LPS331APMEMS pressure sensor, 260-1260 mbar absolute digital output barometer
The LPS331AP is an ultra compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world.
The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable to detecting pressure and is manufactured using a dedicated process developed by ST, called VENSENS.
The VENSENS process allows to build a mono-silicon membrane above an air cavity with controlled gap and defined pressure. The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper.
The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LPS331AP is available in a small holed cap land grid array (HCLGA) package and it is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.
- 260 to 1260 mbar absolute pressure range
- High-resolution mode: 0.020 mbar RMS
- Low power consumption:
- Low resolution mode: 5.5 μA
- High resolution mode: 30 μA
- High overpressure capability: 20x full scale
- Embedded temperature compensation
- Embedded 24-bit ADC
- Selectable ODR from 1 Hz to 25 Hz
- SPI and I2C interfaces
- Supply voltage: 1.71 to 3.6 V
- High shock survivability: 10,000 g
- Small and thin package
- ECOPACK® lead-free compliant
DS8615: MEMS pressure sensor: 260-1260 mbar absolute digital output barometer
AN4159: Hardware and software guidelines for use of the LPS331AP
Technical Notes & Articles
TN1180: How to interpret pressure and temperature readings in the LPS331AP pressure sensor
TN1198: Surface mount guidelines for MEMS sensors in HLGA packages
Design Notes & Tips
DN0035: G-Module Motherboard
Related Tools and Software
Related Tools and Software
|STEVAL-MKI124V1||L3GD20, LSM303DLHC and LPS331AP 10-axis module designed to be plugged into a standard DIL 24 socket|
|STEVAL-MKI120V1||LPS331AP adapter board for standard DIL24 socket|
|STEVAL-MKI109V2||eMotion: ST MEMS adapters motherboard based on STM32F103, compatible with all ST MEMS adapter boards|
|X-NUCLEO-IKS01A1||Motion MEMS and environmental sensor expansion board for STM32 Nucleo|
Sample & BuyTop
|Part Number||Marketing Status||Package||Packing Type||Automotive Grade||Order From ST||Unit Price (US$)*|
|Distributor Availability||RoHS Compliance Grade||Download
|LPS331APTR||NRND||HCLGA 3x3||Tape And Reel||_||-|
|LPS331APY||NRND||HCLGA 3x3||Tray||_||-||No availability reported, please contact our Sales office||Ecopack2||PDF|
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.