IEEE International Reliability Physics Symposium (IRPS)
Date: March 26-30, 2023 – in person conference, with a virtual event available online up to April 30, 2023
Where: Monterey, California, at the Hotel Hyatt Regency Monterey
Go to the IRPS website and register here
Prepare your visit: check out the schedule available here
For 60 years, the IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. The IRPS brings together scientists from all around the world, and seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic systems, through an improved understanding of the physics of failure and the application environment.
The IRPS will allow attendees to increase their knowledge and understanding of microelectronics reliability.
It also provides participants with an opportunity to meet with colleagues from around the world, and to grow their network.
STMicroelectronics joins the event as a bronze patron this year, presenting step forwards in microelectronics reliability with eight papers and four posters.
Follow us at IRPS, virtually or in person in Monterey!
|28 March||3:55||ORAL PRESENTATION - 4B.4 Circuit Reliability and Aging Integrated test circuit for off-state dynamic drain stress evaluation||Jocelyn Hai, |
|28 March||3:55||ORAL PRESENTATION - 4A.3 Emerging Memory Unveiling Retention Physics of Ge-rich GST ePCM memory cells||Luca Laurin, |
|28 March||3:55||ORAL PRESENTATION - 4C.2 Gate/MOL Dielectrics Location of Oxide Breakdown Events under Off-state TDDB in 28nm N-MOSFETs dedicated to RF applications||Mahamadou Tidjani |
|29 March||9:15||ORAL PRESENTATION - 5B.3 Process Integration Characterization and modeling of DCR and DCR drift variability in SPADs||Mathieu Sicre, |
|30 March||3:10||ORAL PRESENTATION - 11B.4 Metallization/BEOL Reliability Effect of frequency on reliability of high-K MIM capacitors||Xavier Federspiel, |
|29-30 March||6:00 - 9:00 PM||POSTER - FAILURE ANALYSIS Backside Failure Analysis of IGBT power devices assembled in STPAK||Elisa Vitanza, |
|29-30 March||6:00 - 9:00 PM||POSTER – Packaging and 2.5/3D Assembly New Innovative Reliability Solution for WLCSP Packages||Klodjan Bidaj, |
|29-30 March||6:00 - 9:00 PM||POSTER - Wide-Bandgap Semiconductors (SiC) Carrot-like crystalline defects on the 4H-SiC powerMOSFET yield and reliability||Santi Alessandrino, |
|29-30 March||6:00 - 9:00 PM||POSTER - Process Integration Insight into I/O device HCI stress methodology||Celestin Doyen, |
|29-30 March||1:45 - 4:00 PM||POSTER Evidence of Carbon Doping Effect on VTH Drift and Dynamic-RON of 100V p-GaN Gate AlGaN/GaN HEMTs||Marcello Cioni, |