32-bit Power Architecture MCU for Automotive Applications

This family of MCUs targets automotive powertrain controller applications for four-cylinder gasoline and diesel engines, chassis control applications, transmission control applications, steering and braking applications, as well as low-end hybrid applications.

Many of the applications are considered to be functionally safe and the family is designed to achieve ISO26262 ASIL-D compliance.

Key Features

  • Two main 32-bit Power Architecture® VLE compliant CPU core (e200z4), dual issue, running in lockstep
    • Single-precision floating point operations
    • 16 KB local instruction SRAM and 64 KB local data SRAM
    • 4 KB I-Cache and 2 KB D-Cache
  • One 32-bit Power Architecture® VLE compliant I/O processor core (e200z2)
    • Single-precision floating point operations
    • Lightweight Signal Processing Auxiliary Processing Unit (LSP APU) instruction support for digital signal processing (DSP)
    • 16 KB local instruction SRAM and 48 KB local data SRAM
  • 2624 KB on-chip flash memory
    • Supporting EEPROM emulation (64 KB)
  • 64 KB on-chip general-purpose SRAM (+112 KB data RAM included in the CPUs)
  • Multi-channel direct memory access controller (eDMA) with 32 channels
  • Dual interrupt controller (INTC)
  • Dual phase-locked loops, including one Frequency-modulated
  • System integration unit lite (SIUL)
  • Boot Assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
  • Generic timer module (GTM122)
    • Intelligent complex timer module
    • 88 channels (24 input and 64 output)
    • 3 programmable fine grain multi-threaded cores
    • 26 KB of dedicated SRAM
    • Hardware support for engine control, motor control and safety related applications
  • Enhanced analog-to-digital converter system with:
    • 1 supervisor 12-bit SAR analog converter
    • 4 separate fast 12-bit SAR analog converters
    • 2 separate 16-bit Sigma-Delta analog converters
  • 5 Deserial Serial Peripheral Interface (DSPI) modules
  • 5 LIN and UART communication interface (LINFlexD) modules
  • 3 MCAN interfaces with advanced shared memory scheme, two supporting ISO CAN-FD and one supporting TTCAN
  • One Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
  • Dual-channel FlexRay controller
  • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with partial support for 2010 standard
  • Device and board test support per Joint Test Action Group (JTAG) (IEEE 1149.1)
  • Single 5 V +/-10% Power supply supporting cold start conditions (down to 3.0 V)
  • Designed for eTQFP144 and eLQFP176



Description Version Size
32-bit Power Architecture® based MCU for automotive applications 6.0 4 MB
Description Version Size
How to split self-test (Key-On & Key-Off) 1.0 1 MB
Introduction to the usage of TDM peripheral SPC57xx devices 1.0 717 KB
Memory monitoring using JDC module 1.0 2 MB
SPC574K72/SPC57EM80 Getting Started 2.0 773 KB
SPC574K72xx safety manual 1.0 2 MB
SPC57xx ADC device 1.0 1 MB
SPC57xx/SPC58xx: Debug over CAN 3.0 966 KB
Self–test performances 2.0 441 KB
Sensorless BLDC Motor Control using SPC574K72xx 1.0 498 KB
Software routine for safe usage the interrupt controller SPC57EM80x/SPC574K72x according to ISO26262 2.0 448 KB
Technical Notes & Articles
Description Version Size
SENT demo driver for the SPC57xx/SPC58xx microcontroller families 2.0 407 KB
TDM: SW Tamper Region override 1.0 400 KB
Description Version Size
Standard software driver for C55 Flash 4.0 764 KB
Variable-Length Encoding (VLE) extension -programming interface manual 1.3 421 KB
uTester 1.0 2 MB
Description Version Size
Generic Timer Module specification revision 1.0 10 MB
Programmer's reference manual for Book E processors 2.0 24 MB
Description Version Size
SPC574K70x, SPC574K72x device errata JTAG_ID = 0x0AF07041 2.0 2 MB
SPC574K70x, SPC574K72x device errata JTAG_ID = 0x3AF07041 1.0 2 MB
SPC574K72E5, SPC574K72E7 device errata JTAG_ID = 0x0AF06041 3.0 2 MB
SPC574K72x devices errata JTAG_ID=0x4AF0_7041 1.0 322 KB


Description Version Size
SPC5 32-bit microcontroller Series featuring Power Architecture 2 MB
SPC5 Family Overview October 2015 2 MB


Description Version Size
Driving Electromobility 1.0 1 MB


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型号 Marketing Status Packing Type CPU Clock Frequency (MHz) (max) FLASH Size (kB) (Data) Features set Operating Temperature (°C) (min) Operating Temperature (°C) (max) Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
SPC574K72E7C6FAR Active Tape And Reel 160 64 ASILD/SIL3,Flexray -40 125 - - NEC 3A991A2 - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C60AR Proposal Tape And Reel 160 64 - -40 125 - - - - - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C68AR Proposal Tape And Reel 160 64 - -40 125 - - - - - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C6FAY Active Tray 160 64 ASILD/SIL3,Flexray -40 125 - - NEC 3A991A2 - MORE INFO No availability reported, please contact our Sales office
SPC574K72E7C61AR Proposal Tape And Reel 160 64 ASILD/SIL3 -40 125 - - - - - MORE INFO No availability reported, please contact our Sales office

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors


型号 Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
SPC574K72E7C6FAR ActiveLQFP 176 24x24x1.4AutomotiveEcopack2 0 0
SPC574K72E7C60AR Proposal - AutomotiveEcopack2
SPC574K72E7C68AR Proposal - AutomotiveEcopack2
SPC574K72E7C6FAY ActiveLQFP 176 24x24x1.4AutomotiveEcopack2 0 0
SPC574K72E7C61AR ProposalLQFP 176 24x24x1.4AutomotiveEcopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.