Advanced IO-Link Chips for Intelligent Sensor Networks
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Join our 1-hour webinar on Advanced IO-Link Chips for Intelligent Sensor NetworksThis webinar was broadcasted Tuesday, December 1st, 2020
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Enable digital communication down to the sensor & actuator level, and boost the performance and efficiency of your application with the newest ST IO-Link Master & Device transceivers.
We will present our solutions for implementing IO-Link Master and Device nodes in smart industrial sensor and actuator networks, with key focus on the new L6364 physical layer transceiver and related ST IO-Link products. We will also discuss the relevant hardware and software evaluation ecosystem for developers, with evaluation boards based on STM32 running the IO-Link stack provided by TEConcept.
Our ICs offer highly robust and efficient power stages for minimal power dissipation, and come with a rich set of widely programmable features and embedded protections to enable highly integrated and compact solutions.
Agenda
- IO-Link Technology introduction and market overview, advantages vs. conventional busses
- New ST Master and Device transceivers, key features and benefits
- Evaluation kits based on STM32 MCUs, firmware and graphical user interface
Speakers
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Milos Hofman is Technical Marketing Manager responsible for ST Factory Automation Vertical Program. He focuses on smart industrial networks and digital I/O systems. Milos has 17 years’ experience in industrial automation field and is behind the specification of several ST integrated circuits. |
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Vojtech Elias is an advanced Application Engineer with ten years' experience in STMicroelectronics. As a member of the Power Application Laboratory in Prague, Vojtech focuses particularly on integrated solutions for Industrial Automation applications. His technical knowledge covers smart power & protection components for Industrial Automation and IO-Link communication. |
Product details
ST offers complete solutions for IO-Link communication on both Master and Device sides. The L6360 single-channel Master transceiver embeds a very efficient power stage, digital input interfaces with a highly precise pull-down current generator to minimize power losses. L6362A is a very robust and flexible IC, which is fully compliant with the IO-Link specification, but performs just as well as a general purpose line driver or transceiver. Its integrated power stage offers the lowest ON resistance on the market. The L6364 is our newest IO-Link Device side solution, with highly integrated dual-channel transceiver with very advanced features like configurable power stages with a join-mode option for double current ratings, SPI with receive and transmit buffers, embedded power management circuits, automatic clock extraction, and more.