ST Life.augmented

H3LIS331DL

MEMS motion sensor: low power high g 3-axis digital accelerometer
  • active 活性

The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.

The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.

The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.

The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

pdf Please read
Errata Sheet
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数据表

Key Features

  • Wide supply voltage, 2.16 V to 3.6 V
  • Low-voltage compatible IOs, 1.8 V
  • Ultra-low power consumption down to 10 μA in low-power mode
  • ±100g/±200g/±400g dynamically selectable full scales
  • I2C/SPI digital output interface
  • 16-bit data output
  • Sleep-to-wakeup function
  • 10000 g high-shock survivability
  • ECOPACK®, RoHS and “Green” compliant

图案 资源

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Technical Documentation

Product Specifications

描述 版本 大小
pdf
DS9012: MEMS motion sensor: low-power high-g 3-axis digital accelerometer
3.0 805 KB

Application Notes

描述 版本 大小
pdf
AN2328: HID device coding example
1.1 54 KB
pdf
AN4156: Hardware abstraction layer for Android
1.0 370 KB

Technical Notes & Articles

描述 版本 大小
pdf
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Related Tools and Software

Related Tools and Software

产品型号 描述
iNEMOEngine_PAAP PAAP engine PRO - Android Platform
iNEMOEngine_PI3P PI3P engine PRO - platform independent
iNEMOEngine_PW8 PW8 engine PRO - supports Win8 sensors

Publications and Collaterals

Brochure

描述 版本 大小
pdf
MEMS motion sensors
3,928 KB

Magazine

描述 版本 大小
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AUTO - International Journal of THE FIA, March 2013: Size matters. ST’s high-g accelerometer revolutionizes crash safety in Formula One racing
378 KB

White Paper

描述 版本 大小
pdf
Mechanical characterization and simulation of fracture processes in polysilicon MEMS
1.0 9,933 KB
pdf
Physical Sensors Drive MEMS Consumerization Waves
1.0 886 KB

样品 & 购买

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产品型号 Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
H3LIS331DLActiveLLGA 16 3x3x1.0Tray_-Distributor reported inventory date: 2014-07-30
Distributor NameRegionStockMin. order
ARROWOrder NowEUROPE4820
Ecopack2PDF
XML
H3LIS331DLTRActiveLLGA 16 3x3x1.0Tape And Reel_Free SamplesDistributor reported inventory date: 2014-07-30
Distributor NameRegionStockMin. order
DIGIKEYOrder NowWORLDWIDE25931
MOUSEROrder NowWORLDWIDE5611
Ecopack2PDF
XML

(*) 建议零售价格仅用于预算,以美元为单位,每。的报价,以当地货币计算的价格,请联系您当地的 ST 销售办事处 或我们的 分销商
(**) 材料声明表格上提供st.com可以是一般的文件,根据最常用的包,包内的家庭。出于这个原因,他们可能不是100%准确,对于一个特定的设备。请联系我们 销售支持 在特定设备上的信息。
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