<rss xmlns:atom="http://www.w3.org/2005/Atom" version="2.0">
<channel>
	<title>STMicroelectronics News Release</title>
	<link>https://www.st.com/content/st_com/en/press-rss.html</link>
	<description>A Collection of STMicroelectronics News Release</description>
	<language>en</language>
	<lastBuildDate>Sun, 15 Nov 2026 07:10:01 +0100</lastBuildDate>
<item>
	<title><![CDATA[Jean-Marc Chery, STMicroelectronics’ President and CEO to speak at Morgan Stanley investor conference]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) President and Chief Executive Officer Jean-Marc Chery will speak at the Morgan Stanley European Technology, Media & Telecom Conference in Barcelona on Thursday, November 19, 2026 at 12:00 pm CET (noon). A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay until December 3, 2026. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/jean-marc-chery-stmicroelectronics-president-and-ceo-to-speak-at-morgan-stanley-investor-conference-c3423.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 12 Nov 2026 08:00:16 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics to host investor call on STM32 pioneering the convergence era]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) will host a webcast for investors and analysts on November 18, on STM32: pioneering the convergence era. The webcast, hosted by Remi El-Ouazzane, President of ST’s MDRF Group, is scheduled at 3 p.m. Central European Time (CET) / 9 a.m. U.S. Eastern Time (ET). The presentation will be followed by a Q&A session. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-to-host-investor-call-on-stm32-pioneering-the-convergence-era-c3424.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 12 Nov 2026 07:30:19 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics simplifies IoT deployment with SoftSIM, SGP.32 in-factory provisioning, and Zephyr support for ST87M01]]></title>
	<description><![CDATA[STMicroelectronics has announced new capability options for users of ST87M01 NB-IoT industrial modules, with Onomondo SoftSIM, support for in-factory SGP.32-compliant SIM profile provisioning, and Zephyr ecosystem compatibility. The Onomondo SoftSIM is a software-based solution running on the ST87M01 processing subsystem which makes unnecessary the use of a physical SIM device. This dramatically accelerates IoT-device deployment and significantly lowers production costs, reduces power consumption to relieve battery demand, and simplifies device-lifecycle and supply chain management. At Enlit, ST will also showcase how the ST87M01 module lets equipment manufacturers perform in-factory SIM profile provisioning leveraging the SGP.32 standard, which saves stocking SIMs preconfigured for different operators. Downloading and provisioning mobile network operators’ profiles directly on the production line helps simplify inventory management while providing a consistent approach to both in-factory provisioning and remote profile management in the field, using the same SGP.32 framework. “The latest software-based connectivity and SIM-management options for ST87M01 further extend the flexibility of this family for innovators to tackle the next generation of IoT applications,” said Massimiliano Brambilla, Multisegment ASIC and Application Specific Division (MSA) Division General Manager, STMicroelectronics. “We have also integrated the ST87M01 with the widely adopted Zephyr framework, which makes this module series accessible within a broad open-source embedded ecosystem for all developers.” The ST87M01 driver for Zephyr is now available through the Zephyr GitHub. It supports connectivity features including UDP, TCP, HTTP, MQTT, and CoAP, as well as GNSS, Wi-Fi positioning, and RSSI display. For developers working with Zephyr-based systems, this support can help streamline integration of the ST87M01 to take advantage of its connectivity and positioning capabilities. The ST87M01 NB-IoT module family contains multiple variants, compliant with SGP.32 for secure remote SIM provisioning and presenting flexible options including GSMA-certified embedded SIM, GNSS/A-GNSS, Wireless M-Bus, and Wi-Fi positioning. Meeting LTE Cat NB2 Release 15, and with worldwide regional band coverage, the modules are certified in accordance with GCF, EU RED, RED-DA, FCC/ISED, PTCRB, Anatel, and Icasa. Versatile protocol support and ultra-low-power consumption allow extended maintenance-free operation, and the 12.8mm x 10.6mm LGA package is ideal for space-constrained IoT applications. Visitors to Enlit Europe can see the ST87M01 SIM-provisioning demonstration at STMicroelectronics’ booth, B.b110, VIECON, the Vienna Congress & Convention Center, November 10-12. ST will also present the ST87M01 and a selection of IoT solutions at electronica 2026, Messe Műnchen, Munich, November 10-13, Hall C3/booth 101. Visit www.st.com/nb-iot for more information.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-simplifies-iot-deployment-with-softsim-sgp-32-in-factory-provisioning-and-zephyr-support-for-st87m01.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/st87m01-PR-image-lr.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Thu, 5 Nov 2026 14:59:11 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics sharpens agentic-AI coding with new STM32 tools]]></title>
	<description><![CDATA[STMicroelectronics is empowering embedded-software developers with new tools designed from the ground up to support workflows incorporating AI agents in STM32 microcontroller (MCU) based projects. “Agentic AI is transforming embedded software development, redefining commercial expectations and changing the developer’s role into orchestrator, director, and supervisor,” said Patrick Aidoune, Group Vice President and General Purpose and Automotive Microcontrollers Division General Manager, STMicroelectronics. “STM32Cube for Agentic AI is built to support the “team” of developer and AI agent, providing the truthful information about STM32 the agent needs to do its work and giving the developer the tools for expressing intent and checking the output. Our tests confirmed the dramatic improvement in accuracy now available for STM32 developers.” “By combining the intelligence of OpenAI models with STM32Cube’s accurate data and skills, our solutions help embedded developers work more efficiently and benefit from enhanced optimization,” said Benjamin Schwartz, Managing Director for Partnerships, OpenAI. “STM32Cube for Agentic AI gives us more confidence in adopting AI agents in our development,” said Serge Robin, lead architect at Somfy. “It provides validated configurations, reference examples, and code review capabilities, along with deployment flexibility and the ability to regain control within a familiar development workflow.” The STM32Cube for Agentic AI framework brings higher efficiency to diverse aspects of AI-based development. It provides high-quality STM32-specific information directly from the manufacturer to help AI agents ensure accuracy, avoid hazards such as hallucinations, and minimize token costs. There is also help for AI agents to select appropriate STM32 ecosystem assets, such as whether to use a ready-made code example or call a code-generation tool. Users can select the context that best fits their development flows, with options to include STM32CubeIDE or to rely on any other IDE choice. There is also assistance for users, whether working in OEMs or mass-market companies, that may need extra support for validation, debug, and optimization. STM32Cube for Agentic AI enables the AI agents to seamlessly use optimized and verified reference code examples created by ST and to use STM32CubeMX, the deterministic code generation tool. This ensures higher code accuracy and determinism, as well as allowing developers to take back control of code development and debug when needed, letting them continue working in their familiar project and coding environment. After code is generated, the new STM32Cube for Agentic AI framework provides a first review to verify API calls, check for correct interactions with MCU hardware, and suggest workarounds. Users can also take advantage of STM32Sidekick, a recently introduced tool that adds 24/7 digital assistant functionality for our customers to answer basic support questions as a first line support with links to relevant data and content. As a proof point, ST researchers tasked AI agents to develop code on STM32 MCUs, letting some refer to the STM32 context and guidelines provided by STM32Cube for Agentic AI, while others worked without assistance. The assisted agents successfully generated functional code, where others failed, and consumed 15 times fewer tokens. STM32Cube for Agentic AI is in beta now and preparing for public launch soon. STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-sharpens-agentic-ai-coding-with-new-stm32-tools-n4799.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/PR2611AgenticAI_800x450.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Wed, 4 Nov 2026 11:00:56 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics’ STM32H7P MCUs embed digital signal processing, edge-AI, and real-time control for demanding industrial applications]]></title>
	<description><![CDATA[STMicroelectronics’ STM32H7P microcontrollers add hardware acceleration for DSP and edge AI workloads alongside a 2773-CoreMark® Arm® Cortex®-M7 to handle digital power, motor control, condition monitoring, and other mission-critical industrial applications. The architecture includes ST’s Hardware Signal Processor (HSP) and Neural-ART ™ Neural Processing Unit (NPU). The HSP is a powerful, cost-optimized and energy-efficient DSP accelerator for matrix, vector, and digital signal processing operations. By offloading these workloads from the main CPU, HSP helps free up Cortex-M7 bandwidth and can reduce the need for a dedicated external DSP. It cuts the time for Fast Fourier Transforms (FFTs) by up to 5 times compared to software implementation on Cortex-M7. “The STM32H7P extends the proven STM32H7 series, with two dedicated hardware accelerators alongside a 520MHz Cortex-M7 core that deliver 1.7-times the performance of alternative products on the market. Combining more real-time performance with advanced hardware acceleration for DSP and edge-AI these MCUs let engineers build the next generation of smart, responsive embedded systems across industrial, power electronics, sensing, and intelligent edge applications,” said Laurent Vera, STM32 Marketing Director, STMicroelectronics. “In addition, richer analog and timer capabilities, and strong cost efficiency are ideal for power electronics applications such as solar, digital power, and motor control.” The new MCUs feature larger Tightly Coupled Memories (TCM) for fast access to instructions and data, maximizing the architecture’s performance in real-time control, signal processing, and AI inference. For customers seeking a high-performance cost-optimized MCU, the new series offers up to 2MB of Flash for non-volatile code and data storage at a price point similar to the previous 1MB STM32H7 series, enabling general-purpose and mass-market designs to deliver more real-time performance and greater memory density without moving to a higher-cost platform. In addition to its compute enhancements, the STM32H7P features advanced analog peripherals (ADC, DAC and comparators) and timers inherited from the newly introduced STM32G5 mixed-signal series, making it a compelling solution for control applications and strengthening industrial application development. The Neural-ART NPU frees edge-AI workloads from software constraints, enhancing efficiency and allowing larger networks and more complex. Bringing up to 85 GOPS to the STM32H7P series, the NPU has already demonstrated 40-times faster inference than software running ST’s AI Arc Fault Circuit Interrupter (AFCI) model for solar- inverter safety. The anomaly detection model is shown to run 20 times faster, and the AI battery-management system (BMS) model runs 15 times faster. ST’s Edge AI Suite provides a complete environment for embedded machine-learning development, with case studies and a set of tools and resources to help and accelerate the development and deployment of AI models on STM32. Developers can also take advantage of DSP enablement software and ST’s X-CUBE-MCSDK-2 motor-control software tools. The STM32H7P will also connect with the upgraded STM32Cube ecosystem, including the enhanced STM32CubeMX2 configurator and also the latest code-size optimized hardware abstraction layer, HAL2. Ready for demanding industrial environments, the STM32H7P MCUs operate up to 125°C ambient temperature and are included in ST’s industrial longevity support program. An exposed-pad LQFP package option further enhances thermal dissipation, supporting robust operation in high-temperature industrial designs. The STM32H7P series is sampling at OEMs now, with production planned in January 2027, priced from $4.43 with 1MB Flash in LQFP100 package, for orders of 10,000 units. The NUCLEO-H7P5II evaluation board and STM32H7P5IDK Discovery kit will also be available in January 2027. Visit www.st.com/stm32h7p for more information. STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-stm32h7p-mcus-embed-digital-signal-processing-edge-ai-and-real-time-control-for-demanding-industrial-applications-n4798.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/PR2610STM32H7P-s.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Wed, 4 Nov 2026 11:00:38 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics streamlines AI model development for STM32 developers]]></title>
	<description><![CDATA[STMicroelectronics has redesigned the workflow in ST Edge AI Suite, consolidating the developer environment with four new tools that streamline deployment of embedded machine-learning models on STM32 microcontrollers. Model Explorer - the first new tool in the latest update - provides an intuitive web interface for users to browse and find the right AI model among the pre-trained models that were previously accessible though Model Zoo Github repository. Dataset Factory helps capture and transform raw data into usable, reliable datasets. Model Factory assists application-targeted training, customization, quantization, and additional refinements, and helps optimize models for STM32 MCUs. To validate performance before deployment, Model Bench gives users a web interface for benchmarking models on hardware remotely by leveraging the ST board farm. Model Bench replaces ST Edge AI Developer Cloud. “Working efficiently with AI models is a priority for designers as local inference becomes a defining aspect of today’s smart products,” said Stephane Henry, Edge AI Solution Group VP at STMicroelectronics. “Today we have the largest collection of AI models of any microcontroller vendor, with over 400 pre-trained models including a large selection for sensing applications; aka physical AI. With Model Explorer, Model Factory, Dataset Factory and Model Bench in ST Edge AI Suite, we now consolidate this support in an environment purpose-built for designers targeting STM32 devices.” ST supports over 260,000 projects through Edge AI Suite and the number is growing continuously. The user community includes engineers in major blue-chip technology brands and companies of all sizes including startups and independent developers. From consumer electronics to industrial sensors, controls, medical devices, and automotive systems, embedded AI holds the key to delivering competitive capabilities, performance, and power consumption. Engineers need next-generation tools and workflows that are built for selecting models and adapting them to the use case, optimizing memory and compute, and validating performance on target hardware. ST Edge AI Suite connects users with the broader STM32 ecosystem that contains over 4,000 commercial part numbers. The associated powerful STM32Cube ecosystem provides tools to select and configure MCUs, contains software libraries and code examples, and lets users work within their preferred integrated development environment (IDE). STM32Cube also connects users with evaluation hardware, from low-cost STM32 Nucleo boards to full-featured Discovery kits, and expansion cards such as wireless connectivity, vision, time-of-flight, IoT sensing, motor drives, and more. The new tools will be available in late November. Register to be notified at https://content.st.com/new-stm32-edge-ai-tools.html. To use the current version of ST Edge AI Suite, go to https://www.st.com/edge-ai-suite STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-streamlines-ai-model-development-for-stm32-developers-n4800.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/800x450px-1.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Wed, 4 Nov 2026 11:00:19 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics reveals advanced microcontrollers for real-time power control in AI datacenters and robotics]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the new STM32G5 series of mixed-signal microcontrollers (MCUs). The new series will help developers build more efficient, intelligent, and secure technology for datacenters, robotics, photovoltaic installations and wind turbines, industrial drives, and commercial drones, powering the physical AI revolution. Patrick Aidoune, General Manager, General Purpose and Automotive Microcontrollers Division, STMicroelectronics, explained: “This new generation of microcontrollers addresses the challenge to meet the growing energy needs of AI datacenters efficiently, realize more sophisticated humanoid robots, and power more complex motor-control systems. With the STM32G5 series, ST makes the compute performance needed for physical AI accessible and embeddable to deliver improvements that enhance sustainability, safety, and security.” Built with Arm® Cortex®-M33 core, STM32G5 MCUs deliver twice the compute performance of the STM32G4 series. There are also new and upgraded peripherals that boost speed and precision for controlling equipment such as power supplies and electric motors. The STM32G5 single-core portfolio will be enlarged in 2027 with dual-core products offering even more performance and peripherals. “In humanoid robotics, dexterity depends on combining strength, precision, sensing and real-time control in an extremely compact space,” said Paul Tian, Ruiyan Intelligent CEO. “The STM32G5 delivers more than twice the performance of the previous generation, more peripheral support and stronger built-in security needed to control more motors, respond faster when speed and precision matter, and integrate more sensors into the robotic hand. Together with ST, we’re bringing dexterous robotic hands closer to real-world use, from factory automation to medical laboratories, with the goal of making everyday life easier.” Advanced features for digital power and motor control The STM32G5 series MCUs are built with the Arm Cortex-M33 core running at 280MHz and introduce new and upgraded peripherals such as an enhanced high-resolution timer, position encoder, programmable logic array, and hardware security. Improving energy efficiency and reducing demand are critical in today’s datacenters, especially where AI accelerators are concentrated. The increasing speed and performance of the latest GPU clusters is driving rack power towards 1 MW and the largest datacenters could demand over 2 GW of peak power by 2030. At this scale, even small efficiency gains can reduce energy losses and cooling demand. With the high-resolution timer, equipment makers can implement precision algorithms to reconfigure power-supply units dynamically for maximum efficiency as the servers’ power demands change with their workloads. Also, with this sharper timing, the STM32G5 can handle the higher switching frequencies in power supplies built with wide-bandgap silicon carbide (SiC) and gallium nitride (GaN) semiconductors. Humanoid robotics brings complex motor-control requirements including simultaneous multi-axis driving, often with high current delivery to produce high torque, and always with fast response to ensure smooth, natural movement. Fine control is needed where precision takes priority in mechanisms such as the hand and fingers, with as many as 20 motors in one hand. This is one of the most visible applications of physical AI, where the STM32G5’s advanced capabilities can expand the market for affordable, useful humanoid robots. Advanced safety and security By introducing the new PLAy programmable logic array, STM32G5 MCUs let developers implement special custom functions in robust and reliable custom hardware reducing the need for external glue logic. State-of-the-art security, including provisioning capability, which is an added value of the STM32G5 and an important advantage for use in datacenters, supports current and upcoming compliance requirements. ST combines the Cortex-M33’s Arm TrustZone® IP with proprietary STM32Trust features that include an immutable Root of Trust (STiRoT) for secure boot and secure firmware update. There is also an advanced cryptographic engine that supports the latest algorithms, including ST’s PQC libraries, software protection, secure storage for sensitive data such as cryptographic keys, tamper detection, side-channel attack resistance, and support for life cycle security management. Extended ecosystem The STM32G5 benefits from dedicated ecosystems for developing digital power and motor control applications. Comprising hardware, software, documentation, and training resources, they help accelerate development and reduce time to market. The STM32G5 series is included in the latest-generation STM32CubeMX2 development tool, which supports new workflows and advanced features such as live code previews that save time and give instant feedback. In addition, an optimized graphical user interface, new features for configuring clocks and pinout, and online documentation simplify managing dependencies and keeping projects up to date. The STM32G5 series also benefits from the new STM32Cube hardware abstraction layer (HAL2) offering full access to all the rich STM32G5 hardware features with significant memory footprint optimization. Further technical features: • Cortex-M33 core (420 DMIPS/1136 CoreMark® @ 280MHz) • More hardware accelerators: I/D cache, routine booster • Programmable logic array (PLAy) permits on-chip custom hardware • First MCU with ST’s enhanced 12-channel high-resolution timer, ideal for digital power supplies • Motor-control timers, position encoder (POSENC) • Rich and advanced analog peripherals, including 12-bit analog-to-digital converter (ADC), operational amplifier, 12-bit digital-to-analog converter (DAC), ultra-fast comparators • STM32 Nucleo board containing STM32G5-512K in LQFP64 (NUCLEO-G564RE) • Motor Control Discovery Kit (B-G564E-MC1S) • Digital Power Discovery Kit (B-G564E-DPOW1) • Digital power libraries (X-CUBE-DPOWER) • Motor control software development kit (X-CUBE-MCSDK) • LQFP package available in two variants, including thermally-enhanced exposed pad variant to sustain advance mission profiles (required for datacenter power applications) STM32G5 MCUs are in production now, comprising performance and high-resolution product lines, with on-chip Flash from 64Kbytes to 512Kbytes, and package styles from a small QFN32 to the LQFP128. Prices start from $1.0340 for orders of 10,000 pieces. For more information, please go to www.st.com/stm32g5 STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-reveals-advanced-microcontrollers-for-real-time-power-control-in-ai-datacenters-and-robotics-p4797.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/800x450px.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Wed, 4 Nov 2026 07:05:33 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STM32 Summit 2026: STMicroelectronics announces its unified MCU platform, addressing technology convergence across industrial, automotive and physical AI applications]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced a major strategic evolution of its STM32 portfolio: a unified STM32 microcontroller platform spanning industrial, automotive, and robotics applications. As part of this strategy, the new STM32A family extends the platform into automotive and safety-critical systems. Building on more than 20 years of STM32 development, this cross-domain platform will help developers bring advanced embedded systems to market faster by enabling greater continuity and reuse across application domains, including emerging physical AI systems, while supporting each market’s specific requirements for safety, security, qualification and product longevity. “Embedded innovation should not require developers to start again with every new product. With the unified STM32 platform, we are creating a foundation they can trust across markets and generations. The industry needs less fragmentation and a stronger focus on helping MCU technologies converge around a common foundation, while maximizing software reuse. This is how we intend to make STM32 the reference MCU platform across industries,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF Products Group, STMicroelectronics. One platform for converging technology needs As intelligence moves to the edge, industrial and automotive systems increasingly share requirements for real-time control, secure operation, functional safety, connectivity and AI processing. The unified STM32 platform gives development teams a consistent architecture and software foundation, enabling them to reuse proven assets while selecting products tailored to the performance, qualification, and lifecycle requirements of each application. - Continuity across the portfolio: Arm® Cortex®-M cores and shared architectural principles give developers a familiar path between STM32 MCU families, making it easier to carry proven software and IP into new designs. - A common development ecosystem: STM32Cube, the world largest MCU software ecosystem, and the broader Arm ecosystem provide a consistent development environment backed by software resources, technical support, and the ST developer community and help customers retain established workflows. - Shared process technologies: ST’s 40nm Flash technology and 18nm FD-SOI technology with embedded phase-change memory, augmented by TSMC eNVM technologies, provide a scalable manufacturing foundation for future STM32 products. Arm, ST’s longstanding partner, shares this vision of a unified microcontroller platform. ST is a lead partner in shaping the future of the Arm Cortex-M portfolio, the architecture of choice for more than 100 billion devices already, and in building the high-performance MCU foundation required for physical AI. This collaboration is helping developers reuse more code across applications, from cars and robots to automated industrial systems. “The next major frontier for computing is bringing intelligence into the machines that move, manufacture and operate in the physical world,” said Drew Henry, Executive Vice President, Physical AI, Arm. “Building on more than two decades of collaboration, Arm and STMicroelectronics are advancing Cortex-M together to meet the demands of intelligence at the edge, where the physical world is sensed and controlled, helping unlock the next generation of physical AI systems.” STM32A extends the platform into high-safety and automotive markets The new STM32A family brings the STM32 platform into high-safety and automotive systems. It enables customers to reuse software while meeting the qualification and performance requirements of each application. The first three STM32A microcontrollers are sampling to customers, with broader availability planned in 2027: • STM32A4 targets entry-level automotive local control nodes and safety systems • STM32A5 addresses mid-range safety-critical applications in industrial automation, robotics, and energy systems, as well as automotive applications. • STM32A9 addresses safety-critical multi-domain control where real-time control, low latency, Ethernet, and deterministic communication become essential. Hear more from our customers and partners on the benefits of a unified microcontroller platform https://www.st.com/content/st_com/en/campaigns/unified-stm32-mcu-platform-z11.html About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-its-unified-mcu-platform-addressing-technology-convergence-across-industrial-automotive-and-physical-ai-applications-t4802.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/11/pr2610Convergence_A_s.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Wed, 4 Nov 2026 07:00:55 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics Announces Updates to its Organization and Leadership Appointments]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today a new organization to further strengthen its positioning for the next phase of growth and innovation. Remi El-Ouazzane is confirmed President, member of the Executive Committee, Head of Microcontrollers, Digital ICs, RF and Optical Communication Products. In addition to his current responsibilities, he will also take on leadership of the Imaging Sensors Sub-Group and will be appointed ST Chief Technology Officer (CTO). In his new CTO role El-Ouazzane will take on leadership of R&D for digital CMOS and derivative technologies such as RF mixed-signal, embedded flash, and imaging, advanced packaging and test and characterization, as well as Global System Research & Applications and System Engineering. This evolution is intended to enhance coordination across product development, research, and technology activities across the Company to ultimately boost innovation and time-to-market. Marco Cassis is confirmed President, member of the Executive Committee, head of Analog, Power & Discrete and MEMS Products. In addition to his current responsibilities, he will take on leadership of R&D for Analog, Power & Discrete and MEMS technologies. This evolution is intended to accelerate the profitable growth of this Product Group. Cassis’ responsibilities as head of ST strategy remain unchanged and he will be appointed ST Chief Strategic Officer (CSO). In his new CSO role he will align ST’s vision and business objectives with evolving market dynamics, identifying growth, partnership and bolt-on M&A opportunities while anticipating the competitive landscape. Jean-Marc Chery, ST President & CEO, said: “The CTO and CSO responsibilities are strongly interdependent, and in their respective roles Remi and Marco, together with ST’s Managing Board and Executive Committee, will ensure stronger coordination between the Company’s strategy and its advanced technology and product roadmaps, to support ST’s long-term direction and growth opportunities”. The remainder of the organization is unchanged. The new organization will take effect on January 1, 2027, with implementation to be completed by the end of March 2027. The Company will adjust its reportable segments from January 1, 2027. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-updates-to-its-organization-and-leadership-appointments.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 29 Oct 2026 07:13:16 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics Reports Q3 2026 Financial Results]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the third quarter ended September 26, 2026. This press release also contains non-U.S. GAAP measures (see Appendix for additional information). ST reported third quarter net revenues of $3.76 billion, gross margin of 37.3%, operating income of $367 million, and net income of $291 million or $0.31 diluted earnings per share (non-U.S. GAAP1 operating income of $429 million, and non-U.S. GAAP1 net income of $344 million or $0.37 diluted earnings per share). Jean-Marc Chery, ST President & CEO, commented: “Q3 net revenues came above the mid-point of our business outlook range, driven by higher revenues in CECP and Personal Electronics. Gross margin was above the mid-point of our business outlook range.” “On a year-over-year basis, Q3 net revenues increased 17.9%. Q3 gross margin was 37.3%, operating margin was 9.8% and net income was $291 million. On a non-U.S. GAAP basis operating margin was 11.4% and net income was $344 million.” “During the quarter, demand increased further supported by strong bookings and improving visibility, while inventory in distribution continued to track below our standard target. Together, these indicators confirm the continued ongoing recovery and secular growth across the markets we serve.” “Our fourth quarter business outlook, at the mid-point, is for net revenues of $4.15 billion, increasing about 10.5% sequentially and about 24.7% year-over-year. Gross margin is expected to be about 39.0%, including about 40 basis points of unused capacity charges.” “The mid-point of this outlook translates into full year 2026 revenues of about $14.5 billion, representing a 22.8% year-over-year increase. Beyond the cyclical recovery across our end markets, the year-over-year growth is supported by ST\'s company specific growth drivers, including AI datacenters and LEO satellite communication. Gross margin is expected to be about 36.4%, non-U.S. GAAP1 gross margin is expected to be about 36.6%, representing an improvement of 270 basis points versus FY25.” “In an environment where demand remains well above supply, we continue to expand capacity aligned with ST’s strategic roadmap. We remain focused on improving profitability consistent with our intermediate financial model. This is driven by our company-specific growth drivers and the execution of our company-wide program to reshape our manufacturing footprint and resize our global cost base.” The press release is available as a PDF here.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-reports-q3-2026-financial-results.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 29 Oct 2026 07:00:22 +0100</pubDate>

</item>
<item>
	<title><![CDATA[Security by Design: building trust in tomorrow's technologies and products]]></title>
	<description><![CDATA[As connected devices become part of everyday life and cybersecurity regulations reshape markets, security has become a decisive factor in customer trust, product success, and long-term competitiveness. To meet this challenge, STMicroelectronics is scaling its long-standing security expertise embedding Security by Design more broadly across the company, starting from product definition and continuing through the product lifecycle. With new regulations such as the Cyber Resilience Act (CRA) raising customer expectations across the industry, security has evolved into a shared responsibility across ST and serves as a core enabler of trusted, future-ready technologies. Security has long been a specialized discipline. Why is it becoming such a strategic topic for ST today? The role of security has fundamentally changed across the industry. Historically, security was often perceived by the market as a constraint, something that added complexity, cost, or development time. Today, connected products are everywhere, and a security failure can have major consequences, from service disruption and data loss to reputational damage. As a result, security is no longer treated as an afterthought or a standalone feature. It has become a core business requirement that directly impacts customer trust and market success. For ST, this means expanding discipline from a specialized engineering discipline into a broader mindset, structured process, and organizational capability that influences how products are specified, designed, manufactured, maintained, and supported throughout their lifecycle. ST talks about the benefits of a company-wide Security by Design approach. What does that mean in practice? Security by Design means that security considerations begin as early as possible, ideally when a product is first defined. Rather than treating security as a final verification step, we aim to integrate it seamlessly from the start and throughout development, manufacturing, deployment, and maintenance. The goal is to build the optimal level of security into products naturally and efficiently. The earlier security is factored into the product life cycle, the better we can anticipate evolving regulatory and customer needs, address potential risks, and develop solutions that are simultaneously uncompromised on security and competitiveness. Is ST starting from scratch on this journey? This initiative builds on decades of established expertise in hardware and software security, with billions of chips shipped to customers across banking, identification, consumer electronics, automotive and industrial applications. In ST, we already have deep expertise in secure technologies, from advanced cryptography and secure hardware to vulnerability analysis, attack resistance, and embedded security. But also, in areas such as secure IP, security evaluation, attack emulation, and embedded security technologies. ST’s strength lies in combining hardware, software, and product security expertise under one roof. That allows us to address security consistently from silicon and embedded software to evaluation, validation, and lifecycle support. Our Integrated Device Manufacturer (IDM) model gives us the flexibility to adapt the technologies used in our products and deploy secure solutions efficiently across our portfolio. What Security by Design does is connect these capabilities together more systematically across ST and make them available on a broader scale. How is the EU Cyber Resilience Act influencing ST\'s approach? The EU Cyber Resilience Act is one of the major drivers behind the evolution of security practices across the industry. The regulation affects a large portion of products sold in the European Union and introduces stringent requirements covering product security, reporting obligations, documentation, governance, and lifecycle management. It requires seamless coordination across multiple functions, far beyond traditional engineering teams. For ST, compliance naturally involves product organizations, security experts, legal teams, public affairs, communications, human resources, IT, and many others. This perfectly illustrates why security can no longer be confined to a few specialists and has become a company-wide operational capability. Beyond regulation, what future technology trends are shaping ST\'s security roadmap? Two trends are influencing our plans: the emergence of post-quantum cryptography (PQC) and AI. First, the emergence of PQC: although quantum computers capable of breaking today\'s cryptographic algorithms are not expected in the immediate future, the transition to quantum-resistant solutions will take years. That is why our customers need to prepare now, so that their products are ready when these new technologies are deployed. ST\'s ST54M secure mobile chip is an example of this proactive approach. Second, AI is accelerating both defensive and offensive security capabilities. It can help identify vulnerabilities faster, automate protection mechanisms, and improve analysis. At the same time, it also provides new tools for attackers. The challenge for the entire industry is learning how quickly organizations can adapt to this evolving environment. Building a security culture requires collaboration. How is ST bringing teams together? Broad collaboration across the company is essential to make Security by Design a reality. Our Security Platform, established in 2022, has accelerated progress on strategic topics such as post-quantum cryptography and cross-product security solutions. Teams from multiple organizations have worked together to develop and share technologies across product groups. Building on this momentum, we launched the Product Security Affinity Team in 2025, bringing together experts from multiple areas such as hardware, software, cryptography, system security, and attack analysis. This community enables knowledge-sharing and helps align security practices across the company. Our objective is to ensure that security expertise is not isolated within specific teams but becomes a strategic capability that powers the technologies we bring to market. What does success look like for Security by Design? Success means reaching a point where security is no longer seen as a constraint, but as a way to help customers build trust, reduce risk, and bring competitive products to market with confidence. We want security to be seamlessly integrated into technologies, development methodologies, business processes, and company culture. When teams factor security from the start, they can make better decisions, respond more effectively to customer expectations, and prepare for future challenges more confidently.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/security-by-design-building-trust-in-tomorrows-technologies-and-products.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[feature article]]></postType>
	<pubDate>Tue, 27 Oct 2026 07:50:17 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between October 19, 2026 to October 23, 2026 (the “Period”), of 444,659 ordinary shares (equal to 0.05% of its issued share capital) at the weighted average purchase price per share of EUR 40.5207 and for an overall price of EUR 18,017,915.91. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 19-Oct-26 80,000 41.1554 3,292,432.00 XPAR 20-Oct-26 89,843 40.2403 3,615,309.27 XPAR 21-Oct-26 80,000 41.7299 3,338,392.00 XPAR 22-Oct-26 106,766 40.4155 4,315,001.27 XPAR 23-Oct-26 88,050 39.2593 3,456,781.37 XPAR Total for Period 444,659 40.5207 18,017,915.91 Following the share buybacks detailed above, the Company holds in total 16,867,047 treasury shares, which represents approximately 1.9% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3418.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 26 Oct 2026 14:01:40 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics introduces first automotive safety combination sensors for mass-market applications]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a set of automotive sensors that enable vehicle brands to extend advanced safety and driver-assistance features across categories from premium to mass-market, broadening access to state-of-the-art protection. Combining multi-axis accelerometers and gyroscopes (angular rate sensors) in a single package, ST’s new sensors offer a unified platform for OEMs and Tier-1 suppliers to build active and passive safety systems that meet stringent automotive quality, reliability, and safety requirements. The devices address use-cases ranging from crash protection, rollover detection, and airbag deployment to vehicle stability controls and radar beam stabilization. These are the first products launched in the mass market following ST’s acquisition of the NXP automotive and industrial MEMS sensors business in early 2026, a move completed to expand its own MEMS sensors capabilities. ST’s experience in automotive sensing reflects its commitment to guaranteeing product availability for at least 15 years, allowing companies to minimize lifecycle and redesign risks while investing confidently in new programs. “As a cohesive sensor set suited to multiple safety functions, these devices simplify system architecture, accelerate development, and increase flexibility to scale features and performance,” said Simone Ferri, Executive Vice President, MEMS Sub-Group, STMicroelectronics. “Strengthened by our longevity commitment and global support infrastructure, these are the first automotive safety combination sensors ready for mass-market deployment, accelerating the move to active safety.” Omdia has commented on the market opportunities for inertial sensing in Advanced Driver Assistance Systems (ADAS). Nora Houlihan, Senior Research Analyst at Omdia, said, “Thanks to ADAS, inertial measurement units (IMUs) are expected to grow at 17.7% CAGR (2025-30). As automotive manufacturers approach higher levels of autonomy there will be a significant increase in IMU-powered MEMS sensors for acceleration and motion detection.” Further technical information ST’s combination sensors integrate a multi-axis accelerometer and gyroscope in a single ISO 26262 compliant device with full internal diagnostics. All sensors support SafeSPI, the standard serial peripheral interface for automotive safety, that enables independent monitoring of sensor data. The new sensors comprise: • NCS1012BAEP, with z-axis (yaw) angular rate sensor and xy low g acceleration sensor. • NCS1012CAEP, with x-axis (roll) angular rate sensor and yz low g acceleration sensor. • NCS1012EAEP, with x-axis (roll) angular rate sensor and xy medium g acceleration sensor. • NCS10135AEP with z-axis (yaw) angular rate sensor and xyz low g acceleration sensor. The integrated angular rate sensors have a full-scale range of ±125 dps, ±250 dps or ±350 dps and feature low offset with minimal drift over the automotive temperature range (−40°C to +105°C). A low-pass filter is integrated, with 3dB frequency options of 12.5Hz to 400Hz, as well as an optional single-pole high-pass filter with fast startup. The low g acceleration sensors feature a nominal full-scale range from ±1.50 g to ±34 g, while the medium g acceleration sensors have nominal full-scale range from ±15.5 g to ±150 g, featuring an independent signal chain to minimize noise, low offset with low drift over the automotive temperature range, and an integrated low-pass filter. The four new sensors are in production now, in 24-pin QFN 6mm x 6mm x 1.90mm packages, with wettable flanks meeting automotive-industry optical inspection compatibility requirements. Contact your local ST sales office for sample requests and pricing. Please visit www.st.com/mems-for-automotive for more information. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-introduces-first-automotive-safety-combination-sensors-for-mass-market-applications-p4796-2.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/10/P4796D-Oct-26-2026-MEMS-Safety-Sensors_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Mon, 26 Oct 2026 09:38:38 +0100</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics simplifies authentication of Matter smart-home devices with ST MatterConnect personalization service]]></title>
	<description><![CDATA[STMicroelectronics has launched the ST MatterConnect service for securely loading authentication credentials into secure chips used in Matter-compatible smart-home devices. The service provides a convenient, turnkey solution to store authentication data into ST25DA-C NFC and the STSAFE-A120 secure elements. Thanks to its security infrastructure and certified secure factories, ST is uniquely positioned to generate and inject in-house the credentials into the chip. This includes the mandatory Matter Device Attestation Certificate (DAC) and other data such as cryptographic keys, product/version information, and customer personalization. “With ST MatterConnect, we deliver Matter-ready devices with the necessary certificates and keys preloaded, allowing customers to reduce operational costs and complexity, as well as accelerate time to market for new products,” said Sylvain Fidelis, Multi-Market Business Line Manager, STMicroelectronics. “Equipment makers can leverage ST’s status as an approved Product Attestation Authority (PAA) and Product Attestation Intermediate (PAI) to ensure trust and compliance without the expense of building secure provisioning infrastructure internally.” ST’s ST25DA-C and STSAFE-A120 support authentication for Matter devices and store sensitive data such as security keys. They execute an optimized set of commands ensuring authentication on tamper-proof secure hardware. The ST25DA-C tag is designed to support the Matter device NFC commissioning flow, which helps end users quickly connect devices from different ecosystems - such as smart lightbulbs, smart plugs, smoke alarms, security cameras, presence sensors, and many others - without multiple proprietary hubs. Connected to the device host via an I²C interface, STSAFE-A120 is a secure element providing authentication for Matter devices and security services for IoT devices such as secure connection establishment and integrity verification. It runs on a CC EAL5+ certified platform ensuring a strong level of robustness. Please visit www.st.com/MatterConnect for more information.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-simplifies-authentication-of-matter-smart-home-devices-with-st-matterconnect-personalization-service-n4795.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/10/N4795S-Oct-20-2026-ST-MatterConnect_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 20 Oct 2026 14:00:35 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between October 12, 2026 to October 16, 2026 (the “Period”), of 492,285 ordinary shares (equal to 0.05% of its issued share capital) at the weighted average purchase price per share of EUR 42.9537 and for an overall price of EUR 21,145,480.12. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 12-Oct-26 95,769 45.8414 4,390,185.04 XPAR 13-Oct-26 103,394 43.8600 4,534,860.84 XPAR 14-Oct-26 105,000 43.5308 4,570,734.00 XPAR 15-Oct-26 108,122 40.2118 4,347,780.24 XPAR 16-Oct-26 80,000 41.2740 3,301,920.00 XPAR Total for Period 492,285 42.9537 21,145,480.12 Following the share buybacks detailed above, the Company holds in total 16,422,388 treasury shares, which represents approximately 1.8% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3417.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 19 Oct 2026 13:23:34 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM) announced today that its Supervisory Board has asked Jean-Marc Chery, ST’s President and CEO, to be available for a reappointment in his current role for an additional year. Jean-Marc Chery has accepted the proposal. The Supervisory Board will therefore propose to the shareholders adoption at the Company\'s 2027 Annual General Meeting of Shareholders, the reappointment for a one-year term of Jean-Marc Chery, as Chairman of the Managing Board and the Company\'s President and Chief Executive Officer. Mr. Chery’s leadership and vision, combined with a strong focus on execution, have provided ST with a clear strategic course supporting the continued development of ST’s value proposition, and a strong foundation for long-term value creation for ST and its stakeholders. The decision recognizes the importance of the continuity of ST’s strategy, execution discipline and the momentum achieved under Mr. Chery’s leadership. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-to-propose-the-reappointment-of-jean-marc-chery-as-president-ceo-c3416.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 13 Oct 2026 06:01:03 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between October 05, 2026 to October 09, 2026 (the “Period”), of 346,538 ordinary shares (equal to 0.04% of its issued share capital) at the weighted average purchase price per share of EUR 49.2425 and for an overall price of EUR 17,064,401.16. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 5-Oct-26 60,000 50.4548 3,027,288.00 XPAR 6-Oct-26 46,538 51.7449 2,408,104.16 XPAR 7-Oct-26 65,000 50.2872 3,268,668.00 XPAR 8-Oct-26 90,000 48.2588 4,343,292.00 XPAR 9-Oct-26 85,000 47.2594 4,017,049.00 XPAR Total for Period 346,538 49.2425 17,064,401.16 Following the share buybacks detailed above, the Company holds in total 15,930,103 treasury shares, which represents approximately 1.7% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3415.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 12 Oct 2026 13:21:52 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between September 28, 2026 to October 2, 2026 (the “Period”), of 310,000 ordinary shares (equal to 0.03% of its issued share capital) at the weighted average purchase price per share of EUR 47.1205 and for an overall price of EUR 14,607,365.00. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 28-Sep-26 70,000 45.5195 3,186,365.00 XPAR 29-Sep-26 60,000 47.2025 2,832,150.00 XPAR 30-Sep-26 60,000 46.8866 2,813,196.00 XPAR 1-Oct-26 60,000 47.0945 2,825,670.00 XPAR 2-Oct-26 60,000 49.1664 2,949,984.00 XPAR Total for Period 310,000 47.1205 14,607,365.00 Following the share buybacks detailed above, the Company holds in total 15,583,565 treasury shares, which represents approximately 1.7% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3414.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 5 Oct 2026 13:00:31 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces timing for third quarter 2026 earnings release and conference call]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release third quarter 2026 earnings before the opening of trading on the European Stock Exchanges on October 29, 2026. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its third quarter 2026 financial results and current business outlook on October 29, 2026 at 9:30 a.m. Central European Time (CET) / 4:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until November 13, 2026. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-timing-for-third-quarter-2026-earnings-release-and-conference-call-c3413.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 5 Oct 2026 07:00:59 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics delivers advanced context-aware sensors in ST Sustainable Technology framework]]></title>
	<description><![CDATA[STMicroelectronics’ newest miniature motion sensors feature enhanced precision for accurate event reconstruction while meeting the most stringent sustainable-materials standards. The new 6-axis sensors, or inertial measurement units (IMU), will be used in consumer devices like fitness trackers, smart tags, and professional applications such as industrial asset monitors, robots, and drone applications including photography and agricultural surveying. They are part of the ST Sustainable Technology initiative that drives responsible product development. Sensors that support event reconstruction let smart applications distinguish between different types of incidents, enhancing capabilities such as accident alerting, tool-usage monitoring, robot teaching, sports-performance analysis, and concussion detection. ST’s new IMUs, the consumer-oriented LSM6DSK320X and industrial-grade ISM6HGK256X, achieve this with an advanced super-symmetric gyroscope architecture that increases sensing precision, combined with precise accelerometer tracking across a wide dynamic range. These capabilities also enhance use cases such as drone-flight stabilization, structural-condition monitoring, and game controllers. “By maximizing the signal strength and resilience in an extremely compact form factor, the architecture of our latest 6-axis motion sensors will drive powerful new features in smart applications,” said Simone Ferri, Executive Vice President, MEMS Sub-Group, STMicroelectronics. “Moreover, meeting today’s leading sustainable-materials codes such as BPA-free, Pb-free and others helps smart-tech innovators address environmental and regulatory expectations as these become progressively tougher, encompassing additional classes of materials.” “ST’s new LSM6DSK320X sensor delivers unprecedented vibration immunity that we just had to integrate and take advantage of immediately in our ongoing reference platform development,” said Jay Blackman, Leader, Betaflight. “The LSM6DSK320X IMU is the new performance leader for smart and context-aware consumer technology, including UAVs,” said Dr. Zebo Zhou, Chief Technology Officer, Tianhe (Chengdu). \"Drone flight controllers place extremely demanding requirements on an IMU: the sensor must not saturate during aggressive maneuvers, must maintain low noise under severe vibrations, and must be compact and power efficient. Of all the available devices we have evaluated, ST’s LSM6DSK320X was the best match.” Further technical information: The super-symmetric architecture comprises two mirrored electromechanical structures, acting in counter-phase to each other, thereby cancelling the effects of external vibrations and shocks. Combined with a fully differential signal chain, this structure maximizes detected-signal strength and resilience. The internal structure is also extremely compact, enabling each IMU to contain one gyroscope with two separate accelerometers in a single package. The dual accelerometers allow simultaneous measurement of low-range disturbances up to ±16 g and high-g events up to ±320 g, ensuring these IMUs never miss an event. This contrasts with single-accelerometer IMUs that cannot perform measurements while switching between low-range and high-range modes. The consumer-oriented LSM6DSK320X and industrial-grade ISM6HGK256X also contain ST’s machine-learning core (MLC) that embeds AI processing directly in the sensor to reduce the application’s energy consumption and save system resources. Developers can leverage extra libraries including ST’s Motion XLF, and sensor-fusion and context-awareness software, in addition to basic libraries, that enhance power and flexibility to address diverse applications. The new IMUs are supported within the ST MEMS Studio development environment. The STEVAL-MKI257A adapter board for the LSM6DSK320X and STEVAL-MKI258KA adapter board for the ISM6HGK256X will be available in the eSTore and from distributors by November 2026. The LSM6DSK320X for consumer applications operates over a broad temperature range, from -40°C to +85°C. The industrial-grade ISM6HGK256X handles temperatures from -40°C to +105°C and is included in ST’s 10-year longevity program that assures long-term component availability. The IMUs come in 2.5 mm x 3 mm x 0.83 mm packages and available from $4.6 for the consumer-oriented LSM6DSK320X and $5.1 for the industrial-grade ISM6HGK256X for orders of 1000 pieces.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-delivers-advanced-context-aware-sensors-in-st-sustainable-technology-framework-n4791.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/09/N4791D-Sep-22-2026-Advanced-context-aware-sensors_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Tue, 22 Sep 2026 14:00:58 +0200</pubDate>

</item>

</channel>
</rss>
