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MEMS advanced smart sensor: 3D high performance accelerometer and signal processing core
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The LIS331EB is an advanced low-power high-performance smart sensor system which includes a three-axis linear accelerometer and Cortex-M0 core with 64 KB Flash, 128 KB SRAM, 8 dual timers, 2 I2C (master/slave), 1 SPI (master/slave) and 1 UART (transmitter/receiver) in a 3x3x1 mm LGA package. The device features ultra-low-power operational modes that allow advanced power saving and smart sleep-to-wakeup functions. The LIS331EB has user-selectable full scales and is capable of measuring accelerations with selectable output data rates up to 1.6 kHz. An embedded self-test capability allows the user to check the functioning of the sensor in the final application. One possible use of the LIS331EB is as a sensor hub. For example, the device can collect inputs from the accelerometer (embedded), gyroscopes, compasses, pressure and other sensors through the master I2C and elaborates/fuses together 9 or 10 axes (iNemo Engine software) to provide quaternions to the main application processor. The LIS331EB is ECOPACK®, RoHS and “Green” compliant.

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Errata Sheet
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Key Features

  • Motion sensor:
  • Ultra-low-power mode consumption down to 10 μA
  • ±2g/±4g/±6g/±8g/±16g selectable full scale
  • Data rate: 3.125 Hz to 1.6 kHz
  • 16-bit data output
  • 2 embedded state machines
  • Embedded self-test
  • 10000 g high shock survivability
  • ECOPACK®RoHS and “Green” compliant
  • Signal processor:
  • Brain: ARM-based, 32-bit Cortex-M0 CPU core
  • 64 Kbyte Flash memory
  • 128 Kbyte SRAM including 64 Kbyte with error code correction (ECC)
  • I2C master port
  • I2C slave port
  • SPI master/slave
  • 4-wire UART
  • 11 programmable GPIOs
  • Low-power features
  • 8 x 32-bit dual timers, watchdog timer (WDG), Cortex-M0 system tick (SysTick) timer
  • Standard 4-wire JTAG and 2-wire SWD
  • 80 MHz / 32 kHz RC / up to 80 MHz from single-ended external clock

图案 资源


Technical Documentation

Product Specifications

描述 版本 大小
DS10110: iNEMO-A advanced MEMS: 3D high-performance accelerometer and signal processor
2.0 1,153 KB

Application Notes

描述 版本 大小
AN2328: HID device coding example
1.1 54 KB
AN4156: Hardware abstraction layer for Android
1.0 370 KB

Technical Notes & Articles

描述 版本 大小
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Reference Manual

描述 版本 大小
RM0352: Brain smart hub family
1.0 1,553 KB

Programming Manual

描述 版本 大小
PM0222: Brain smart hub family
1.0 383 KB

Related Tools and Software

Related Tools and Software

产品型号 描述
iNEMOEngine_PAAP PAAP engine PRO - Android Platform
iNEMOEngine_PI3P PI3P engine PRO - platform independent
iNEMOEngine_PW8 PW8 engine PRO - supports Win8 sensors

Publications and Collaterals


描述 版本 大小
MEMS motion sensors
3,928 KB

White Paper

描述 版本 大小
Mechanical characterization and simulation of fracture processes in polysilicon MEMS
1.0 9,933 KB
Physical Sensors Drive MEMS Consumerization Waves
1.0 886 KB

样品 & 购买

产品型号 Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@ 1000
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
LIS331EBNRNDLLGA 3X3X1.0 16LTray_-No availability reported, please contact our Sales officeEcopack2-
LIS331EBTRActiveLLGA 3X3X1.0 16LTape And Reel_-Distributor reported inventory date: 2015-03-27
Distributor NameRegionStockMin. order

(*) 建议零售价格仅用于预算,以美元为单位,每。的报价,以当地货币计算的价格,请联系您当地的 ST 销售办事处 或我们的 分销商
(**) 材料声明表格上提供st.com可以是一般的文件,根据最常用的包,包内的家庭。出于这个原因,他们可能不是100%准确,对于一个特定的设备。请联系我们 销售支持 在特定设备上的信息。
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