How to Easily Implement GNSS Positioning in your IoT Design

Learn how Teseo modules use multi-constellation GNSS signals and dead-reckoning to enable high-accuracy positioning in a wide range of IoT applications


This webinar was broadcast on Thursday, September 16th, 2021


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During this one-hour webinar, you will discover a unique family of small but powerful GNSS modules and learn how to easily integrate them into your design using a rich set of hardware and software development tools.

GNSS (Global Navigation Satellite System) is a broad, complex, and quickly-evolving technology. It can be quite daunting if it is new to you and you need to design-in a capable solution quickly.

In this webinar we will demystify the GNSS technology and get right to the heart of what you need to know to design a positioning solution that meets your application's requirements.

You will learn:

  • What GNSS means and why multi-constellation is beneficial
  • The key benefits of the Teseo-LIV3FL and Teseo-VIC3D/DA modules
  • How to calibrate and leverage dead-reckoning (DRAW/DRUM)
  • Tips on how to ensure your hardware design is optimized from the first iteration



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Massimiliano Nicotra is a Market Development Engineer for Teseo GNSS module families in STMicroelectronics’ Americas region, a position he has held since 2019. Joining ST over 10 years ago in Italy, he transferred to the US in 2018 to work as ST's Market Development Engineer for automotive microcontrollers and microprocessors. Before joining ST, he was a researcher in the biometric and bio-security field. Massimiliano is from Catania (Italy) and holds a master’s degree in Computer Engineering from the University of Catania


About Teseo GNSS modules from STMicroelectronics

The Teseo-LIV3FL (9.7 x 10.1 x 2.3 mm) is an easy-to-use Global Navigation Satellite System (GNSS) standalone module, embedding a Teseo III single-die positioning receiver IC working simultaneously with multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS).

The Teseo-VIC3D/DA modules (12.2 x 16 x 2.4 mm) include an ST 6-axis Inertial Measurement Unit (IMU) to support the on-chip dead-reckoning solution (DRAW and DRUM).