EUROSIME 2021
22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
DATE: April 19-20-21-22, 2021 – virtual event
Website: Click here
Listen to ST experts present our latest innovations on thermal Mechanical and Multi-physics simulation in microelectronics!
| Date | Time (CET) | Title | Speaker |
| 19 April | 9:00am | KEYNOTE: Simulation, a reality for successfully IC packaging heterogenous integration | Laurent Herard |
| April 21 | 13:00 | Weibull Analysis of Failure Strength and Flexural Modulus in 4H-SiC Die through a 3-PB test | Vincenzo Vinciguerra |
| April 21 | 15:30 | Thermomechanical deformation characterization for full-molded sensor package | Marco Del Sarto |
| On Demand Program | Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: a Parametric Study | Alessandro Sitta | |
| On Demand Program | Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package | Alessandro Sitta | |
| On demand program | On the Way to understand the Warpage in 8” Taiko Semiconductor Wafers for Power Electronics Applications (Si and SiC) | Vincenzo Vinciguerra |
