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LIS331EB

MEMS advanced smart sensor: 3D high performance accelerometer and signal processing core
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The LIS331EB is an advanced low-power high-performance smart sensor system which includes a three-axis linear accelerometer and Cortex-M0 core with 64 KB Flash, 128 KB SRAM, 8 dual timers, 2 I2C (master/slave), 1 SPI (master/slave) and 1 UART (transmitter/receiver) in a 3x3x1 mm LGA package. The device features ultra-low-power operational modes that allow advanced power saving and smart sleep-to-wakeup functions. The LIS331EB has user-selectable full scales and is capable of measuring accelerations with selectable output data rates up to 1.6 kHz. An embedded self-test capability allows the user to check the functioning of the sensor in the final application. One possible use of the LIS331EB is as a sensor hub. For example, the device can collect inputs from the accelerometer (embedded), gyroscopes, compasses, pressure and other sensors through the master I2C and elaborates/fuses together 9 or 10 axes (iNemo Engine software) to provide quaternions to the main application processor. The LIS331EB is ECOPACK®, RoHS and “Green” compliant.

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Key Features

  • Motion sensor:
  • Ultra-low-power mode consumption down to 10 μA
  • ±2g/±4g/±6g/±8g/±16g selectable full scale
  • Data rate: 3.125 Hz to 1.6 kHz
  • 16-bit data output
  • 2 embedded state machines
  • Embedded self-test
  • 10000 g high shock survivability
  • ECOPACK®RoHS and “Green” compliant
  • Signal processor:
  • Brain: ARM-based, 32-bit Cortex-M0 CPU core
  • 64 Kbyte Flash memory
  • 128 Kbyte SRAM including 64 Kbyte with error code correction (ECC)
  • I2C master port
  • I2C slave port
  • SPI master/slave
  • 4-wire UART
  • 11 programmable GPIOs
  • Low-power features
  • 8 x 32-bit dual timers, watchdog timer (WDG), Cortex-M0 system tick (SysTick) timer
  • Standard 4-wire JTAG and 2-wire SWD
  • 80 MHz / 32 kHz RC / up to 80 MHz from single-ended external clock

デザイン・リソース

トップ

Technical Documentation

Product Specifications

Description Version Size
pdf
DS10110: iNEMO-A advanced MEMS: 3D high-performance accelerometer and signal processor
2.0 1,153 KB

Application Notes

Description Version Size
pdf
AN2328: HID device coding example
1.1 54 KB
pdf
AN4156: Hardware abstraction layer for Android
1.0 370 KB

Technical Notes & Articles

Description Version Size
pdf
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Reference Manual

Description Version Size
pdf
RM0352: Brain smart hub family
1.0 1,553 KB

Programming Manual

Description Version Size
pdf
PM0222: Brain smart hub family
1.0 383 KB

Related Tools and Software

Related Tools and Software

製品型名 Description
iNEMOEngine_PAAP PAAP engine PRO - Android Platform
iNEMOEngine_PI3P PI3P engine PRO - platform independent
iNEMOEngine_PW8 PW8 engine PRO - supports Win8 sensors

Publications and Collaterals

Brochure

Description Version Size
pdf
MEMS motion sensors
3,928 KB

White Paper

Description Version Size
pdf
Mechanical characterization and simulation of fracture processes in polysilicon MEMS
1.0 9,933 KB
pdf
Physical Sensors Drive MEMS Consumerization Waves
1.0 886 KB

サンプル& 購入

トップ
製品型名 Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
LIS331EBActiveLLGA 3X3X1.0 16LTray_-Distributor reported inventory date: 2014-12-20
Distributor NameRegionStockMin. order
ARROWOrder NowEUROPE28150
Ecopack2-
LIS331EBTRActiveLLGA 3X3X1.0 16LTape And Reel_-No availability reported, please contact our Sales officeEcopack2-

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(**)弊社ホームページで入手できるMaterial Declaration(材料宣誓書)のフォームは、各パッケージ・タイプで最も一般的に使用されるパッケージに基づいた包括的な文書です。そのため、特定のデバイスについて100%正確ではない可能性があります。特定のデバイスに関する情報については、 弊社セールスオフィス にお問合せ下さい。
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