ST Life.augmented

H3LIS331DL

MEMS motion sensor: low power high g 3-axis digital accelerometer
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The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.

The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.

The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.

The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

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Errata Sheet
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Key Features

  • Wide supply voltage, 2.16 V to 3.6 V
  • Low-voltage compatible IOs, 1.8 V
  • Ultra-low power consumption down to 10 μA in low-power mode
  • ±100g/±200g/±400g dynamically selectable full scales
  • I2C/SPI digital output interface
  • 16-bit data output
  • Sleep-to-wakeup function
  • 10000 g high-shock survivability
  • ECOPACK®, RoHS and “Green” compliant

デザイン・リソース

トップ

Technical Documentation

Product Specifications

Description Version Size
pdf
DS9012: MEMS motion sensor: low-power high-g 3-axis digital accelerometer
3.0 805 KB

Application Notes

Description Version Size
pdf
AN2328: HID device coding example
1.1 54 KB
pdf
AN4156: Hardware abstraction layer for Android
1.0 370 KB

Technical Notes & Articles

Description Version Size
pdf
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Related Tools and Software

Related Tools and Software

製品型名 Description
iNEMOEngine_PAAP PAAP engine PRO - Android Platform
iNEMOEngine_PI3P PI3P engine PRO - platform independent
iNEMOEngine_PW8 PW8 engine PRO - supports Win8 sensors

Publications and Collaterals

Brochure

Description Version Size
pdf
MEMS motion sensors
3,928 KB

Magazine

Description Version Size
pdf
AUTO - International Journal of THE FIA, March 2013: Size matters. ST’s high-g accelerometer revolutionizes crash safety in Formula One racing
378 KB

White Paper

Description Version Size
pdf
Mechanical characterization and simulation of fracture processes in polysilicon MEMS
1.0 9,933 KB
pdf
Physical Sensors Drive MEMS Consumerization Waves
1.0 886 KB

サンプル& 購入

トップ
製品型名 Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
H3LIS331DLActiveLLGA 16 3x3x1.0Tray_-Distributor reported inventory date: 2014-08-20
Distributor NameRegionStockMin. order
ANGLIA LiveOrder NowEUROPE9490
ARROWOrder NowEUROPE4820
Farnell Element14Order NowEUROPE4891
Ecopack2PDF
XML
H3LIS331DLTRActiveLLGA 16 3x3x1.0Tape And Reel_Free SamplesDistributor reported inventory date: 2014-08-20
Distributor NameRegionStockMin. order
ARROWOrder NowAMERICA193424000
DIGIKEYOrder NowWORLDWIDE14191
MOUSEROrder NowWORLDWIDE4571
Ecopack2PDF
XML

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(**)弊社ホームページで入手できるMaterial Declaration(材料宣誓書)のフォームは、各パッケージ・タイプで最も一般的に使用されるパッケージに基づいた包括的な文書です。そのため、特定のデバイスについて100%正確ではない可能性があります。特定のデバイスに関する情報については、 弊社セールスオフィス にお問合せ下さい。
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