STMicroelectronics Signs Loan Agreement with the European Investment Bank
- Euro 350 million multicurrency facility supports ST’s R&D investments in Power, MEMS and Sensors, Microcontrollers, Advanced Analog and Healthcare high-growth applications
- Euro 350 million floating-rate senior bonds repaid on March 17th with available resources
- ST capital structure further strengthened
This new facility, which further strengthens the long-established relationship between ST and EIB, supports ST’s activities in R&D and innovation related to the design and realization of the next generation of technologies and electronic devices for applications in Power, MEMS, Microcontrollers, Advanced Analog and Healthcare. This includes the full cycle from technology R&D and product development to application solutions that include software development and systems integration. These activities are mainly carried out in ST’s Italian sites of Agrate Brianza, Castelletto and Catania.
Furthermore, on March 17th, 2013, ST repaid with available cash the residual Euro 350 million floating-rate senior bonds outstanding with a principal amount of Euro 500 million at issuance. ST’s capital structure, already supported by a net cash position of about US$ 1.19 billion at the end of Q4 2012, and existing committed credit lines for about US$ 490 million, has been further strengthened by this new credit facility from the EIB.
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.
In 2012, the Company’s net revenues were $8.49 billion. Further information on ST can be found at www.st.com