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LIS331HH

MEMS digital output motion sensor:ultra low-power high full-scale 3-axes nano accelerometer
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The LIS331HH is an ultra low-power high performance high full-scale three axes linear accelerometer belonging to the "nano" family, with digital I2C/SPI serial interface standard output.

The device features ultra low-power operational modes that allow advanced power saving and smart sleep to wake-up functions.

The LIS331HH has dynamically user selectable full scales of ±6g/±12g/±24g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz. The self-test capability allows the user to check the functioning of the sensor in the final application.

The device contains 2 indipendent interrupt engines able to recognize dedicated inertial events.

Thresholds and timing of interrupt generators are programmable by the end user on the fly.

The LIS331HH is available in small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

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Errata Sheet
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Datasheet

Key Features

  • Wide supply voltage, 2.16 V to 3.6 V
  • Low voltage compatible IOs, 1.8 V
  • Ultra low-current mode consumption down to 10 μA
  • ±6g/±12g/±24g dynamically selectable fullscale
  • I2C/SPI digital output interface
  • 16 bit data output
  • 2 independent programmable interrupt engines
  • Sleep to wake-up function
  • 6D orientation detection
  • Embedded self-test
  • 10000 g high shock survivability
  • ECOPACK® RoHS and "Green" compliant

Circuit Diagram

Design Resources

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Technical Documentation

Product Specifications

Description Version Size
pdf
DS6508: MEMS digital output motion sensor ultra low-power high full-scale 3-axes “nano” accelerometer
1.1 673 KB

Application Notes

Description Version Size
pdf
AN2328: HID device coding example
1.1 54 KB
pdf
AN4156: Hardware abstraction layer for Android
1.0 370 KB

Technical Notes & Articles

Description Version Size
pdf
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Related Tools and Software

Related Tools and Software

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Publications and Collaterals

White Paper

Description Version Size
pdf
Mechanical characterization and simulation of fracture processes in polysilicon MEMS
1.0 9,933 KB
pdf
Physical Sensors Drive MEMS Consumerization Waves
1.0 886 KB

Sample & Buy

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Part Number Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@ 1000
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
LIS331HHActiveLLGA 16 3x3x1.0Tray_Free Samples2.5Distributor reported inventory date: 2015-07-02
Distributor NameRegionStockMin. order
ARROWOrder NowAMERICA22612940
Newark Element14Order NowAMERICA3580
ARROWOrder NowEUROPE5530
Farnell Element14Order NowEUROPE2881
RS COMPONENTSOrder NowEUROPE5761
RUTRONIKOrder NowEUROPE2429490
DIGIKEYOrder NowWORLDWIDE31831
FUTUREOrder NowWORLDWIDE28491
MOUSEROrder NowWORLDWIDE6371
Ecopack2-
LIS331HHTRActiveLLGA 16 3x3x1.0Tape And Reel_-2.5Distributor reported inventory date: 2015-07-02
Distributor NameRegionStockMin. order
ARROWOrder NowAMERICA133604000
Ecopack2-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
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