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Starting January 2001, top 3 European semiconductor device manufacturers: STMicroelectronics, Philips Semiconductors and Infineon Technologies are working together in the E3 (Environmental 3) Initiative to promote standardization, methodologies and a common roadmap towards Lead-free electronics. Since June 3rd 2004 the Initiative is extended to Freescale Semiconductors; it is now named E4 (Environmental 4).
Aim of E4 is to provide high quality drop-in solutions for Lead-free applications to all Customers of the E4 members. E4 will share databases and methodologies, collaborate on standards and develop a common conversion strategy for the transition to Lead-free.
9 common documents have been published on Lead-free Matte Tin plated components and on whisker risk prevention:
E3 Tin Whisker Formation - Results, Test Methods and Countermeasures
E3 Whisker Root Cause and Respective Test Conditions
E3 Data on solderability of leadfree parts
E3 Data on whiskers for parts done with Cu
E3 Whiskers data for AL42 frames
E4 Sn plating in respect to proposed NEMI test conditions
E4 Whisker Formation on Tin Plated Cu based Leadframes
E4 Whisker Formation on Tin Plated FeNi42
E4 Lead-free packaging for Semiconductor Devices
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Whisker Formation |
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Whisker on Lead-free platings |
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Whiskers testing: Reality or Fiction? |
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Pure Tin Plating Qualification |
Product/Process Change Notification
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PCN Code
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PCN Reference
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Insertion Date
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PCSR2003004
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31-Oct-03
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PCSR2003005
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6-Nov-03
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DSG-COM/03/145
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24-Jan-03
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DSG-DIS/03/322
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28-Aug ,2003
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DSG/03/288
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13- Oct-2003
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DSG/03/346
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14-Oct-03
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DSG/03/368
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27-Nov-03
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DSG/03/380
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28-Nov-03
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DSG-COM/03/391
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11-Dec-03
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MPG EEP/04/451
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12-Feb-04
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CMG-IMG/04/457
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26-Feb-04
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CMG-TVD/04 493
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16-Apr-2004
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MPG EEP/04/578
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28-Jun-04
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CMG-TVD/04/635
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20-Jul-,2004
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CMG-TVD/04/634
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20-Jul-2004
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CMG-TVD/04/651
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23-Jul-2004
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CMG-TVD/04/677
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08-Sep-2004
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CMG-TVD/04/678
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8-Oct-04
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CMG-TVD/04/679
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8-Oct-04
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CMG-TVD/04/683
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8-Oct-04
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CMG-TVD/04/742
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10-May-04
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CMG-TVD/04/743
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10-Jun-04
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CRP 04/744
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8-Nov-2004
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PIL 1014 MOLDING MATERIAL IMPROVEMENT FOR SO NARROW PREPLATED PACKAGES
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20-May-2005
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PCN 1015 SUBSTRATE METALLISATION AND LEAD FREE SOLDER BALLS CHANGE FOR BGA PACKAGES WITH SIZE EQUAL OR BELOW 23X23
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20-May-2005
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Product/Process Information Letter
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PIL Title |
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LEADFREE COMPONENTS CONNECTIONS
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New Format for Standard Label Inner box (“bulk”)
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