 - 50 - 25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Open Load On State Detection Threshold
Iol (mA)
200 190 180 170 160 150 140 130 120 110 100 90 80 - 50 -25 0 25 50 75 100 125 150 175
Vcc=13V Vin=5V
Tc (C)
12/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PowerSO-10, P 2PAK, PENTAWATT Maximum turn off current versus load inductance
ILM AX (A) 100
10
A B C
1 0 .1 1 L (m H )
A = Single Pulse at TJstart=150C B= Repetitive pulse at T Jstart=100C C= Repetitive Pulse at T Jstart=125C Conditions: V CC= 13. 5V Values are generated with R L=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization
10
10 0
t
13/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PPAK Maximum turn off current versus load inductance
ILM AX (A) 100
A
10
B C
1 0 .1 1 L (m H )
A = Single Pulse at TJstart=150C B= Repetitive pulse at T Jstart=100C C= Repetitive Pulse at T Jstart=125C Conditions: V CC= 13. 5V Values are generated with R L=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization
10
100
t
14/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
SO-16L Maximum turn off current versus load inductance
IL M A X (A) 100
A B
10
C
1 0.1 1 L( mH )
A = Single Pulse at TJstart=150C B= Repetitive pulse at T Jstart=100C C= Repetitive Pulse at T Jstart=125C Conditions: V CC= 13. 5V Values are generated with R L=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization
10
1 00
t
15/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
SO-16L THERMAL DATA
SO-16L PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.5cm2, 6cm2).
Rthj-amb Vs PCB copper area in open box free air condition
70 65 60 55 50 45 40
RTH j-amb (C/W)
0
1
2
3
4
5
6
7
PCB Cu heatsink area (cm^2)
16/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
P2PAK THERMAL DATA
P2PAK PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.97cm2, 8cm2).
Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/W)
55
Tj-Tamb=50C
50 45 40 35 30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
17/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PPAK THERMAL DATA
PPAK PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.44cm2, 8cm2).
Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb
(C/W)
90 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
18/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PowerSO-10TM THERMAL DATA
PowerSO-10TM PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2).
Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/W)
55
Tj-Tamb=50C
50 45 40 35 30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
19/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PowerSO-10 Thermal Impedance Junction Ambient Single Pulse
ZTH (C/W) 100
0.5 cm2 6 cm2
10
1
0.1
0. 01 0.0001
0. 001
0. 01
0. 1
1
10
100
1000
Tim e (s)
Thermal fitting model of a single channel HSD in PowerSO-10 Pulse calculation formula
Z T H = RT H + ZT H t p ( 1 )
where
= tp / T
0.5 0.04 0.25 0.25 0.8 12 37 0.0008 7.00E-03 0.015 0.3 0.75 3 6
Thermal Parameter
Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
22
T_amb
5
20/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
P2PAK Thermal Impedance Junction Ambient Single Pulse
ZT H (C/W) 1 000
100
0.97 cm2 6 cm2
10
1
0.1
0 .0 1 0.000 1 0.001 0.01 0.1 1 T ime (s) 10 100 1000
Thermal fitting model of a single channel HSD in P 2PAK
Pulse calculation formula
Z T H = RT H + ZT H t p ( 1 )
where
= tp / T
0.97 0.04 0.25 0.3 4 9 37 0.0008 0.007 0.015 0.4 2 3 6
Thermal Parameter
Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
22
T_amb
5
21/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PPAK Thermal Impedance Junction Ambient Single Pulse
ZT H (C/W) 1 000
100
0.44 cm2 6 cm2
10
1
0.1
0.01 0.0 001 0 .0 0 1 0.01 0.1 1 T ime (s) 10 10 0 1 000
Thermal fitting model of a single channel HSD in PPAK
Pulse calculation formula
Z T H = RT H + ZT H t p ( 1 )
where
= tp / T
0.44 0.04 0.25 0.3 2 15 61 0.0008 0.007 0.02 0.3 0.45 0.8 6
Thermal Parameter
Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
24
T_amb
5
22/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
SO-16L Thermal Impedance Junction Ambient Single Pulse
ZT H (C/W) 1 000
100
0.5 cm2 6 cm2
10
1
0 .1
0 .0 1 0. 0001 0 .0 0 1 0 .0 1 0 .1 1 T ime (s) 10 1 00 100 0
Thermal fitting model of a single channel HSD in SO-16L
Pulse calculation formula
ZT H = RT H + Z T H t p ( 1 )
where
= tp / T
0.5 0.04 0.25 2.2 12 15 37 0.0008 7.00E-03 1.50E-02 0.14 1 3 6
Thermal Parameter
Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
22
T_amb
5
23/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PowerSO-10TM MECHANICAL DATA
DIM. A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) (*)
(*) Muar only POA P013P
mm. MIN. 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 0.047 0.031 0 2 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 TYP MAX. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 MIN. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232
inch TYP. MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 0.050 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8
B
0.10 A B
10
H
E
E2
E
E4
1
SEATING PLANE e
0.25
B
DETAIL "A"
A
C D = D1 = = = SEATING PLANE
h
A F A1
A1
L DETAIL "A"
P095A
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1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PENTAWATT (VERTICAL) MECHANICAL DATA
DIM. A C D D1 E F F1 G G1 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Diam. 3.65 2.6 15.1 6 4.5 4 3.85 0.144 10.05 17.85 15.75 21.4 22.5 3 15.8 6.6 0.102 0.594 0.236 0.177 0.157 0.152 2.4 1.2 0.35 0.8 1 3.2 6.6 3.4 6.8 mm. MIN. TYP MAX. 4.8 1.37 2.8 1.35 0.55 1.05 1.4 3.6 7 10.4 10.4 0.396 0.703 0.620 0.843 0.886 0.118 0.622 0.260 0.094 0.047 0.014 0.031 0.039 0.126 0.260 0.134 0.268 MIN. inch TYP. MAX. 0.189 0.054 0.110 0.053 0.022 0.041 0.055 0.142 0.276 0.409 0.409
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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
P2PAK MECHANICAL DATA
DIM. A A1 A2 b c c2 D D2 E E1 e e1 L L2 L3 L5 R V2 Package Weight 0 1.40 Gr (typ) 3.20 6.60 13.70 1.25 0.90 1.55 0.40 8 10.00 8.50 3.60 7.00 14.50 1.40 1.70 2.40 mm. MIN. 4.30 2.40 0.03 0.80 0.45 1.17 8.95 8.00 10.40 TYP MAX. 4.80 2.80 0.23 1.05 0.60 1.37 9.35
P 0 10 R
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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
SO-16L MECHANICAL DATA
DIM. A a1 a2 b b1 C c1 D E e e3 F L M S 7.4 0.5 10.1 10.0 1.27 8.89 7.6 1.27 0.75 8 (max.) 0.291 0.020 10.5 10.65 0.35 0.23 0.5 45 (typ.) 0.397 0.393 0.050 0.350 0.300 0.050 0.029 0.413 0.419 0.1 mm. MIN. TYP MAX. 2.65 0.2 2.45 0.49 0.32 0.014 0.009 0.020 0.004 MIN. inch TYP. MAX. 0.104 0.008 0.096 0.019 0.012
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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PPAK MECHANICAL DATA
DIM. A A1 A2 B B2 C C2 D1 D E E1 e G G1 H L2 L4 R V2 Package Weight 0 Gr. 0.3 0.60 0.2 8 4.90 2.38 9.35 0.8 6.00 6.40 4.7 1.27 5.25 2.70 10.10 1.00 1.00 MIN. 2.20 0.90 0.03 0.40 5.20 0.45 0.48 5.1 6.20 6.60 TYP MAX. 2.40 1.10 0.23 0.60 5.40 0.60 0.60
P032T1
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VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PowerSO-10TM SUGGESTED PAD LAYOUT
14.6 - 14.9
B
TUBE SHIPMENT (no suffix)
CASABLANCA MUAR
C
10.8 - 11 6.30
A A
C
0.67 - 0.73 1 2 3 4 5 10 9 8 7 6 0.54 - 0.6
B
9.5
All dimensions are in mm.
1.27
Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532
A
B
C ( 0.1) 0.8 0.8
10.4 16.4 4.9 17.2
TAPE AND REEL SHIPMENT (suffix "13TR")
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 6 00 6 00 3 30 1.5 13 20.2 24.4 60 30.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
29/35
1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PENTAWATT TUBE SHIPMENT (no suffix)
B
C
B ase Q.ty B ulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
50 1000 532 18 33. 1 1
A
30/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
P2PAK TUBE SHIPMENT (no suffix)
B
C
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
50 1000 53 2 18 33.1 1
A
TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 3 30 1.5 13 20.2 24.4 60 30.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 16 1.5 1.5 11.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
31/35
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
SO-16L TUBE SHIPMENT (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
A
C B
50 1000 53 2 3. 5 13.8 0. 6
TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 3 30 1.5 13 20.2 16.4 60 22.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 12 1.5 1.5 7.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
32/35
1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
PPAK TUBE SHIPMENT (no suffix)
A C
B
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
75 3000 53 2 6 21.3 0. 6
TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 3 30 1.5 13 20.2 16.4 60 22.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 8 1.5 1.5 7.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
33/35
1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
REVISION HISTORY
Date Revision - Minor changes - Current and voltage convention update (page 2). - "Configuration diagram (top view) & suggested connections for unused and n.c. pins" insertion (page 2). Jul 2004 1 - 6 cm2 Cu condition insertion in Thermal Data table (page 3). - VCC - OUTPUT DIODE section update (page 4). - PROTECTIONS note insertion (page 3) - Revision History table insertion (page 34). - Disclaimers update (page 35). Description of Changes
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1
VN820 / VN820SO / VN820SP / VN820-B5 / VN820PT
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics. All other names are the property of their respective owners 2004 STMicroelectronics - Printed in ITALY- All Rights Reserved. STMicroelectro nics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States h ttp://www.st.co m
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