ST Life.augmented

Kerkey

Security Module for Smartmetering system
  • active Active

The Kerkey device implements the commands defined by the BSI for the Security Module of a Smart Meter Gateway as well as Global Platform v2.1.1 commands.

pdf Please read
Errata Sheet
pdf データシート
Data Brief

Key Features

  • Protection profile for the Security Module of a Smart Meter Gateway (Security Module PP)
  • ECC support for NIST-P-256
  • Digital signature generation and verification with ECDSA
  • Key agreement with Diffie-Hellman (ECKA-ECDH) and El Gamal (ECKA-EG)
  • PACE with ECDH-GM-AES-CBC-CMAC-128 for secure messaging
  • On-chip ECC key pair generation
  • ISO7816-4 file system with EFs, DFs and ADFs, including nesting of DFs
  • Key pair, public key and PIN objects
  • Extended length APDUs
  • ECOPACK® 32-lead VFQFPN 5x5 mm (0.5 mm pitch)
  • Platform
  • Java Card™ inside (Version 2.2)
  • GlobalPlatform™ (Version 2.1.1)
  • ISO/IEC 7816 T=0 and T=1 contact protocols
  • Common personalization specification (CPS) compliant
  • Hardware
  • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes linear addressable memory
  • 80 Kbytes of User EEPROM including 128 bytes of User OTP area:
  • 30-year data retention at 25° C
  • 500,000 erase/write cycles at 25° C
  • 1 to 64 bytes Erase or Program in 1.5 ms
  • Operating temperature: –25° to +85° C
  • Enhanced NESCRYPT crypto-processor for public key cryptography
  • Hardware security enhanced DES accelerator
  • Contact assignment compatible with ISO/IEC 7816-3 standards
  • Asynchronous receiver transmitter (IART) for high speed serial data support (ISO/IEC 7816-3 and EMV™ compliant)
  • ESD protection greater then 6 kV (HBM)
  • 3V and 5V supply voltage ranges
  • EMVCo / CC (EAL6+) certification
  • Security
  • AIS-31 class P2 compliant true random number generator (TRNG)
  • Enhanced cryptographic algorithms:
  • DES/3DES, RSA, ECC and AES
  • SEED, SHA-1, SHA-256, MD5 and CRC16
  • Password Authenticated Connection Establishment (PACE) protocol
  • Differential power analysis (DPA) and differential fault analysis (DFA) countermeasures against side channel attacks
  • Active shield
  • ISO 3309 CRC calculation block
  • Memory protection unit (MPU)
  • Unique serial number on each die

デザイン・リソース

トップ

Technical Documentation

Product Specifications

Description Version Size
pdf
DB2075: Security Module for Smartgrid applications
2.0 184 KB

Presentations & Training Material

Presentations

Description Version Size
pdf
Kerkey - SmartGrid presentation
642 KB

Publications and Collaterals

Flyer

Description Version Size
pdf
Kerkey for Brand Protection
1,668 KB

サンプル& 購入

トップ
製品型名 Marketing StatusPackagePacking TypeOrder From STUnit Price (US$)*
@
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
KERKEYActiveDICENot Applicable-No availability reported, please contact our Sales officeN/A-

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(**)弊社ホームページで入手できるMaterial Declaration(材料宣誓書)のフォームは、各パッケージ・タイプで最も一般的に使用されるパッケージに基づいた包括的な文書です。そのため、特定のデバイスについて100%正確ではない可能性があります。特定のデバイスに関する情報については、 弊社セールスオフィス にお問合せ下さい。
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