LSM330D
iNEMO inertial module: 3D accelerometer and 3D gyroscope-
アクティブ
The LSM330D is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using a CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LSM330D has dynamically user-selectable full scale acceleration range of ±2 g/±4 g/±8 g/±16 g and angular rate of ±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can be either activated or separately put in Low power/Power-down mode for applications optimized for power saving.
The LSM330D is available in a plastic land grid array (LGA) package.
Key Features
- Analog supply voltage: 2.4 V to 3.6 V
- Digital supply voltage IOs: 1.8 V
- Low power mode
- Power-down mode
- 3 independent acceleration channels and 3 angular rate channels
- ±2 g/±4 g/±8 g/±16 g dynamically selectable full scale
- ±250/±500/±2000 dps dynamically selectable full scale
- SPI/I2C serial interface (16-bit data output)
- Programmable interrupt generator for free-fall and motion detection
- ECOPACK® RoHS and “Green” compliant
模様 資源
トップTechnical Documentation
Product Specifications
| 描写 | 稿 | 大きさ |
|---|---|---|
|
DS8787: iNEMO inertial module: 3D accelerometer and 3D gyroscope
|
2.0 | 1,503 KB |
User Manual
| 描写 | 稿 | 大きさ |
|---|---|---|
|
UM1049: Unico GUI: software guide
|
2.0 | 1,837 KB |
Design Notes & Tips
| 描写 | 稿 | 大きさ |
|---|---|---|
|
DT0005: Providing flexibility in sampling the accelerometer and gyroscope by using the DEN_G pin of the iNEMO inertial module
|
1.0 | 165 KB |
Related Tools and Software
Related Tools and Software
| 製品型名 | 描写 |
|---|---|
| STSW-MEMS029 | LSM330D Linux OS device driver |
| iNEMOENgine_PW8 | PW8 engine PRO - supports Win8 sensors |
| iNEMOEngine_LI3 | LI3 engine LITE - source code |
| iNEMOEngine_PAAP | PAAP engine PRO - Android Platform |
| iNEMOEngine_PI3P | PI3P engine PRO - platform independent |
Publications and Collaterals
Brochure
| 描写 | 稿 | 大きさ |
|---|---|---|
|
MEMS motion sensors
|
1,905 KB | |
|
Peripheral semiconductors for set-top box applications
|
634 KB |
サンプル& 購入
トップ| 製品型名 | Marketing Status | Package | Packing Type | Automotive Grade | Order From ST | Unit Price (US$)* @ | Distributor Availability | RoHS Compliance Grade | Download Material Declaration** |
|||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LSM330D | Active | LGA 3X5.5X1 28L PITCH 0.45 | Tray | _ | - | No data reported, please contact our Distributors | Ecopack2 | PDF XML | ||||
| LSM330DTR | Active | LGA 3X5.5X1 28L PITCH 0.45 | Tape And Reel | _ | - | No data reported, please contact our Distributors | Ecopack2 | PDF XML | ||||
(*) 概算見積もり用になり通貨単位が価格(USD)。詳細情報については、現地通貨での価格は、地元の販売店にお問い合わせください ST 販売の オフィス または当社 代理店 (**) st.comで利用可能な材質宣言フォームはパッケージ·ファミリの中で最も一般的に使用されるパッケージに基づいて一般的な文書かもしれません。このような理由から、彼らは、特定のデバイスのための100%正確ではないかもしれません。当社までご連絡ください セールスサポート 特定のデバイスの詳細については、 |
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