STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping through CMPInitiative sets to advance new application developments in motion sensing
ST’s long-term success in MEMS (Micro-Electro-Mechanical Systems) sensors has drawn upon Company-developed industry-leading manufacturing processes. The 0.8-micron, surface micro-machining THELMA (Thick Epitaxial Layer for Micro-gyroscopes and Accelerometers) process combines variably thick and thin poly-silicon layers for structures and interconnections. This enables the integration of linear and angular mechanical elements in a single chip, delivering significant cost and size benefits to customers.
The CMP multi-project wafer service allows organizations to obtain small quantities--typically from a few dozens to a few thousand units--of advanced ICs manufactured using the same process technologies as would be used on much higher-volume products. The THELMA process design rules and design kits are now available for universities and microelectronics companies and the first requests are already being answered.The introduction of ST’s MEMS manufacturing process in CMP’s catalogue builds on the successful collaboration that has allowed universities and design firms to access ST’s semiconductor manufacturing processes from the 130nm CMOS, introduced in 2003, up to the 28nm FD-SOI technology, released for prototyping in late 2012, which enables the efficient design of next-generation mobile devices that simultaneously require high performance and low power consumption.
“The small-scale availability of our industry-leading MEMS process alongside CMOS technologies including the game-changing FD-SOI, complemented with CMP’s advanced service capabilities, offers unprecedented access to state-of-the-art in chip manufacturing for start-ups and R&D labs looking to design intelligent sensor systems,” said Benedetto Vigna, Executive Vice President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics. “With leading-edge industrialized processes at their fingertips, innovators can now concentrate on developing new products rather than investing time and resources in developing technologies.”
“Anticipating huge development in MEMS, CMP was the first silicon brokerage service in the world to offer MEMS technologies as early as in 1995,” said Bernard Courtois, Director of CMP. “Today, CMP is expanding the very successful ST partnership to the THELMA process, offering both the CMOS part and the MEMS part from a single manufacturer. Going beyond inertial sensors, pressure sensors, microphones, e-compasses etc., the ST-CMP partnership will allow CMP customers to move towards complex, embedded systems, addressing more and more societal needs, as components of the Internet of Things.”
Perspectives on Smart Systems for the Internet of Things will be presented later today by ST’s Benedetto Vigna in his opening keynote address at the DATE (Design, Automation & test in Europe) event in Grenoble, France. (http://www.date-conference.com/).About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.
In 2012, the Company’s net revenues were $8.49 billion. Further information on ST can be found at www.st.com.About CMP
CMP is a broker in ICs and MEMS for prototyping and low volume production. Circuits are fabricated for Universities, Research Laboratories and Industrial Companies. Advanced industrial technologies are available in CMOS, BiCMOS, SiGe BiCMOS, High Voltage, FD-SOI down to 20nm, pHEMT GaAs, and MEMS etc. CMP distributes and supports several CAD software tools for both Industrial Companies and Universities. Since 1981, more than 1000 Institutions from 70 countries have been served, more than 6,000 projects have been prototyped through 700 runs, and 60 different technologies have been interfaced. For more information, visit: http://cmp.imag.fr
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