ST’s IPD process is able to integrate high-quality passive elements (resistors, inductors, capacitors) on a glass substrate and in various design configurations. The available IPs are baluns, RF couplers, filters, diplexers, triplexers, and impedance matching. Today’s standard product offering includes baluns, RF couplers and diplexers.
The IPD technology is able to cover all RF applications with a frequency range from 800 MHz and above, such as WLAN, Bluetooth, ZigBee, WiMax, UWB, UMTS and LTE. The key benefits of this technology are a competitive cost structure, a small form factor, and reduced power losses.
ST’s IPD products are compatible with different assembly modes including CSP, microbumping and wirebonding, to be mounted either on the main PWB or inside a complete RF module.