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MoCA v.2 chip set - MAC, baseband and radio integrated device
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The STiC2BB and STiC2PA companion chips connect ST back-end devices to the home MoCA network as defined by the MoCA standard specification v2.0. The chip set is fully backward compatible with MoCA v1.1 standard (ST device STVMOCA).

STiC2BB is interfaced via RGMII to ST back-end devices such as STiD128 or STiH410.

The chip set comes with a complete firmware and software suite included in a product design kit.

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Errata Sheet
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Data Brief

Key Features

  • Baseband/RF IC
  • MoCA v2.0 device with backwards compatibility to MoCA v1.x
  • Wide frequency range covering all MoCA 2 bands
  • Turbo mode capable
  • Reduced Gigabit MII (RGMII)
  • I2C bus control
  • 3.3-V, 2.5-V and 1.2-V supplies
  • VQFPN 13 x 13 mm2dual row packagewith exposed pad down
  • Temperature range 0 to 70 °C
  • Channel 3/4 A/V modulator
  • I2S digital audio input
  • Digital video input (DVI)
  • Channel 3/4 RF output
  • Power/low-noise amplifiers IC
  • Supports the MoCA v1.x and v2.0 standards
  • Frequency range 400 to 1675 MHz
  • Common input/output of LNA and PA
  • High speed LNA/PA gain control interface
  • Low external component count
  • Single 3.3-V DC supply
  • Low power consumption
  • VFQFPN-24 4x4x1mm3with exposed pad down (EPD) for heat dissipation
  • Temperature range 0 to 70 °C

Design Resources


Technical Documentation

Product Specifications

Description Version Size
DB1962: MoCA® v2.0 chip set
2.0 51 KB

Sample & Buy

Part Number Marketing StatusPackagePacking TypeOrder From STUnit Price (US$)*
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
STIC2BBAPreviewQFN-MR 13X13Tray-No availability reported, please contact our Sales officeEcopack2PDF
STIC2BBBPreviewQFN-MR 13X13Tray-No availability reported, please contact our Sales officeEcopack2-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
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