ST Life.augmented

LSM303DLHC

Ultra compact high performance e-compass: 3D accelerometer and 3D magnetometer module
  • NRND NRND

The LSM303DLHC is a system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor.

The LSM303DLHC has linear acceleration full scales of ±2g / ±4g / ±8g / ±16g and a magnetic field full scale of ±1.3 / ±1.9 / ±2.5 / ±4.0 / ±4.7 / ±5.6 / ±8.1 gauss.

The LSM303DLHC includes an I2C serial bus interface that supports standard and fast mode 100 kHz and 400 kHz. The system can be configured to generate interrupt signals by inertial wake-up/free-fall events as well as by the position of the device itself. Thresholds and timing of interrupt generators are programmable by the end user. Magnetic and accelerometer blocks can be enabled or put into power-down mode separately.

The LSM303DLHC is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

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Errata Sheet
pdf データシート
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Key Features

  • 3 magnetic field channels and 3 acceleration channels
  • From ±1.3 to ±8.1 gauss magnetic field full scale
  • ±2g/±4g/±8g/±16g linear acceleration full scale
  • 16-bit data output
  • I2C serial interface
  • Analog supply voltage 2.16 V to 3.6 V
  • Power-down mode / low-power mode
  • 2 independent programmable interrupt generators for free-fall and motion detection
  • Embedded temperature sensor
  • Embedded FIFO
  • 6D/4D-orientation detection
  • ECOPACK® RoHS and “Green” compliant

デザイン・リソース

トップ

Technical Documentation

Product Specifications

Description Version Size
pdf
DS7202: Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer
2.0 814 KB

Technical Notes & Articles

Description Version Size
pdf
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Design Notes & Tips

Description Version Size
pdf
DT0008: Simple screen rotation using the accelerometer built-in 4D detection interrupt
1.0 204 KB

Related Tools and Software

Related Tools and Software

製品型名 Description
STEVAL-MKI106V1 LSM303DLHC adapter board designed to be plugged into a standard DIL24 socket
STEVAL-MKI108V2 L3GD20 and LSM303DLHC 9 axis module for a standard DIL24 socket
STEVAL-MKI109V2 eMotion: ST MEMS adapters motherboard based on STM32. Compatible with all ST MEMS adapters based on STM32F103
STEVAL-MKI114V1 Magnetic field probe kit based on the LSM303DLHC
STEVAL-MKI124V1 L3GD20, LSM303DLHC and LPS331AP 10-axis module designed to be plugged into a standard DIL 24 socket
STSW-MEMS009 Platform-independent device driver for LSM303DLHC
STSW-MEMS026 LSM303DLHC Linux OS device driver
iNEMOEngine_PAAP PAAP engine PRO - Android Platform
iNEMOEngine_PI3P PI3P engine PRO - platform independent
iNEMOEngine_PW8 PW8 engine PRO - supports Win8 sensors

Publications and Collaterals

Brochure

Description Version Size
pdf
MEMS motion sensors
3,928 KB
pdf
Peripheral semiconductors for set-top box applications
634 KB

サンプル& 購入

トップ
製品型名 Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
LSM303DLHCNRNDLGA 14 3x5x1.0Tray_-Distributor reported inventory date: 2014-08-01
Distributor NameRegionStockMin. order
AVNETOrder NowAMERICA9920
ARROWOrder NowEUROPE102340
Farnell Element14Order NowEUROPE8571
RUTRONIKOrder NowEUROPE49951
FUTUREOrder NowWORLDWIDE52661
Ecopack2PDF
XML
LSM303DLHCTRNRNDLGA 14 3x5x1.0Tape And Reel_-Distributor reported inventory date: 2014-08-01
Distributor NameRegionStockMin. order
P&SOrder NowASIA/PACIFIC5331
RUTRONIKOrder NowEUROPE50005000
Ecopack2PDF
XML

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(**)弊社ホームページで入手できるMaterial Declaration(材料宣誓書)のフォームは、各パッケージ・タイプで最も一般的に使用されるパッケージに基づいた包括的な文書です。そのため、特定のデバイスについて100%正確ではない可能性があります。特定のデバイスに関する情報については、 弊社セールスオフィス にお問合せ下さい。
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