STMicroelectronics News Release https://www.st.com/content/st_com/en/press-rss.html A Collection of STMicroelectronics News Release en Tue, 27 Oct 2020 10:00:00 +0100 <![CDATA[STMicroelectronics and Sanken Announce Strategic Partnership to Develop Intelligent Power Modules for High-Voltage Industrial and Automotive Products]]> \"\"STMicroelectronics (NYSE: STM),  a global semiconductor leader serving customers across the spectrum of electronics applications, and Sanken Electric Co., Ltd (TSE: 6707), a leader in innovative technology specializing in semiconductor devices, power modules, and sensors, have collaborated to unleash the performance and practical advantages of intelligent power modules (IPM) in high-voltage, high-power equipment designs. The two companies are developing and will jointly market 650V/50A and 1200V/10A industrial modules, which simplify design challenges and shrink the bill of materials for HVAC systems, industrial servo drives, industrial washing machines, and general-purpose inverters over 3 kW. The ST/Sanken IPM product roadmap will continue with 650V/50A automotive-grade modules for high-voltage compressors, pumps, and cooling fans. “With ST and Sanken contributing their strengths, we can bring these new high-voltage, high-power IPMs to industrial and automotive markets, ensuring superior performance, efficiency, and reliability,” said Masao Hoshino, Director and Head of Device Business Corporate Headquarters of Sanken. Marco Monti, President, Automotive and Discrete Group, STMicroelectronics, said, “These new devices extend our established STPOWER SLLIMM™ portfolio with a High-Power (HP) product line to address applications over 3 kW and introduce our first automotive-grade IPMs that permit sleeker designs and greater reliability.” IPMs let designers replace traditional power circuits built using discrete components with a compact, integrated device that simplifies circuit layout and PCB design. This helps accelerate time to market and improve cost-effectiveness and reliability. Leveraging easier manufacturing, faster assembly, and bill-of-materials savings, designers of high-voltage equipment can create new generations of power products that are space-saving, economical, energy-efficient, and robust. Engineering samples of the industrial IPMs will be available in March 2021 and production will begin soon afterwards. Samples of the automotive-grade devices will be available in second half of 2021. Further technical information: The new IPMs integrate a complete inverter stage including six short-circuit rugged IGBTs with freewheeling diodes, associated high-side and low-side gate drivers in a single package designed optimally for thermal efficiency. Ready to operate in hard switching up to 20 kHz, the modules also contain built-in features for protection and control. These include bootstrap diodes, short-circuit protection, under-voltage lockout protection for gate drivers, a 100 kΩ thermistor for temperature monitoring, and a comparator for fault protection. Additional benefits that simplify design for users and enhance safety and reliability include:
  • 3.3V/5V TTL/CMOS-compatible inputs with hysteresis
  • Shutdown input and Fault output
  • Separate open-emitter outputs
  • Very fast, soft-recovery diodes
  • Fully isolated package with isolation rating of 2500Vrms/min
About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. \"\"About Sanken Sanken Electric’s mission as a company is to provide optimal solutions in the broad and expansive field of electricity and electronics with semiconductors, our core business, power electronics and peripheral fields. We provide products globally for the increasingly electrified automotive industry, as well as for white goods and industrial equipment, which are becoming more energy efficient as demand for electricity increases. Sanken Electric works to constantly innovate its technological capabilities and provides products of assured quality to help solve global environmental and social issues and further develop industry, the economy and culture. Further information can be found at www.sanken-ele.co.jp/en/. For Press Information Contact: Michael Markowitz Director Technical Media Relations STMicroelectronics Tel: +1 781 591 0354 Email: michael.markowitz@st.com Akihiro Goto / Takuya Iwata Finance and Investor Relations Division Sanken Electric Co., Ltd. Tel: +81 48 472 1111]]>
https://newsroom.st.com/media-center/press-item.html/p4294.html Mon, 26 Oct 2020 07:55:58 +0100
<![CDATA[STMicroelectronics Reports 2020 Third Quarter Financial Results]]> here.]]> https://newsroom.st.com/media-center/press-item.html/c2972.html Thu, 22 Oct 2020 06:02:10 +0200 <![CDATA[First Multi-Zone Time-of-Flight Sensor Headlines STMicroelectronics Technology Powering Samsung Flagship Galaxy Note20 Ultra Phones]]> STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, revealed that the newly unveiled Samsung Galaxy Note20 Ultra uses top-notch ST sensing and control technology, enhancing the smartphones’ high-end features while squeezing every watt from the power budget with minimal noise and package size. The Galaxy Note20 similarly leverages ST’s MEMS pressure sensors, inertial measurement units, and EEPROMs. With camera performance and user experience becoming more and more important in consumers’ choice of their personal communication devices, the Galaxy Note20 Ultra, and the Galaxy Note20, have placed strong emphasis on capturing images and video in stunning sharpness and detail. Samsung’s accent on managing performance and power efficiency led them to select ST’s newest low-power 6-axis MEMS Inertial Measurement Unit (IMU) and EEPROM with outstanding low-power performance. An ST MEMS barometric pressure sensor measures the atmospheric pressure as well as the user altitude and can enable precise fitness tracking and many other applications where vertical detection is important. In addition, to provide ultra-fast and accurate focusing for complex scenes where enhanced camera performance is required, Samsung added ST’s groundbreaking FlightSenseTM Time-of-Flight sensor, the world’s first, multi-zone all-in-one module, to the Note20 Ultra. Another key feature, the S Pen stylus in the Note 20 series embeds an ST 6-axis IMU for quick gesture detection and interpretation. The ultra-low-power ST device includes ST’s unique Machine Learning logic to simplify the analysis of the gesture interpretation for almost latency free responsiveness and precision. Enabling these new features through their low-noise, low-power design, ST’s IMU and pressure sensor also efficiently perform standard Android OS features. These include detecting device orientation, steps, tilt, motion, and air pressure.  “Samsung’s commitment to low power and high performance, evident in its Galaxy Note20 and Galaxy Note20 Ultra, contributes to pushing us to maximize performance and power efficiency in all of our products,” said Marco Cassis, President, Sales, Marketing, Communications and Strategy Development, STMicroelectronics. “Our broad portfolio of sensors, along with EEPROM memory, power, and other devices, offers an outstanding range of options to best optimize performance and power.” About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. 1MEMS = Micro-Electro-Mechanical Systems微机电系统 2EEPROM = Electrically Erasable Programmable Read-Only Memory带电可擦可编程只读存储器 For Press Information Contact: Michael Markowitz Director Technical Media Relations STMicroelectronics Tel: +1 781 591 0354 Email: michael.markowitz@st.com]]> https://newsroom.st.com/media-center/press-item.html/t4281.html Wed, 21 Oct 2020 13:56:14 +0200 <![CDATA[STMicroelectronics Eases Access to STM32WB Dual-Core Wireless MCUs for Bluetooth® LE 5.0, Zigbee® 3.0, and Thread Connectivity]]> \"\"STMicroelectronics has expanded the STM32WB portfolio of dual-core multi-protocol microcontrollers (MCUs) by introducing the STM32WB35 and STM32WB30 Value Line, giving designers more flexibility to target cost-conscious market opportunities. The extremely low-power MCUs integrate a 2.4GHz radio managed by a dedicated Arm® Cortex®-M0+ core, with a 64MHz Arm® Cortex-M4 for the main application, to permit uninterrupted real-time performance. They support Bluetooth® Low Energy 5.0, Zigbee® 3.0, OpenThread (IEEE 802.15.4) protocols and concurrent modes, with built-in security features. All stacks are fully certified, supported and handled by ST and available free of charge. The new devices are suited to large-scale IoT applications such as fleet and resource management, as well as asset monitoring and tracking. Packaged in QFN48, the new devices are pin compatible with existing STM32WB5x devices and share common MCU features, giving users flexibility to easily scale and migrate their designs. The MCUs integrate the radio balun, USB2.0 Full Speed device with crystal-less oscillator, embedded capacitors for 32MHz crystal, and DC/DC step-down converter to minimize Bill of Materials (BoM) and platform footprint. Outstanding RF performance, with programmable output power up to +6dBm and with a 102dBm link budget, ensures reliable connectivity over longer distances, while ultra-low power consumption extends battery runtime. All STM32WB products are supported in the market-proven STM32Cube ecosystem, an exhaustive software development suite offering a combination of embedded software libraries and software tools addressing all the needs of a complete project development cycle, thus ensuring a consistent user experience across the whole portfolio. The STM32WB35 and STM32WB30 Value Line devices are available with up to 512 KBytes of integrated Flash memory and up to of 96 KBytes of SRAM, with a Quad-SPI interface for connecting to external high-speed memory. They also provide a rich selection of analog peripherals, digital interfaces, and fast I/Os, many of which are 5V tolerant. With a focus on security, the STM32WB MCUs integrate Secure firmware installation (SFI), hardware encryption for the application and radio stacks, hardware public key authority (PKA), hardware accelerators for state-of-the-art cryptographic algorithms, and support for secure Over-The-Air (OTA) firmware updates. The STM32WB35 and STM32WB30 Value line are in production now, in QFN48 package. Prices start from $1.57 for the STM32WB30CEU5A for orders in volume. For more information please go to www.st.com/stm32wb * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]> https://newsroom.st.com/media-center/press-item.html/n4288.html Tue, 20 Oct 2020 13:55:56 +0200 <![CDATA[STMicroelectronics Unveils Features of Multi-Application, Deterministic Automotive Microcontrollers to Maximize Safety and Security in Next-Generation Domain/Zone Architectures]]> \"\"STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed further details of its innovative Stellar automotive microcontrollers (MCUs) to show how the devices ensure reliable and deterministic execution of multiple independent real-time applications. This is one of the toughest challenges facing manufacturers in today’s automotive sector as the complexity of new car architectures leads to the consolidation of independent applications into a single powerful Integration MCU and typically involves choosing either determinism or virtualization. Stellar delivers both. Pioneering this new class of controllers, Stellar Integration MCUs are designed with exceptional computing power to significantly simplify the concurrent and deterministic execution of multiple-sourced software while guaranteeing the highest levels of safety and performance. These capabilities meet system requirements in the electrics/electronics (E/E) architecture of the next generation of connected cars. To do this, Stellar introduces features that include a state-of-the-art processor with hardware support for virtualization, quality of service settings, the ability to firewall peripherals, and perform resource separation at interconnect levels. These features allow independent applications, or Virtual ECUs, to coexist in the same physical MCU by guaranteeing freedom from interference and secure compartmentalization of software functions while supporting concurrent multiple ASIL safety levels. ST has developed this new technology with Bosch, the well-known tier-one automotive electronic module supplier, to meet future OEM integration demands.  We have set up Stellar’s functionality to cover integration challenges, while maintaining isolation and compartmentalization,” said Axel Aue, Vice President, Bosch. “The computing performance for this kind of system is outstanding, with Phase Change Memory performance equal to, or surpassing, that of alternative Flash technologies. Moreover, Stellar’s performance concerning Firmware Updates Over-the-Air (FOTA) has been flawless with zero down time and zero recovery time.” “We designed Stellar to meet the demands of future Domain/Zone architectures and service-oriented communication needs, setting aggressive real-time performance, safety, and determinism goals,” said Luca Rodeschini, Strategy & Automotive Processors and RF Division General Manager, STMicroelectronics. “The setup, evaluations and validations performed by Bosch now provide expert confirmation, showing that our teams’ integration of outstanding real-time performance, embedded PCM non-volatile memory, and comprehensive virtualization ensure efficient software isolation and compartmentalization that will add to consumers’ safety and convenience in their vehicles.” Stellar embeds multiple Arm® Cortex®-R52 cores — some operating in lockstep and some in Split/Lock – and features a 2-level Memory Protection Unit and a low-latency Generic Interrupt Controller. The MCU is suited to hard real-time applications up to the highest safety integrity level, ASIL-D, specified in the automotive functional-safety standard, ISO 26262. There are also multiple powerful accelerators for secure data routing, processing, and mathematical functions, with advanced security support and extensive communication command and control. The Integration MCU offers a comprehensive virtualization at multiple levels using a Virtual Machine ID (VMID) at the network-on-chip and memory levels. Firewalls ensure complete separation at all interconnect levels including the peripherals. These firewalls allow Stellar to manage Virtual Machines (VMs) accesses and privileges to peripherals, ensuring the isolation of entire mission-critical functions. At the same time, Stellar manages increasing software complexity and integration with better utilization of its hardware resources. This reduces total overhead of multiple separate ECUs performing their own housekeeping and managing communication-stack-related latency. In fact, Stellar can support several real-time operating systems (OSes) running independently, without interference. These OSes can separately manage applications with different functional-safety levels and superior processing capabilities for encrypted communication over Ethernet or CAN buses with dedicated AES accelerators to offload the main Hardware Security Modules (HSM) for MACSec, IPSec, and CAN authentication. Stellar Integration MCUs feature non-volatile Phase-Change Memory (PCM), offering fast read access times, and single-bit alterability that is not available in Flash memory. PCM ensures Over-The-Air (OTA) updates with zero down time, even for full-sized memory updates. In addition to increasing flexibility and erase/write cycles, single-bit alterability at runtime (no erase required) extends safety setup by refreshing bits to eliminate single-bit failures and extend the memory’s lifetime. ST’s embedded-PCM technology has been developed and tested to operate within the most stringent automotive requirements for robust high-temperature operation, radiation hardening, cycling and data retention. ePCM achieves automotive requirements for AEC-Q100 Grade 0 with an operating temperature up to +165°C. To date, ST has delivered more than 3000 samples to customers and samples have been running in vehicles for about a year. For additional information, please contact ST sales.  About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. For Press Information Contact: Michael Markowitz Director Technical Media Relations STMicroelectronics Tel: +1 781 591 0354 Email: michael.markowitz@st.com 1Controller Area Network 2Advanced Encryption Standard 3Media Access Controller (MAC) Security 4Internet Protocol Security]]> https://newsroom.st.com/media-center/press-item.html/p4269.html Tue, 20 Oct 2020 12:55:01 +0200 <![CDATA[STMicroelectronics Acquires Power Amplifier and RF Front-End-Module Specialist SOMOS Semiconductor]]> STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the acquisition and integration of the assets of SOMOS Semiconductor (“SOMOS”). SOMOS, based in Marly-le-Roy (France), is a fabless semiconductor company founded in 2018, and specialized in silicon-based power amplifiers and in RF Front-End Modules (FEM) products. With this acquisition, ST reinforces its specialist staff, IP and roadmaps of Front-End Modules for the IoT and 5G markets. A first product – an NB-IoT / CAT-M1 module – is already undergoing qualification and will be the inception of a new roadmap of connectivity RF FEM products. SOMOS technology and assets will also support the development of ST’s existing roadmap of RF Front-End Modules for the 5G infrastructure market. Consumers and Industry expect more and better connectivity solutions. At ST we are committed to offering and enabling solutions to address these needs and challenges. Cellular IoT and 5G infrastructure technologies are key in that perspective. With this acquisition, we reinforce our ambition to play a major role in RF FEM for a buoyant connectivity IoT market and we strengthen our roadmap of RF Front-End for the 5G markets,” said Claude Dardanne, President, Microcontrollers and Digital ICs Group, at STMicroelectronics. “With the recent acquisition of BeSpoon for UWB technology and Riot Micro for NB-IoT modems, ST now offers its customers complete connectivity solutions leveraging the market-leading STM32 solutions and ecosystem.” The terms of the transaction were not disclosed. About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com.   For further information, please contact: INVESTOR RELATIONS: Céline Berthier Group VP, Investor Relations Tel: +41.22.929.58.12 celine.berthier@st.com MEDIA RELATIONS: Alexis Breton Corporate External Communications Tel: + 33 6 59 16 79 08 alexis.breton@st.com]]> https://newsroom.st.com/media-center/press-item.html/c2971.html Thu, 15 Oct 2020 16:01:53 +0200 <![CDATA[STMicroelectronics Eases Simple GUI Design for Ultra-Low-Cost Devices with TouchGFX Updates and New STM32 Nucleo Shield]]> \"\"STMicroelectronics is pioneering the HMI of things with a new STM32* Nucleo display shield that leverages the affordability of STM32G0 microcontrollers (MCUs). The new X-NUCLEO- GFX01M1 SPI shield is supported in the latest TouchGFX software, version 4.15.0, which introduces additional new features including support for low-cost non-memory-mapped SPI Flash ICs. Designing with STM32G0 and TouchGFX lets developers target a bill of materials as low as $5 to add a small graphical display to any project. Simple devices such as timers, controllers, and home appliances can thus offer a smartphone-like user experience. The new X-Nucleo-GFX01M1 shield is supported by a new X-cube-display package that offers simple “hello world” example. The shield contains a 2.2-inch QVGA (320x240) SPI display, 64-Mbit SPI NOR Flash, and a joystick and is ready to use with various STM32 MCU development boards such as the NUCLEO-G071RB. The STM32G071RB is a mainstream Arm® Cortex®-M0+ MCU that integrates up to 128kBytes Flash, 36kBytes SRAM, extensive communication interfaces, analog peripherals, fast I/Os, hardware security ID, and a USB Type-C™ Power Delivery controller. The latest TouchGFX software builds on the TouchGFX Engine’s partial framebuffer, which can reduce the GUI RAM footprint by up to 90% and allow a simple user interface in as little as 16-20KB of internal MCU RAM. A new rendering algorithm enhances GUI performance by realizing partial screen updates in an optimized order to allow extra updates and avoid visually distracting tearing effects. Also new, support for non-memory-mapped SPI Flash allows more complex GUIs to use low-cost off-chip storage for memory-hungry graphics assets such as images and fonts. To ease user-interface prototyping, an optimized application template for the STM32G071 Nucleo board and display kit is available in TouchGFX Designer. It is also possible to introduce an RTOS to the setup if required and use TouchGFX Generator to change to other hardware. All elements are available now, including the X-cube-display package and TouchGFX 4.15.0 with code examples for running the G071RB. The X-NUCLEO- GFX01M1 and STM32G0 products are in mass production and available through the normal ST distribution channels. In addition, a new graph widget simplifies showing sequential data using lines, bars, area plots, histograms, or combined visualizations. The widget works smoothly with any STM32 MCU and developers can customize aspects such as colors and layout using TouchGFX Designer. Also new in TouchGFX 4.15.0, full out-of-the-box support for the STM32H725 lets developers run microprocessor-class graphics on ST’s Cortex-M7 MCUs. With 550MHz core frequency, ST’s Chrom-ART Accelerator™ for faster graphics performance, an Octal-SPI interface for high-speed connections to external Flash and RAM, and an XGA TFT-LCD controller, the STM32H725 is the new graphics flagship for the STM32 family. TouchGFX Designer contains sample source code and a demonstration video is available here. For more information and to download TouchGFX free of charge, please visit http://www.st.com/x-cube-touchgfx. You can also read our blogpost at https://blog.st.com/x-nucleo-gfx01m1/   * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]> https://newsroom.st.com/media-center/press-item.html/n4292.html Mon, 12 Oct 2020 13:56:46 +0200 <![CDATA[STMicroelectronics Introduces Bluetooth® 5.2-Certified SoC, Extending Range, Throughput, Reliability and Security]]> \"\"STMicroelectronics has revealed its latest BlueNRG-LP Bluetooth® LE System-on-Chip (SoC), which leverages the latest Bluetooth features to increase communication range, raise throughput, strengthen security, and save power. The ultra-low-power radio is optimized to consume as little as 3.4mA in receive mode, just 4.3mA when transmitting, and less than 500nA quietly waiting for wake-up events, cutting by half the size of battery needed in most applications and prolonging runtime. BlueNRG-LP, the 3rd-generation Bluetooth SoC from ST, is the world’s first Bluetooth LE 5.2-certified SoC to support concurrent connections up to 128 nodes, enabling seamless low-latency control and monitoring large numbers of connected devices, for instance from a stylish and intuitive smartphone app. Combined with high RF-output power, which is programmable up to +8dBm, and excellent RF sensitivity up to -104dBm, the BlueNRG-LP radio SoC can now natively cover a much larger area in beacons, smart lighting, gaming, building automation, industrial and tracking applications. Furthermore, the communication range can be extended without limit by seamlessly adding Bluetooth LE Mesh, now fully certified and available as part of the comprehensive BlueNRG software and hardware ecosystem. In addition, BlueNRG-LP supports Bluetooth Long Range mode, which uses coded physical layers (Coded PHY) with Forward Error Connection (FEC) to extend radio-communication range up to hundreds of meters and increase reliability, as well as GATT (generic attribute) caching to connect quickly and efficiently. BlueNRG-LP comes with ST’s third-generation Bluetooth Low Energy protocol stack certified to Core Specification 5.2 and designed to match its ultra-low-power architecture. The stack is provided as a free-of-charge and compiler-independent linkable library supported by multiple Integrated Development Environments (IDEs) and is optimized for small footprint, modularity, low latency, interoperability, and lifetime over-the-air upgradability. It supports features such as extended advertising and scanning, high-duty-cycle non-connectable advertising, extended packet length, and 2Mbit/s throughput. In addition BlueNRG-LP supports L2CAP Connection-Oriented Channel (CoC), which eases large bidirectional data transfers, multi-role simultaneous connectivity, and Channel Selection Algorithm #2 (CSA #2), which permits robust connections in noisy environments such as home, building, or industrial networks. Enhanced security mechanisms included in the integrated Arm® Cortex®-M0+ microcontroller (MCU) comprise a secure bootloader, readout protection for the entire 256KB embedded flash, a 48-bit unique ID, as well as customer key storage, true Random-Number Generator (RNG), hardware public-key accelerator (PKA), and a 128-bit AES cryptographic co-processor. The highly efficient processing unit executes code at up to 64MHz, consuming an amazingly tiny 18µA/MHz, and features industry-standard digital interfaces, multi-channel 12-bit ADC, an analog microphone interface with programmable gain amplifier, user and system timers and watchdog, and up to 31 5V-tolerant user-programmable I/O pins. The BlueNRG-LP SoC also integrates an embedded RF balun, DC/DC converter, and capacitors for the HSE (High-Speed External) oscillator and internal low-speed ring oscillator, minimizing bill-of-materials (BOM) costs and simplifying circuit design. BlueNRG-LP is available in a choice of 5mm x 5mm QFN32, 6mm x 6mm QFN48, and a miniature 3.14mm x 3.14mm WLCSP49 wafer-level package. With 32KB or 64KB RAM and a choice of temperature range up to 85°C or 105°C, designers get extra flexibility to choose a configuration that best meets their needs. The devices are covered by ST’s 10-year industrial longevity commitment, assuring users of long-term parts availability. BlueNRG-LP SoCs are in production now, in QFN48, priced from below $1.00 for volume orders. Please visit www.st.com/bluenrg-lp-pr for more information. You can also read our blogpost at https://blog.st.com/bluenrg-lp/]]> https://newsroom.st.com/media-center/press-item.html/n4290.html Wed, 7 Oct 2020 14:25:25 +0200 <![CDATA[STMicroelectronics Launches LaSAR, an Ecosystem to Accelerate Development of Augmented-Reality Eyewear Applications]]> \"\"STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announces the launch of the LaSAR Alliance (Laser Scanning for Augmented Reality), an ecosystem of leading technology developers, suppliers and manufacturers collaborating to develop and accelerate Augmented Reality (AR) smart-glass solutions. Founding members in the LaSAR Alliance include Applied Materials, Dispelix, Mega1, and Osram, in addition to ST. The Alliance is focused on meeting the technical challenges required for all-day wearable smart glasses. The eyewear will balance a small, light-weight form factor and extremely low-power operation with good FoV (Field-of-View) and a large eyebox. The founding members coalesced around the recognition that near-to-eye displays based on ST-developed Laser Beam Scanning (LBS) solutions have demonstrated the potential to meet all these requirements. The LaSAR Alliance brings together all the foundational elements -- a MEMS micro-mirror platform and BCD expertise from ST, compact illumination sources from Osram, advanced waveguide elements from Applied Materials and Dispelix, and the overall integration of these devices into a small optical light engine from Mega1. These elements can be assembled into AR-enabled smart glasses that are stylish, functional, comfortable and deliver critical application-specific information. The Alliance’s mission is to facilitate the development, availability, and support of all key technology elements for rapid AR-enabled smart-glass application creation, adoption, and volume production. “With its leadership developing and delivering in volume a high-performance, low-power, laser-beam scanning MEMS micro-mirror solution that combines MEMS mirrors, MEMS driver, laser driver, and control software, ST recognized the value of its technology to Augmented Reality and especially to Smart Glasses and Eyewear,” said Anton Hofmeister, Vice President and General Manager MEMS Microactuator Division, STMicroelectronics. “In working with Applied Materials, Dispelix, Osram, and Mega1 to bring their critical expertise to establish LaSAR, we see a powerful alliance of exceptional technical strength that aims to accelerate the adoption of Augmented Reality in comfortable Smart Glass eyewear through foundational developments.” “One of the most critical requirements needed to support widespread growth of the AR industry is the ability to manufacture high-quality, high-performance, affordable waveguides,” said Wayne McMillan, General Manager of Applied Materials’ Engineered Optics™ program. “Applied Materials is answering this need with our decades-long leadership in materials engineering and expertise in precision manufacturing at an industrial scale. We are excited to work with the LaSAR Alliance and others in the industry to accelerate the availability of all-day-wear smart glasses for AR applications.” “Dispelix is delighted to join the LaSAR Alliance. We\'re combining our world-leading waveguide technology with advanced technologies from the alliance partners to make it easier for our customers to integrate a complete display solution for advanced all-day wearables. Our innovations will set a new benchmark for what is already the thinnest and lightest waveguide technology in the industry – without sacrificing image quality,” said Juuso Olkkonen, Dispelix CTO and co-founder. “Miniaturized modular integration and automated volume production play pivotal roles in the ultimate success of the next generation AR wearable. Mega1’s LBS solution integrates all critical modules into 1.2cc in 3g light-weight optical engine. With aligned mission of LaSAR, Mega1 facilitates its strength to manufacture for volume production. We believe true AR adoption will come to realization soon with this powerful Alliance,” said CTO & COO, Makoto Masuda, Mega1. “We constantly work to miniaturize and optimize our RGB (Red, Green, Blue) laser portfolio because we know size and power are critical parameters for our AR customers,” explains Jörg Strauss, General Manager and Vice President of Visualization & Laser at Osram Opto Semiconductors. “Being a founding member of LaSAR enables us to contribute to the alliance’s technical strength that will help resolve the system challenges of LBS adoption in all-day-wear AR eyewear.” About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. For Press Information Contact: Michael Markowitz Director Technical Media Relations STMicroelectronics Tel: +1 781 591 0354 Email: michael.markowitz@st.com]]> https://newsroom.st.com/media-center/press-item.html/t4297.html Wed, 7 Oct 2020 13:52:22 +0200 <![CDATA[STMicroelectronics Announces Third Quarter 2020 Preliminary Revenues and Timing for Third Quarter 2020 Earnings Release and Conference Call]]> STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today that its preliminary and unaudited net revenues for the third quarter ended September 26, 2020 are above the business outlook range provided in the Company’s news release dated July 23, 2020. Preliminary Q320 net revenues are $2.67 billion, up 27.8% sequentially and 690 basis points above the high end of the range. The prior outlook was for Q320 net revenues to be $2.45 billion, an increase of 17.4% sequentially, plus or minus 350 basis points. “We ended Q320 with net revenues above the outlook range due to significantly better than expected market conditions throughout the quarter. Sharp acceleration in demand of Automotive products and Microcontrollers, as well as our engaged customer programs in Personal Electronics, were the main factors that contributed to this result. We now plan for our FY20 revenues to be above $9.65B. I look forward to providing additional details on the third quarter, and on our fourth quarter guidance, during our earnings call on October 22,” said Jean-Marc Chery, STMicroelectronics’ President & CEO. The Company will release third quarter 2020 earnings before the opening of trading on the European Stock Exchanges on Thursday October 22, 2020. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its third quarter 2020 financial results and current business outlook on October 22, 2020 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, http://investors.st.com, and will be available for replay until November 6, 2020. About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com.   For further information, please contact: INVESTOR RELATIONS: Céline Berthier Group VP, Investor Relations Tel: +41.22.929.58.12 celine.berthier@st.com MEDIA RELATIONS: Alexis Breton Corporate External Communications Tel: + 33 6 59 16 79 08 alexis.breton@st.com]]> https://newsroom.st.com/media-center/press-item.html/c2970.html Thu, 1 Oct 2020 06:00:06 +0200 <![CDATA[STMicroelectronics Pioneers Smaller and Faster Chargers and Power Supplies with World’s First Driver and GaN Device]]> \"\" STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled MasterGaN®, the world-first platform embedding a half-bridge driver based on silicon technology along with a pair of  gallium-nitride (GaN) transistors. The combination will accelerate the creation of next-generation compact and efficient chargers and power adapters for consumer and industrial applications up to 400W. GaN technology enables these devices to handle more power even as they become smaller, more lightweight, and more energy efficient. These improvements will make a difference for smartphone ultra-fast chargers and wireless chargers, USB-PD compact adapters for PCs and gaming, as well as in industrial applications like solar-energy storage systems, uninterruptible power supplies, or high-end OLED TVs and server cloud. Today’s GaN market is typically served by discrete power transistors and driver ICs that require designers to learn how to make them work together for best performance. ST’s MasterGaN approach bypasses that challenge, resulting in faster time to market and assured performance, together with a smaller footprint, simplified assembly, and increased reliability with fewer components. With GaN technology and the advantages of ST’s integrated products, chargers and adapters can cut 80% of the size and 70% of the weight of ordinary silicon-based solutions. “ST’s market-unique MasterGaN platform builds on our proven expertise and power-design skills to combine high-voltage smart-power BCD process with GaN technology, to accelerate the creation of space-saving and power-efficient products that are kinder to the environment,”said Matteo Lo Presti, Executive VP and General Manager Analog Sub-Group, STMicroelectronics. ST is launching the new platform with MasterGaN1, which contains two GaN power transistors connected as a half bridge with integrated high-side and low-side drivers. MasterGaN1 is in production now, in a 9mm x 9mm GQFN package only 1mm high. Priced at $7 for orders of 1,000 units, it is available from distributors. An evaluation board is also available to help jump-start customers’ power projects.  Further technical information: The MasterGaN platform leverages STDRIVE 600V gate drivers and GaN High-Electron-Mobility Transistors (HEMT). The 9mm x 9mm low-profile GQFN package ensures high power density and is designed for high-voltage applications with over 2mm creepage distance between high-voltage and low-voltage pads. The family of devices will span different GaN-transistor sizes (RDS(ON)) and will be offered as pin-compatible half-bridge products that let engineers scale successful designs with minimal hardware changes. Leveraging the low turn-on losses and absence of body-diode recovery that characterize GaN transistors, the products offer superior efficiency and overall performance enhancement in high-end, high-efficiency topologies such as flyback or forward with active clamp, resonant, bridgeless totem pole PFC (power factor corrector) and other soft- and hard-switching topologies used in AC/DC and DC/DC converters and DC/AC inverters. The MasterGaN1 contains two normally-off transistors that feature closely matched timing parameters, 10A maximum current rating, and 150mΩ on-resistance (RDS(ON)). The logic inputs are compatible with signals from 3.3V to 15V. Comprehensive protection features are also built in, including low-side and high-side UVLO protection, interlocking, a dedicated shutdown pin, and over-temperature protection. For more information please go to www.st.com/mastergan1-pr You can also read our blogpost at https://blog.st.com/mastergan1/ About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. For Press Information Contact: Michael Markowitz Director Technical Media Relations STMicroelectronics Tel: +1 781 591 0354 Email: michael.markowitz@st.com]]> https://newsroom.st.com/media-center/press-item.html/p4287.html Wed, 30 Sep 2020 13:58:20 +0200 <![CDATA[STMicroelectronics Raises Performance and Value for Smart, Connected Devices with Even Faster STM32H7 Microcontrollers]]> \"\"STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed record-breaking STM32* microcontrollers (MCUs) with embedded Flash that bring high-end features such as rich graphics, AI, and state-of-the-art cyber-protection to cost-sensitive new products. The new STM32H7 MCUs build on the Arm® Cortex®-M7 core and operate at 550 MHz, the fastest core speed in the market among MCUs that integrate Flash storage on-chip to run deeply embedded applications. These single-core devices, which are available with up to 1 Mbyte of Flash, deliver increased performance with affordability for cost-conscious applications. At the same time, the devices can interact with off-chip storage while ensuring full execution performance and security. Their benchmark performance figures of 2778 CoreMark®1 and 1177 DMIPS are realized whether working from internal or external memory, aided by features such as the Flexible Memory Controller (FMC) and Octal SPI memory interface. This lets designers tackle memory-hungry applications, such as high-resolution, full-color graphics and video that demand a large frame buffer, to create new products that deliver more sophisticated and immersive user experiences. Further assisting the creation of full-color user interfaces, the TouchGFX graphic framework STM32Cube Expansion Package (X-CUBE-TOUCHGFX) and TouchGFX Designer programming tool are available free of charge. Advanced features powered by AI technology can be developed thanks to STM32Cube ecosystem and STM32Cube.AI (X-CUBE-AI) to port neural networks and leverage computer vision through the parallel camera interface. By connecting the STM32H7 to one or multiple sensors, condition monitoring and other machine learning techniques will also help bringing added value to the STM32-based product. As part of the STM32Trust security suite, cyber-protection is enhanced with support for on-the-fly decryption (OTFDEC) and secure firmware install (SFI). OTFDEC enables encrypted code to be executed from external memory. SFI lets OEMs order standard products anywhere in the world, to be programmed only with encrypted code. These two solutions effectively safeguard OEM intellectual property in Flash memory. Out-of-the-box security features include support for secure boot, symmetric (by hardware or software library) encryption, and cryptographic key provisioning. Asymmetric encryption (by software library) is also available. Cryptographic processing is handled with a true random number generator, hardware acceleration for AES-128, AES-192 and AES-256 encryption, and support for GCM and CCM2, Triple DES, and hash (MD5, SHA-1 and SHA-2) algorithms. “Our latest STM32H7 MCUs enable small, low-power products to deliver extraordinary functionality and performance, while leveraging the outstanding value and efficiency of the STM32 family,” said Ricardo de Sa Earp, Group Vice President, Microcontroller Division General Manager, STMicroelectronics. “Home appliances, small medical devices, and industrial sensors and actuators that might previously have been unable to incorporate computationally intensive features such as AI, graphics, and voice interaction now have an appropriate solution.” Several key features deliver important advantages in industrial applications, including an integrated switched-mode power supply (SMPS) that overcomes dissipation constraints to allow extended-temperature operation up to 125°C. In addition, fault-resilience is provided through error correction (ECC) for all memories. ST has updated the STM32 development ecosystem to let users get started quickly with the new devices. Flexible prototyping and demonstrations can leverage the STM32H735G-DK Discovery kit, while the NUCLEO-H723ZG Nucleo-144 board provides an affordable option for quickly building prototypes and proof-of-concept models. The latest STM32H7 MCUs are also supported in the STM32Cube ecosystem, which comprises tools, embedded software, and middleware including graphics libraries, communication stacks, and application-code examples such as motor control, AI, and advanced security. The MCUs’ capabilities can also be exercised using appropriate software tools for application and security development published by Arm® Keil and IAR Systems. Haydn Povey, General Manager Embedded Security Solutions, IAR Systems, commented: “ST’s latest STM32H7 MCUs deliver game-changing value, performance and security enhancements. The security features, including enhanced cryptographic accelerators, advanced off-chip memory protection, and secure key provisioning are all critical capabilities in achieving legislative requirements, including the recent EN303645 standard. We expect IAR Embedded Workbench, coupled with C-Trust for security, to be the IDE of choice for engineers to realize their full potential in next-generation designs.” The new STM32H7 devices introduced are the STM32H723/733, STM32H725/735, and STM32H730 Value-Line MCUs, which are available in various package options. Prices start from $2.83 for the STM32H730VBT6, for orders of 10,000 pieces. * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.    Further technical information: Each of the new devices is based on the Arm Cortex-M7 core running at the record-breaking frequency of 550 MHz and features single-core architecture to deliver cost-effective advanced performance. Further features that let designers maximize performance, energy efficiency, and flexibility in diverse applications include:
  • 32 Kbytes I-cache and D-cache sizes
  • Tightly coupled instruction RAM (ITCRAM) with remapping for zero latency in time-critical routines
  • ST’s proven FMAC (filtering) and Cordic (trigonometric) blocks for mathematical acceleration
  • Crypto algorithms supported
  • Advanced analog peripherals including two 16-bit ADCs and one 12-bit ADC in the low-power domain
  • Interfaces to popular industrial connectivity standards, including three FD-CAN ports, Ethernet, and Parallel Synchronous Slave Interface (PSSI)
  • ST’s Chrom-ART Accelerator™ for superior graphics performance
You can also read our blogpost at https://blog.st.com/stm32h723-stm32h733-stm32h725-stm32h735-stm32h730 About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. For Press Information Contact: Michael Markowitz Director Technical Media Relations STMicroelectronics Tel: +1 781 591 0354 Email: michael.markowitz@st.com 1CoreMark: Comparative score calculated after analysis by the EEMBC® (Embedded Microprocessor Benchmark Consortium) Certification Lab. 2Counter modes for cryptography with block ciphers]]>
https://newsroom.st.com/media-center/press-item.html/p4285.html Tue, 29 Sep 2020 13:57:09 +0200
<![CDATA[STMicroelectronics Simplifies Sensor Connections with Flexible, Configurable Dual IO-Link and SIO Transceiver]]> \"\"STMicroelectronics is bringing extra flexibility to IO-Link connections with the L6364 transceiver, which features dual communication channels that allow configurable output doubling for extra drive strength, in addition to a DC/DC converter and dual-mode UART. The L6364 supports IO-Link at COM2 (38.4 kbaud) and COM3 (230.4 kbaud) modes, as well as standard Single-Input/Output (SIO) communication. The dual outputs, comprising an IO-Link CQ pin and standard DIO pin, each have surge-pulse and reverse-polarity protection. The maximum drive strength is programmable up to 250mA and the two channels can be paralleled to supply up to 500mA. An SPI port connects the L6364 to the host microcontroller (MCU), with an additional interrupt pin for diagnostic reporting. Sensor data can be exchanged with the MCU through the UART or by using single-byte or multi-byte (SPI) modes. The integrated UART, which supports IO-Link message sequencing (M-Sequencing), can be programmed to operate in IO-Link or standard Single-Input/Output (SIO) mode and allows unlimited M-Sequence size in single-octet IO-Link. An internal data buffer supports up to 15 octets. In normal operation the L6364 is configured by the MCU via the SPI interface at start-up. It starts operating in SIO-device mode, driving the output lines as configured by the MCU. If the device is connected to an IO-Link master, the master can initiate IO-Link communication by a wake-up request. The highly integrated transceiver contains a DC/DC buck converter with programmable output voltage. There are also 3.3V and 5V low-dropout regulators (LDOs) with 50mA output current. The LDOs can be powered from the external supply voltage, or from the DC/DC converter, and are connected to external pins to supply the MCU and sensors. The design of the L6364 emphasizes flexibility and ease of use, including a wide operating-voltage range from 5V to 35V. There are also flexible protection features, with configurable thresholds for thermal-shutdown, UVLO (Under-Voltage Lock Out), and under-voltage, overvoltage, and overload detection. Short circuit, and ground and Vcc disconnection, are also provided. In addition, the transceiver reports extended diagnostics to the MCU through the Interrupt pin, including wake-up recognition, short-circuit, under-voltage, and 7-bit calibrated temperature-sensor reading that indicates when the programmed threshold has been exceeded. The L6364 is in production now and available in a 4mm x 4mm QFN-20L for $2.26 in quantities of 1000 units. A 2.5mm x 2.5mm 19-bump wafer-level chip-scale package will be available by the end of 2020. For more information please go to www.st.com/l6364-pr The L6364 IO Link transceiver, alongside many other factory-automation products and solutions including industrial sensors and motor-control ICs, will be on display in ST’s online showroom at SPS Italia 2020 (September 28-30). For more information, please go to https://www.st.com/content/st_com/en/about/events/events.html/sps-italia-2020.html]]> https://newsroom.st.com/media-center/press-item.html/n4296.html Mon, 28 Sep 2020 13:58:12 +0200 <![CDATA[STMicroelectronics Releases KNX-RF Software for Power-Conscious Building Automation]]> \"\"STMicroelectronics has released KNX software for the S2-LP ultra-low-power radio transceiver to enable energy-saving standardized wireless connectivity for smart-building controls. Ready to run on an STM32* microcontroller (MCU) or alternatively on a BlueNRG-2 Bluetooth® Low Energy System-on-Chip (SoC) that embeds an Arm® Cortex®-M0 core running at 32MHz and a comprehensive set of I/O peripherals, the software contains a certified KNX-RF stack, RF adaptation layer, and S2-LP library needed to connect the transceiver to create an ultra-low-power wireless KNX node. Operating in the 868.3MHz band at only 10mA with +10dBm output, the S2-LP delivers market-leading energy efficient, secure and robust wireless connectivity prolonging battery run-time and reducing the overall cost of the solution. Combining the S2-LP radio and BlueNRG-2 SoC enables a unique hybrid and low-power optimized KNX/Bluetooth solution in two chips, allowing a smartphone to access KNX-based networks and provide an intuitive and stylish interface for conveniently monitoring, controlling, configuring, provisioning, and updating the KNX nodes. Whether hosted on the BlueNRG-2 or STM32 MCU, ST’s KNX-RF software enables innovation and power savings for push-buttons, light switches, occupancy sensors, roller-shutter controls, dimmer actuators, and other devices for lighting, heating, HVAC, and energy-harvesting systems. The software meets the latest KNX-RF Multi specification, which supports secure (S mode), encrypted communications and frequency agility with five channels to help avoid interference and permit fast and slow communication modes to save power. Further features of KNX-RF Multi boost reliability and allow larger numbers of KNX devices to coexist on the network, including listen before talk (LBT), fast acknowledge with auto-retry, and support for repeaters. To create the new KNX-RF Multi software, ST teamed with its Authorized Partners, Tapko for the certified KNX stack and Actimage for the RF adaptation layer. The S2-LP package joins ST’s STKNX highly integrated transceiver for KNX TP communication over twisted-pair cable and extends the Company’s portfolio of certified solutions for smart-building communication, which comprehensively covers the major industry standards. In addition to enabling both wired and wireless KNX specifications with these solutions, ST provides embedded software, evaluation tools, and mobile apps to accelerate the development of Bluetooth Low Energy Mesh and 6LoWPAN networking solutions for smart-building and industrial applications. Both S2-LP and BlueNRG-2 devices belong to the ST 10-year longevity program. As a Gold Sponsor of the KNXperience online tradeshow running September 28 to October 2, ST will present demonstrations during the event that leverage the KNX RF Multi software package with interoperability using legacy KNX-TP and ETS to configure and control light switches, adjust LED color and dimming, and setup KNX devices with a smartphone connected through the BlueNRG-2 Bluetooth SoC. Please visit www.st.com/s2-lp-pr for more information.   * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]> https://newsroom.st.com/media-center/press-item.html/n4237.html Thu, 24 Sep 2020 13:57:59 +0200 <![CDATA[STMicroelectronics Updates on Supervisory Board Decision On Dividend]]> STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported an update on its cash dividend distribution. In light of the current global societal and economic environment caused by the COVID-19 outbreak, the STMicroelectronics NV Supervisory Board has decided to maintain the distribution of a cash dividend of US$0.168 per outstanding share of the Company’s common stock, as approved by the Annual General Meeting of Shareholders on June 17, 2020. About STMicroelectronics At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com. For further information, please contact: INVESTOR RELATIONS: Céline Berthier Group VP, Investor Relations Tel : +41.22.929.58.12 celine.berthier@st.com MEDIA RELATIONS: Alexis Breton Corporate External Communications Tel: + 33 6 59 16 79 08 alexis.breton@st.com]]> https://newsroom.st.com/media-center/press-item.html/c2969.html Wed, 23 Sep 2020 21:11:31 +0200 <![CDATA[STMicroelectronics Reveals BlueNRG-2N Network Processor Combining Convenience and Scalability, with Bluetooth® 5.0 Features and Security]]> \"\"STMicroelectronics has unveiled the BlueNRG-2N Bluetooth 5.0-certified network processor, lowering power consumption and adding support for the latest Bluetooth features that increase data throughput and enhance privacy and security. The BlueNRG-2N network coprocessor comes pre-programmed, ready for connecting to a host controller to provide Bluetooth connectivity. Not only simplifying product manufacture, the co-processor allows scaling the performance, features, and cost of the host system independently. Designers of products such as smart medical wearables, PC peripherals, remote controls, lighting, industrial and home automation can thus optimize their choice of microcontroller (MCU) to meet specific model requirements. The latest Bluetooth enhancements featured in BlueNRG-2N include support for Data Length Extension, which accelerates over-the-air (OTA) firmware updates by as much as 2.5 times and raises data transfers to 700kbit/s at the application level. In addition, with support for Bluetooth LE Privacy 1.2, BlueNRG-2N changes address frequently without host-processor involvement to prevent unwanted tracking with minimal impact on system power consumption. BlueNRG-2N is programmed with a digitally signed Bluetooth LE stack, which saves manufacturing costs while still allowing the flexibility to upgrade OTA. Built-in image authentication technology enhances cyber-security by always checking the stack before starting to allow only signed firmware images to run. Power consumption is lower compared with previous BlueNRG generations, with low transmit and receive current and drawing just 900nA in shutdown mode with the BLE stack running. At the same time, the device maintains robust and reliable radio performance, with +8dBm programmable RF output power and up to a 96dB link budget. BlueNRG-2N is the latest member in ST’s BlueNRG family of Bluetooth Low Energy chips that cater to various approaches when designing wireless systems. It shares key features with the BlueNRG-2 Bluetooth 5.0-certified System-on-Chip (SoC), which also contains a programmable Arm® Cortex®-M0 MCU to host the main application and Bluetooth connectivity on the same device. Developers working with BlueNRG chips can take advantage of the powerful and user-friendly STM32* online development environment (ODE), which includes the STM32CubeMX GUI plugin, to kick-start their projects. As the dedicated network co-processor within the BlueNRG family, BlueNRG-2N is in full production and is included in ST’s 10-year industrial product-longevity program. Devices are available in a 2.66mm x 2.56mm WLCSP34 chip-scale packages: BlueNRG-234N or 5mm x 5mm QFN32: BlueNRG-232N, from $1.21 for orders of 1000 pieces. Please visit https://www.st.com/bluenrg-2n-pr for more information. You can also read our blogpost at https://blog.st.com/bluenrg-2n/ * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]> https://newsroom.st.com/media-center/press-item.html/n4289.html Tue, 22 Sep 2020 13:58:20 +0200 <![CDATA[STMicroelectronics Accelerates Space Applications with 150MHz+ High-Speed Rad-Hard Logic]]> \"\"STMicroelectronics has introduced the first two logic devices in a new high-speed, radiation-hardened family that brings 150MHz+ performance to space applications. The QML-V qualified RHFOSC04 (SMD15962F20207) integrated oscillator driver/divider and RHFAHC00 (SMD 5962F18202) quad NAND gate have more than twice the gate speed of typical rad-hard logic ICs to ensure faster response in high-frequency circuits. Designed with ST’s proprietary 130nm CMOS technology already proven throughout the space industry, the new devices combine their speed advantage with low operating current and a best-in-class radiation hardness with an RHA (Radiation Hardness Assurance) qualified TID2 at 300 krad (Si) and immunity to SEL and SET3 up to 125 MeV.cm2/mg. Their supply-voltage range of 1.8V-3.6V helps meet the tight power and energy restrictions typical on-board satellites and space vehicles. The RHFOSC04 combines the roles of multiple discrete logic components to drive a crystal oscillator directly, which simplifies circuit design and enhances stability while saving board space and increasing system reliability. The divider adds flexibility by providing nominal-frequency, divide-by-2, divide-by-4, and divide-by-8 outputs. The devices are available as bare die ready for System-in-Package (SiP) integration in customers’ applications or packaged as ceramic hermetic Flat 14 (RHFAHC00) and Flat 10 (RHFOSC04) devices. Please contact your ST sales office for pricing options and sample requests. For further information please visit www.st.com/fastlogic-pr 1 SMD: Standard Microcircuit Drawing number, issued by the QML-V qualifying authority and usually the default component reference used within the space industry. 2 TID: Total Ionizing Dose 3 SEL and SET free at 125 MeV.cm2/mg: quantifies resistance to heavy-ions-induced Single Event Latchup and Single Event Transient faults]]> https://newsroom.st.com/media-center/press-item.html/n4278.html Mon, 31 Aug 2020 13:56:16 +0200 <![CDATA[STMicroelectronics Expands Access to Market-Unique LoRa®-Enabled STM32WL SoC with 48-Pin Package Option]]> \"\"STMicroelectronics has added a QFN48 package to the award-winning STM32WLE5* wireless System-on-Chip (SoC) portfolio, bringing the device’s extensive feature integration, power efficiency, and multi-modulation flexibility to a wider variety of industrial wireless applications. The STM32WLE5, named ‘Best IoT Connectivity Solution’ at IoT World 2020, combines ST’s STM32L4 ultra-low-power microcontroller technology and Semtech SX126x sub-GHz radio IP optimized to meet local radio-equipment regulations worldwide. Its unique single-silicon-die integration helps save bill-of-materials (BOM) costs and simplifies the design of connected, smart devices for applications in metering, city management, agriculture, retail, logistics, smart buildings, and environmental management. Long-term availability is assured through ST’s rolling 10-year longevity commitment for industrial products. With its low power consumption and small footprint, the STM32WLE5 enables energy efficient, compact, and lightweight new products for burgeoning IoT markets. Now, the new 7mm x 7mm QFN48 package option makes it suited to a simplified two-layer board design that further eases manufacturing and reduces BOM costs. As the world’s first LoRa®-enabled SoC, the STM32WLE5 supports multiple RF-modulation schemes including LoRa spread-spectrum modulation as well as the (G)FSK, (G)MSK, and BPSK used by various sub-GHz long-range protocols including proprietary protocols. Users have flexibility to apply their desired protocol stack, whether created in-house, sourced externally, or chosen from off-the-shelf software such as the LoRaWAN® and wM-Bus stacks that are available from ST and authorized partners. ST has engineered the integrated RF stage to address global markets while improving performance and easing manufacture. Features include dual low-power (14dBm) and high-power (22dBm) transmitter modes with highly linear performance from 150MHz to 960MHz, spanning the sub-1GHz unlicensed frequency range, which ensures technical compatibility with RF regulations in all world markets. Sensitivity down to -148dBm helps to maximize RF range. Only a single crystal is needed to synchronize the high-speed external (HSE) clock and the radio, delivering a further saving in BOM. The new QFN48 package extends the STM32WLE5 portfolio, which also includes devices in 5mm x 5mm BGA73. Three different Flash-memory density options are available per package, offering a choice of 64KB, 128KB, or 256KB, and all devices feature a high proportion of user-assignable GPIOs. All feature ST’s ultra-low-power microcontroller technologies, including dynamic voltage scaling and proprietary adaptive real-time ART Accelerator™ that allows zero-wait execution from Flash. STM32WLE5 SoCs, including STM32WLE5J BGA73 and the latest STM32WLE5C QFN48 devices, are in production now. Please contact your local ST office for pricing information and sample requests. Please visit www.st.com/stm32wl for more information.   * STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]> https://newsroom.st.com/media-center/press-item.html/n4283.html Thu, 27 Aug 2020 14:00:52 +0200 <![CDATA[STMicroelectronics Launches High-Accuracy Inclinometer with Machine-Learning Core]]> \"\"

The IIS2ICLX from STMicroelectronics is a high-accuracy, low-power, 2-axis digital inclinometer for use in applications such as industrial automation and structural-health monitoring[1]. It features a programmable machine-learning core and 16 independent programmable finite state machines that help edge devices save power and reduce data transfers to the cloud. With its advanced embedded functions, the IIS2ICLX lowers system-level power consumption to extend the operation of battery-powered nodes. The sensor’s inherent characteristics simplify integration into high-performing products, while minimizing the effort and cost of calibration. Using MEMS accelerometer technology, the IIS2ICLX inclinometer has a selectable full scale of ±0.5/±1/±2/±3g and provides outputs over an I2C or SPI digital interface. Embedded compensation maintains stability over temperature to within 0.075mg/°C, ensuring high accuracy and repeatability even when ambient temperatures undergo extreme fluctuations. Its ultra-low noise density of 15μg/√Hz enables high-resolution tilt sensing as well as sensing of low-level, low-frequency vibration, as required in structural-health monitoring. The combination of high stability and repeatability, high accuracy, and high resolution make the IIS2ICLX particularly suited to industrial applications such as antenna pointing and monitoring, platform leveling, forklift and construction machines, leveling instruments, equipment installation and monitoring, and installation and sun tracking for solar panels, as well as Industry 4.0 applications such as robots and autonomous guided vehicles (AGVs). In structural-health monitoring, accurately measuring inclination and vibration with the IIS2ICLX can help assess the integrity of structures such as tall towers and infrastructure like bridges or tunnels. Affordable, battery-powered MEMS tilt sensors containing the IIS2ICLX enable many more structures to be monitored for safety than has been economically viable using earlier, more expensive technologies. Whereas many high-accuracy inclinometers are single-axis devices, the 2-axis IIS2ICLX accelerometer can sense the tilt with respect to a horizontal plane along two axes (pitch and roll) or, by combining the two axes, can measure the tilt with high and repeatable accuracy and resolution with respect to a single direction of the horizontal plane over a range of ±180°. The digital output simplifies system design and reduces Bill-of-Materials (BOM) cost by saving external digital-to-analog conversion or filtering. To ease the adoption of the IIS2ICLX and accelerate application development, ST also provides specific software libraries to support sensor calibration and real-time computation of tilt angle. Such software libraries are part of the X-CUBE-MEMS1 expansion software package for STM32Cube The IIS2ICLX is housed in a high-performance ceramic-cavity LGA package measuring 5mm x 5mm x 1.7mm, with an operating temperature range of -40°C to +105°C. It is available now in sample quantities. The devices are in volume production now, with a web price of $15.00. For more information please go to www.st.com//iis2iclx-pr. 1 Structural health monitoring: continuous condition screening through sensors on buildings and infrastructure such as roads, bridges, tunnels]]>
https://newsroom.st.com/media-center/press-item.html/n4275.html Mon, 24 Aug 2020 14:00:50 +0200
<![CDATA[STMicroelectronics’ STM32 Discovery Day Online Introduces Cutting-Edge Embedded Solutions for Power & Energy, IoT, and Connectivity Markets]]> STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will host the STM32 Discovery Day Online Track 2020 from September 1 to 4. The webinar series will highlight core STM32 products and solutions for targeted applications in Power & Energy, Internet of Things, and Connectivity.

 

The STM32 Discovery Day is an annual event hosted by ST Korea with a focus on STM32 32-bit general-purpose microcontrollers. This year, it will be held online due to the impact of the COVID-19 pandemic. Free of charge, the event encourages engineers and product managers to participate and learn about ST’s industry-leading products and solutions.

 

During this four-day event, ST will showcase the latest trends and state-of-the-art technologies in STM32 products. These include the STM32MP1, a microprocessor with a powerful dual Arm® Cortex® core; the STM32-based TouchGFX, a free graphics solution; the STM32WL, the world’s first LoRa® one-chip solution; the STM32Cube.AI that implements the STM32-based basic neural-network embedded system; and the STM32CubeMonitor, which shows the runtime variables of STM32 applications in real time. The free webinar series will also demonstrate an NFC-based door-lock control solution, and STSAFETM family of secure authentication ICs. Representatives from AWS, Microsoft, and SDT(Sigma-Delta Technologies Inc.) will also participate as speakers to introduce their IoT solutions and services.

 

The STM32 family of 32-bit microcontrollers and microprocessors offers products covering the full range of very high performance, real-time capabilities, digital signal processing, low-power / low-voltage operation, and connectivity, while maintaining full integration and ease of development.

 

“By hosting the online demonstrations of the latest STM32 solutions for Power & Energy and the Internet of Things, and Connectivity markets we can ensure safe participation while also greater convenience that will allow more people to join,” said Paolo Oteri, Microcontroller Marketing Director at ST Korea and Japan. “Our STM32 products with rich functionality and powerful ecosystem provide embedded designers an exceptional number of choices to pick the perfect system ‘brain,’ while preserving both product efficiency and innovation.”  

Pre-registration is required to participate in the STM32 Discovery Day Online Track 2020. For more information on the registration and the event please click here: link.

 

 

STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.

 

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https://newsroom.st.com/media-center/press-item.html/t4284.html Mon, 24 Aug 2020 08:00:54 +0200