<rss xmlns:atom="http://www.w3.org/2005/Atom" version="2.0">
<channel>
	<title>STMicroelectronics News Release</title>
	<link>https://www.st.com/content/st_com/en/press-rss.html</link>
	<description>A Collection of STMicroelectronics News Release</description>
	<language>en</language>
	<lastBuildDate>Mon, 6 Apr 2026 12:10:03 +0200</lastBuildDate>
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	<title><![CDATA[STMicroelectronics Announces Timing for First Quarter 2026 Earnings Release and Conference Call]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release first quarter 2026 earnings before the opening of trading on the European Stock Exchanges on April 23, 2026.   The press release will be available immediately after the release on the Company’s website at www.st.com.   STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its first quarter 2026 financial results and current business outlook on April 23, 2026 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET).   A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until May 8, 2026.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3390.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Fri, 3 Apr 2026 07:00:23 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics Reports on Resolutions to be Proposed at the 2026 Annual General Meeting of Shareholders]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the resolutions to be submitted for adoption at the Annual General Meeting of Shareholders (AGM) which will be held in Amsterdam, the Netherlands, on May 27, 2026.   The press release is available as a PDF here.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3389.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 26 Mar 2026 22:46:38 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics China-manufactured STM32 microcontrollers begin volume production]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announces the start of general-purpose STM32 microcontroller deliveries manufactured in China. The first batch of STM32 wafers fully produced in China by Huahong for ST is now being delivered to customers in China. This milestone is a major step forward in ST global supply chain strategy, with additional STM32 families, including performance-oriented, secure, and entry-level microcontroller series, planned for local volume production in 2026.   \"Bringing STM32 MCUs to mass production in China is a core commitment of ST to its Chinese customers. In collaboration with Huahong, ST is bringing the very same market-leading products to customers with a secure, reliable, and resilient local microcontroller supply chain. ST will continue to respond to the needs of its Chinese customers with greater speed and precision,” said Henry Cao, Executive Vice President, Sales & Marketing, China Region, STMicroelectronics.   Through this collaboration, STMicroelectronics has become the industry\'s first global semiconductor company with a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China. The company has established a fully localized STM32 supply chain, covering all stages from wafer manufacturing to chip packaging and testing.   In front-end wafer manufacturing, ST has strengthened its 15-year partnership with Huahong, leveraging the identical 40 nm embedded non-volatile memory (eNVM) technology and quality control standard as in ST\'s global fabs, to ensure seamless compatibility of China-manufactured products with ST’s global quality standards. The packaging and testing are handled by ST\'s Shenzhen fab and local semiconductor assembly and test (OSAT) partners.   This manufacturing model offers customers in China a unique dual-supply choice between MCUs manufactured locally and those produced outside China, while maintaining globally consistent quality and compatibility.   Product availability (2026-2027) First product with a China for China supply chain STM32H7 series Mature, high-performance general-purpose series, for industrial systems smart home systems with more advanced graphical displays, personal electronics, and medical applications.   Status: mass production has begun for initial product models of the H7 series, with additional product models scheduled to enter mass production by end of 2026.  Next products STM32H5 series Performance-oriented general-purpose series boosts performance and security, with applications including pluggable optics modules in datacenters as well as a broad range of consumer and industrial systems including air conditioners, home appliances, security systems, pumps, lighting, power conversion, PC peripherals, and smartphone accessories.   Status: Mass production planned by end of 2026.   STM32C5 series Entry-level microcontroller series targeting applications such as industrial automation, home appliances, motor control, digital power, medical, and consumer applications such as gaming and wearables.   Status: Mass production planned by end of 2026.    About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4767.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/stm32-china-PR_IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Manufacturing]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 23 Mar 2026 07:01:19 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics expands 800 VDC AI datacenter power conversion portfolio with new 12V and 6V architectures in collaboration with NVIDIA]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the expansion of its 800 VDC power conversion portfolio with two new advanced architectures: 800 VDC to 12V and 800 VDC to 6V. Developed according to the NVIDIA 800 VDC reference design, these new power conversion stages complement the previously introduced 800 VDC to 50V solution. The rapidly emerging 800 VDC data center architecture enables higher energy efficiency, reduces power losses, and supports more scalable, high compute density, infrastructure for hyperscalers and AI compute.   “As AI infrastructure compute scale continues to expand fast, it requires higher voltage distribution and greater density, which can only be achieved with system-level innovation for each of the different AI server form factors,” said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office at STMicroelectronics. “With these new converters for 800 VDC power distribution, ST brings a complete set of solutions to support the deployment of gigawatt-scale compute infrastructure with more efficient, scalable, and sustainable power architectures.”   A complete 800 VDC ecosystem for the different AI server form factors   The expansion to 12V and 6V output stages reflects the industry move toward different server architectures requiring different power delivery topologies depending on GPU generation, server height, form factor, and thermal envelope for large-scale training clusters, inference farms, and high-density AI infrastructures. The 50V, 12V, and 6V intermediate DC buses will all coexist in AI data centers depending on rack density, GPU configuration, and cooling strategy.   The new 800 VDC to 12V converter enables high-efficiency distribution from rack-level power shelves directly to the voltage domains that feed advanced AI accelerators.   The new 800 VDC to 6V path allows OEMs to reduce the number of conversion stages and move the 6V bus closer to the GPU. This reduces copper usage, minimizes resistive losses, and improves transient performance, a critical differentiator for large-scale training clusters.   Back in October 2025, STMicroelectronics introduced a fully integrated prototype power‑delivery system showcasing a compact GaN‑based LLC converter operating directly from 800 V at 1 MHz with over 98% efficiency and exceptional power density in a smartphone‑sized footprint exceeding 2,600 W/in³ at 50 V.   The three solutions combine ST technologies across power semiconductors (silicon, SiC, GaN), analog and mixed-signal, and microcontrollers.   Technical highlights of the new 12V and 6V architectures   Direct 800 VDC to 12V high-efficiency conversion: ● Eliminates the traditional 54V intermediate stage, reducing conversion steps and system-level losses. ● Enables higher rack-level efficiency, lower copper usage, and simplified integration for future GPU generations. ● Includes newly developed high-density power delivery board (PDB) achieving efficiency targets exceeding the sum of previous two-stage conversion paths.   800 VDC to 6V architecture for GPU-nearing conversion: ● Is designed for system builders who require power stages closer to the GPU, minimizing IR drop and improving response under fast load transients. ● Completes the topology portfolio for servers with ultra dense GPU configurations.   Additional technical information at https://blog.st.com/800-v-hvdc-data-center/   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4766.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/T4766D-Mar-17-2026-ST-expands-800-VDC-AI-datacenter-power-conversion_PR-IMAGE.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Tue, 17 Mar 2026 08:01:26 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module]]></title>
	<description><![CDATA[STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, 3D scene-mapping, and motion sensing with the NVIDIA Holoscan Sensor Bridge technology, the module integrates natively with NVIDIA Jetson and NVIDIA Isaac open robot development platform, simplifying and accelerating vision system design within the size, weight, and power constraints of humanoid robots.   “Humanoid robotics is moving beyond research projects and demonstrations to deliver powerful new machines for a wide range of roles in manufacturing and automotive factories, logistics and warehousing, as well as retail and customer service,” said Marco Angelici, Vice-President of Marketing and Application for Analog Power MEMS and Sensors, at STMicroelectronics. “Our collaboration with Leopard Imaging brings market-leading ST sensors and actuators, seamlessly integrated into the NVIDIA robotics ecosystem, to accelerate the deployment of physical AI applications with human-like awareness.”   “Accessing to ST sensors and actuators directly within the ecosystem has allowed us to standardize and streamline data acquisition and logging for humanoid robot vision across the HSB interface,” said Bill Pu, CEO of Leopard Imaging. “Robot builders can use our multi-sensing vision module with Isaac tools to accelerate learning and quickly bridge the ‘sim-to-real’ gap.”   Powered by the NVIDIA Holoscan Sensor Bridge, the new module integrates seamlessly with NVIDIA Jetson over ethernet for real-time sensor data ingestion and NVIDIA Isaac open robot development platform, which offers open AI models, simulation frameworks and libraries for developers. The new module includes a build system and application programming interfaces (APIs), artificial intelligence (AI) algorithms curated for mobile robots, sample applications, domain randomization, and a simulation environment containing sensor models.   ST continues to integrate its sensors, drivers, actuators, controllers, and development tools into the NVIDIA robotics ecosystem as a key NVIDIA robotics and edge AI partner, including high-fidelity models and proof-of-concept modules.   Technical information The Leopard Imaging Systems vision module incorporates:   For vision-based sensing, the ST VB1940 automotive-grade RGB-IR 5.1-megapixel image sensor with combined rolling shutter and global shutter modes. ST has also released a mass market and industrial version V**943, part of the ST BrightSense product family, existing in monochrome or RGB-IR, in die or packaged sensor.   For motion sensing, the LSM6DSV16X 6-axis inertial measurement unit (IMU) embeds ST machine-learning core (MLC) for AI in the edge, sensor-fusion low-power (SFLP), and Qvar electrostatic sensing for user-interface detection.   For 3D depth sensing, the VL53L9CX dToF all-in-one LiDAR module, part of the ST FlightSense product family, provides 3D depth sensing with accurate ranging up to 9 meters. With its resolution of 54 x 42 zones (near 2,300 zones) combined with a wide 55°x42° FoV providing 1° angular resolution, short and long-distance measurements and small objects detection are achievable at up to 100 fps.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.   About Leopard Imaging Inc. Headquartered in Silicon Valley and founded in 2008, Leopard Imaging is a global leader in AI vision innovation, advancing computational imaging performance across autonomous machines, smart drones, AI-enabled IoT, robotics, automation, and medical technologies. Additional information is available at www.leopardimaging.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4765.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/pr2602Leopard_s.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 16 Mar 2026 22:31:57 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics accelerates global adoption and market growth of Physical AI with NVIDIA]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the acceleration of global development and adoption of physical AI systems, including humanoid, industrial, service and healthcare robots. ST is integrating its comprehensive portfolio for advanced robotics, into the reference set of components compatible with the NVIDIA Holoscan Sensor Bridge (HSB). In parallel, high-fidelity NVIDIA Isaac Sim models of ST components are being integrated into both companies’ robotics ecosystems to support faster, more accurate sim-to-real research and development. The first deliverables available to developers today include the integration of Leopard’s depth camera enabled by ST with the NVIDIA HSB and the high-fidelity model of an ST IMU into NVIDIA’s Isaac Sim ecosystem.   “ST is well engaged within the robotics community, providing robust support and a well-established ecosystem,\" said Rino Peruzzi, Executive Vice President, Sales & Marketing, Americas & Global Key Account Organization at STMicroelectronics. \"Our collaboration with NVIDIA aims to unleash the next wave of cutting-edge robotics innovation with developer and customer experience streamlined at every step, from the inception of AI algorithms to the seamless integration of sensors and actuators. This will accelerate the evolution of sophisticated AI-driven physical platforms.”   “Accelerating the development of next-generation autonomous systems requires high-fidelity simulation and seamless hardware integration to bridge the gap between virtual training and real-world deployment,” said Deepu Talla, Vice President of Robotics and Edge AI at NVIDIA. “The integration of STMicroelectronics’ sensor and actuator technologies with NVIDIA Isaac Sim, Holoscan Sensor Bridge and Jetson platforms provides developers with a unified foundation to build, simulate and deploy physical AI at scale.”   Simplifying sensor and actuator integration with the Holoscan Sensor Bridge   With the NVIDIA HSB, developers can unify, standardize, synchronize, and streamline data acquisition and logging from multiple ST sensors and actuators, a critical foundation for building high fidelity NVIDIA Isaac models, accelerating learning, and minimizing the sim to real gap.   The goal is to simplify the process of connecting ST sensors and actuators to NVIDIA Jetson platforms through pre-integrated solutions for the combination of STM32 MCUs, advanced sensors (including IMUs, imagers, and ToF devices) and motor‑control solutions, particularly for humanoid robot designs. Leopard Imaging’s stereo depth camera for robots is the perfect example. Using ST imaging, depth and motion-sensing technologies, it is expected to support a broad wave of designs across Physical AI OEMs, academic research groups and the industrial robotics community.   Reducing cost, complexity challenges with high-fidelity modeling for Omniverse Isaac   Advanced robotics developers face high development costs, in addition to modeling challenges. High‑fidelity simulations with extensive randomization demand substantial GPU and CPU resources and large datasets. Selecting which parameters to randomize, and over what ranges, requires deep domain expertise. Poor choices can result in unrealistic scenarios or inefficient training. Finally, excessive variability can confuse models, slow convergence, and degrade real‑world performance when randomization no longer reflects plausible conditions.   ST and NVIDIA’s objective is to provide accurate, hardware-calibrated models for the comprehensive portfolio of ST components matching the requirements of advanced robotics. Following the availability of the first model of an IMU, ST is working to bring developers models of ToF sensors, actuators and other ICs derived from benchmark data collected on real ST hardware, using ST tools to capture accurate parameters and realistic behavior, resulting in models optimized to NVIDIA’s Isaac Sim ecosystem. NVIDIA HSB is being integrated into ST’s toolchain collaboratively.   As a result, ST and NVIDIA envision that more accurate models will significantly improve robot learning. With models that closely mirror real-world device behavior, robots can learn from simulations that better reflect actual conditions, shortening training cycles and lowering the cost of building and refining humanoid robotics applications.   More information on NVIDIA Holoscan Sensor Bridge (HSB) is accessible here.   More information on ST solutions to accelerate physical AI development with NVIDIA is accessible here.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4764.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/PR2603Robot-small.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 16 Mar 2026 22:01:21 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics propels new era of ultra-wideband technology for automotive and smart device applications]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an ultra-wideband (UWB) chip family that comprehensively supports the next-generation wireless standard for localizing and tracking devices at distances up to several hundred meters. This UWB chip family combines extended range with greater processing power and robustness to enable new and improved automotive, consumer, and industrial use cases, including secure digital access control, presence and motion sensing, and precise approach detection.   “The ST64UWB family we announce today is an industry-first system-on-chip supporting the latest ultra-wideband specification, IEEE 802.15.4ab including narrow-band assistance radio, with ultra-precise ranging and sensing,” said Rias Al-Kadi, General Manager, Ranging and Connectivity Division, STMicroelectronics. “These chips are tailored for automotive, consumer, and industrial applications, providing innovators with a powerful platform for the next wave of ultra-wideband use cases.”     The emerging standard builds on the IEEE 802.15.4z UWB wireless technology in today’s hands-free digital car keys that unlock a vehicle on approach. New technical enhancements enabled by multi-millisecond ranging (MMS) and narrowband assistance (NBA) extend operating range, strengthen connections with devices carried in bags or rear pockets, and enable direction finding at close range to better interpret user intent. IEEE 802.15.4ab also enhances radar mode, improving use cases such as child presence detection (CPD) in vehicles, a potentially life-saving feature recommended by Euro-NCAP, the independent vehicle safety assessment organization.   The devices are now sampling to major Tier 1s and original equipment manufacturers.   Why IEEE 802.15.4ab and ST64UWB matter “IEEE 802.15.4ab is set to become the backbone of next-generation ultra-wideband,” said Andrew Zignani, Senior Research Director at ABI Research. “By 2030, we expect the vast majority of ultra-wideband equipped vehicles to migrate to this new standard, leveraging a rapidly growing installed base of hundreds of millions of compatible smartphones. Meanwhile, backward compatibility with IEEE 802.15.4z allows the industry to adopt these enhancements quickly without disrupting existing deployments, while enabling valuable new user experiences and services across multiple end markets.”   “IEEE 802.15.4ab is the foundation for enabling a new generation of key fobs as part of a digital key system,” said Daniel Siekmann, Head of Car Access HW D&D Team, Forvia Hella. “It offers more than eight times the range of 802.15.4z and significantly better non-line-of-sight performance, which allows for key fob functionality to reliably perform from a back-pocket or inside a bag. With backward compatibility to 802.15.4z, it provides a practical path to replace legacy HF/LF key fobs with a modern ultra-wideband based architecture, a transition that is further enabled by STMicroelectronics’ new ST64UWB chips.”   “With IEEE 802.15.4ab, the ability to drastically increase UWB performance, especially when the smartphone is left in the rear pocket, is highly appreciated,” said Bernd Bär, Expert Product Line Technology, Marquardt. “At the same time, operating within tight global homologation limits while remaining backward compatible with existing IEEE 802.15.4z ecosystems tremendously extends the applicability of UWB systems.”   \"Over the last decade, Nuki has helped establish and shape the smart lock category in Europe. We firmly believe Ultra-Wideband is a transformative technology for precise, hands-free unlocking,” said Jürgen Pansi, Chief Innovation Officer, Nuki Home Solutions. “Together with STMicroelectronics and their ST64UWB solution, we are showcasing how the IEEE 802.15.4ab standard can bring the power of Aliro and UWB to our region.”     Further information for editors The three SoCs introduced today (ST64UWB-A100, ST64UWB-A500, and ST64UWB-C100) are built on 18 nm FD-SOI process that boosts link budget by nearly 3dB versus standard bulk technologies, extending range by roughly 50% beyond the gains already delivered by the IEEE 802.15.4ab standard.   The ST64UWB-A series, designed for automotive applications and starting with the ST64UWB-A100 for use cases such as digital key and precise vehicle localization, features an Arm® Cortex®-M85 core and supports ASIL A(B) automotive safety concept. The ST64UWB-A500 adds AI acceleration and digital signal processing to support edge AI-powered radar applications, including child presence detection (CPD), kick sensing, and outward-facing use cases, such as parking sensors and radar-based vehicle-sentinel mode. These radar capabilities benefit from the new 15.4ab Kaiser pulse shape and the upgraded 1.3 GHz bandwidth of UWB channel 11, resulting in twice the accuracy compared to 500 MHz channels.   The ST64UWB-C100, built on an Arm Cortex-M85 core, targets commercial and consumer applications, delivering best-in-class handsfree and tap free user experiences with full Aliro standard compatibility.   ST is accelerating next-generation UWB adoption with comprehensive development kit including UWB stack (PHY/MAC), radar toolbox, development boards, reference design for antennas, and application examples for both automotive and consumer markets.   Find out more on product specification and 802.15.4ab technology at www.st.com/uwb.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4760.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/uwb-PR-image-lores.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Tue, 10 Mar 2026 08:31:03 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters. The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge.   “Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle,” said Fabio Gualandris, President, Quality, Manufacturing & Technology, STMicroelectronics. “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.”   “The data center pluggable optics market continues to expand strongly, reaching $15.5 billion in 2025. We expect the market to grow at a compound annual growth rate (CAGR) of 17% from 2025 through 2030, surpassing $34 billion by the end of the forecast period. In addition, co-packaged optics (CPO) will emerge as a rapidly growing segment, contributing more than $9 billion in revenue by 2030. Over the same period, the share of transceivers incorporating silicon photonics modulators is projected to increase from 43% in 2025 to 76% by 2030,” said Dr. Vladimir Kozlov, CEO and Chief Analyst at LightCounting. “ST’s leading silicon photonics platform coupled with its aggressive capacity expansion plan illustrates its capabilities to provide hyperscalers with secure, long-term supply, predictable quality, and manufacturing resilience.”   Upcoming PIC100 TSV Platform Technology   AI infrastructure is experiencing unprecedented scaling, with cloud-optical interconnect performance becoming a critical bottleneck. Drawing on years of silicon photonics innovation, ST’s PIC100 platform provides state-of-the-art optical performance, including best-in-class silicon and silicon nitride waveguide losses (respectively as low as 0.4 and 0.5 dB/cm), advanced modulator and photodiode performance, as well as an innovative edge coupling technology.   In parallel with high-volume PIC100 production, ST is planning to introduce the next step in its silicon photonics technology roadmap: the PIC100 TSV, a new and unique platform that integrates through-silicon via (TSV) technology to further increase optical connectivity density, module integration, and system-level thermal efficiency. The PIC100 TSV platform is designed to support future generations of Near Packaged Optics (NPO) and co-packaged optics (CPO), aligning with hyperscalers’ long-term migration paths toward deeper optical–electronic integration for scale up.   ST at OFC 2026   ST will discuss business and technology roadmap updates at the upcoming Optical Fiber Communication Conference® (March 15-19th), Los Angeles, USA:   - paper titled “An Innovative 300mm Back Side Integrated Silicon Photonics Platform for 200Gbits/lane Applications” - First PIC100-based demo of a 1.6T-DR8 silicon photonics transceiver, engine by Sicoya and STMicroelectronics. See it on the Sicoya booth #507 - Participation to the CEA-Leti event: “Optical Interconnects: Driving Innovation in AI Factory and Beyond” (March 18, 6-8pm PT)   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com   Forward-looking Information Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:   • changes in global trade policies, including the continuation, adoption and expansion of tariffs and trade barriers and sanctions, that are affecting and could further affect the macro-economic environment and are adversely impacting and could further adversely impact the demand for our products; • uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which are impacting and may further impact production capacity and end-market demand for our products; • customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all; • the ability to design, manufacture and sell innovative products in a rapidly changing technological environment; • changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities; • unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding; • financial difficulties with any of our major distributors or significant curtailment of purchases by key customers; • the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers; • availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation); • the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology; • theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation; • the impact of IP claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions; • changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets; • variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations; • the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant; • product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts; • natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate; • increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027; • epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results; • industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; • the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and • individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action or additional research costs.   Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.   Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2025 as filed with the Securities and Exchange Commission (“SEC”) on February 26, 2026. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.   Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our SEC filings, could have a material adverse effect on our business and/or financial condition.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4761.html</link>
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	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 9 Mar 2026 08:01:28 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new generation of entry-level microcontrollers (MCUs) to boost the performance of billions of tiny smart devices throughout factories, homes, cities, and infrastructures while meeting extreme cost, size, and power limitations.   The new STM32C5 series is aimed at consumer and professional devices like smart thermostats, electronic door locks, industrial smart sensors, robotic actuators, wearable electronics, and computer peripherals.   “The new STM32C5 elevates the precision, speed and reliability of competitively priced MCUs to realize the potential in these opportunities. It builds on two decades of STM32 heritage and is part of our ambition to deliver the broadest, most scalable and secure portfolio from entry-level devices to advanced MCUs that redefine the application reach of embedded systems,” said Patrick Aidoune, Group Vice President and General Purpose and Automotive Microcontrollers Division General Manager, STMicroelectronics.   Thanks to an improved design based on ST’s proprietary 40nm manufacturing process, the STM32C5 MCUs can run tasks noticeably faster than many entry-level chips used today. This gives products more room to include modern features such as improved sensing, smoother control, and enhanced user experiences—all while keeping dynamic power consumption low.   The STM32C5 MCUs integrate built-in protections that help safeguard products against tampering and cyber risks. These security features support safer connected devices, a growing priority across consumer and industrial markets.   Users of the new STM32C5 series can enjoy an upgraded STM32Cube environment, now with size-optimized, production-grade drivers to leverage the many hardware features. The modernized ecosystem also introduces enhanced code generation and development tools as well as extended production-ready software examples. Benefiting from continuous updates, the STM32Cube environment is all about helping developers code faster and more efficiently, while maximizing the end-product capabilities.   “At SIT, we work in safety-critical gas and HVAC environments where reliability is essential. For our new generation of Burner Integrated Control platform, choosing the STM32C5 was a natural decision as it provides strong and predictable real-time performance, enabling us to manage combustion, flame detection, and safety interlocks with accuracy, even within a compact footprint. We were able to reuse a large part of our validated firmware, speeding up development, simplifying certification; and the result is a robust and scalable control platform designed for long-term reliability and compliance,” explained Dennis Agnello, Electronics Business Line Director, Heating & Ventilation, SIT Group.   “The STM32C5 provides the performance and feature set enabling us to develop a cost-efficient next generation AC charger for both public and private use, fully aligned with latest security, encryption, and interface requirements for metering and EV charging solutions. Throughout the project, ST provided the flexibility and comprehensive ecosystem support we needed to reduce development time and solve key functional and cost challenges to bring our product faster to the market,” said Enrique Osorio, R&D Director, Circontrol (Grupo Circutor).   STM32C5 MCUs are entering production now, targeting packages from 3mm x 3mm UFQFPN20 to 20mm x 20mm LQFP144. STM32 Nucleo evaluation boards, and a display extension board from Riverdi with TouchGFX development software for building entry-level graphical user interfaces, are ready to assist development.   Prices start at $0.64 for orders of 10,000 units.   Technical information The new STM32C5 MCUs leverage an innovative implementation of the advanced Arm® Cortex®-M33 embedded processor. While Arm’s core delivers advanced performance and efficiency, ST’s proprietary 40 nm manufacturing process is cost-efficient, supports higher clock speed, and enables memory above 512Kbyte where lower density technologies are uncompetitive. STM32C5 MCUs come with on-chip Flash from 128Kbyte, making Cortex-M33 performance accessible at an attractive price for entry-level applications otherwise limited to lower-performing Cortex-M0 and Cortex-M23 devices. Devices are available with up to 1Mbyte, providing generous code and data storage for product designers to create sophisticated new features.   Implementing the Arm Cortex-M33 core at the 40 nm node brings improved arithmetic performance to entry-level devices at competitive cost and low power. This accelerates computations such as embedded digital filters in sensor signal conditioning, noise suppression, and debouncing. In addition, the power supply scheme, comprising a single low-dropout (LDO) regulator, permits extra user I/O pins. There is also direct memory access (DMA), which helps save power, sharpen system responses, and simplify software. Moreover, with two instances, each having at least four channels to permit two fetches in parallel, DMA on the STM32C5 is a valuable tool for developers to boost application performance.   The MCUs target SESIP3 and PSA Level 3 security certifications, with memory protection, tamper protection, cryptographic engines (symmetrical encryption with AES and hashing algorithm), and temporal isolation (HDP) to protect processes such as secure boot and firmware update. The STM32C59x and STM32C5A3 variants have additional security including hardware unique key support (HUK), secure key storage and hardware cryptographic accelerators for symmetric and asymmetric operations with protection against side-channel attacks.   Designed for demanding industrial environments, the device delivers robust performance even in harsh networking conditions. It supports a wide ambient temperature range from -40°C to 125°C, with a junction temperature up to 140°C. Even at the maximum operating temperature, the device can run at its maximum rated frequency, ensuring consistent performance across the full temperature range. STM32C5 enables compliance with industrial safety standards, including IEC 61508 SIL-2 and IEC 60335-1/60730-1 Class-B, by integrating essential hardware and software features.   Enhancements to the development ecosystem include a new STM32CubeMX flavor, STM32CubeMX2, which introduces a preview feature that allows faster access to reference code thereby accelerating development and easing code reuse. Also new in the STM32CubeC5 embedded software offer, the latest code-size optimized hardware abstraction layer (HAL2), gives access to all MCU features and allows more of the MCU’s memory to be used for application code.   Alex Fabre, Embedded Software Expert at ST Authorized Partner RTONE, has experienced the new tools, commenting: “STM32 HAL2 makes developing with the STM32C5 and other family members faster and more efficient. It is much lighter, closer to hardware functions, and porting our code to other STM32 MCUs is extremely easy.”   The comprehensive ecosystem also gives developers:   • STM32C5 hardware evaluation tools enabling faster prototyping and offering reference hardware design guidelines • A new examples library offering faster access to a large number of STM32C5 production-ready code examples, simplifying the use of the STM32C5 features and accelerating development • A choice of two free integrated development environments (STM32CubeIDE and STM32CubeIDE for VSCODE) for faster development and debug • STM32Cube ecosystem with optimized porting of popular middleware including FreeRTOS, LwIP, USBX and FileX   More information on the STM32C5 can be found here: www.st.com/stm32c5   STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4754.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/P4754S-Mar-5-2026-STM32C5-MCUs_IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 5 Mar 2026 08:01:00 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics’ sensor and secure wireless technologies support Snapdragon Wear Elite]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, now supports leading-edge motion-sensing and secure wireless technologies on Qualcomm Technologies’ newly launched personal AI platform, Snapdragon Wear™ Elite. ST components help unlock richer always on sensing, unprecedented power efficiency, and breakthrough user experiences for the next generation of truly personal, responsive wearable computing devices, enabling advanced use cases like activity recognition and health and lifestyle monitoring.   “Our collaboration with Qualcomm Technologies reinforces ST’s position as a trusted partner for leading wearable platforms, delivering innovative sensors and low power AI at the edge,” said Simone Ferri, Executive Vice President MEMS Sub-Group, STMicroelectronics. “By combining ST’s pre-validated reference designs and software with Snapdragon’s new personal AI platform, OEMs can utilize ready-to-use solutions that accelerate time to market, simplify integration, and deliver always-ready, smart wearables.”   “Snapdragon Wear Elite transforms the wearable experience through always-on intelligence and superior connectivity,” said Dino Bekis, SVP and GM, Wearable AI, Qualcomm Technologies Inc. “STMicroelectronics’ ultra-low power sensing and security elements are a natural complement to our platform. Together we are pushing the boundaries of what next-generation wearables can achieve in the age of Personal AI.”   Smart inertial module with machine learning   Supporting Snapdragon Wear Elite’s intuitive on-device intelligence, ST’s LSM6DSV32X smart inertial module with machine-learning capabilities performs common pattern-recognition tasks, such as activity classification, gesture detection, and context awareness, at microamp-level current consumption. Distributing AI between the ST sensor and the Snapdragon Wear Elite offloads the main application processor, enabling advanced use cases such as continuous activity recognition and health and lifestyle monitoring without compromising battery or form factor.   In addition to better battery life through continuous low power sensing, the LSM6DSV32X inside the Snapdragon Wear Elite platform also delivers more accurate and frequent tracking, including posture and specialized activity metrics; more responsive interactions thanks to real time decision-making in the sensor; as well as improved reliability through reduced wake-ups and optimized data transfer.   Secure contactless services enabler   A comprehensive connectivity suite of Snapdragon Wear Elite is enriched when integrated with ST’s ST54L NFC controller with embedded secure element, ensuring seamless deployment of multiple contactless services including secure payments, transportation ticketing, access control including digital car keys, and cellular network connectivity.   An industry-recognized reference in the Android ecosystem, ST’s secure NFC technology perfectly complements the rich set of connectivity options within Snapdragon Wear Elite for a superior connection and precise location tracking virtually anywhere.   With comprehensive documentation, development tools, global support, and alignment across ST and Qualcomm Technologies’ ecosystems, this collaboration will allow OEMs to benefit from reduced technical risk and faster time from prototype to mass production.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com   Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Snapdragon and Snapdragon Wear are trademarks or registered trademarks of Qualcomm Incorporated.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4758.html</link>
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	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 2 Mar 2026 22:10:12 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics to host investor calls on Cloud AI and Intelligent Sensing Enabling Physical AI]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) will host two webcasts for investors and analysts in March 2026.   “ST for Cloud AI”, hosted by Remi El-Ouazzane, President of ST’s MDRF Group. Conference call & webcast on March 9, 2026, at 3.30pm CET / 10.30am ET. “ST Intelligent Sensing Enabling the Physical AI”, hosted by Marco Cassis, President of ST’s APMS Group. Conference call & webcast on March 16, 2026, at 3.30pm CET / 10.30am ET.   Presentations will be followed by a Q&A session. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3388.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 2 Mar 2026 08:15:01 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics powers up next-generation digital access control with Aliro-compliant wireless and secure technologies]]></title>
	<description><![CDATA[STMicroelectronics has revealed its contribution to accelerating widespread availability of secure, interoperable access-control technology to unlock doors and openings with smartphones, wearables, and other access-control devices.   On February 26, the Connectivity Standards Alliance (Alliance) published Aliro 1.0, giving the industry a standardized protocol to exchange access credentials between digital devices. As a member and active contributor to the Aliro Working Group within the Alliance, ST has now made available engineering resources that accelerate design of Aliro readers and ease compliance testing for market-ready products. The reader device is critical for smart locks to check digital wallet credentials.   Compared to mechanical keys, PIN-pads, and contactless cards, access control with Aliro using smartphones, wearables, or other devices combines wireless convenience and flexible operating range with strong electronic security. In addition, Aliro systems can provide hands-free convenience and intelligent localization-related responses, with essential application-level advantages of digital keys, such as privacy, shareability, and configurable user privileges.   Aliro leverages established near-field communication (NFC), Bluetooth® LE, and ultra-wideband (UWB) technologies to provide the underlying platform for wireless communications. Benefiting from ubiquity, as all are supported in smartphones already in users’ hands, these technologies permit flexible use cases operating over distances from a few centimeters to 100 meters or more.   “We are ready to give device makers everything they need to build Aliro-compliant products. ST offers the complete portfolio of connectivity and security solutions to support all three Aliro configurations, from NFC-only to NFC + Bluetooth® Low Energy up to NFC + Bluetooth® LE + UWB for hands-free access,” said Luca Verre, Group Vice President, Microcontrollers, Digital ICs and RF products Group Strategy, STMicroelectronics. “With our Aliro technology expertise, long-term solution availability and decades of experience in security and connectivity, we enable customers to accelerate development and confidently bring next-generation access solutions to market.”   “STMicroelectronics has been instrumental in making Aliro real — not just through their contributions to the specification, but by investing in the reference designs and development tools that make it easier for the entire industry to build to the standard. That\'s exactly what accelerates adoption: removing complexity so companies can get to market faster. We\'re proud to work alongside ST in delivering this foundation,” said Tobin Richardson, Alliance President and CEO, Connectivity Standards Alliance.   Accelerating time to market for product developers and manufacturers, ST’s engineering package available today includes the X-CUBE-ALIRO software package, now integrated in STM32Cube, together with a reference design (STEVAL-ALOCKCB) that leverages ST microcontrollers and wireless connectivity products to help customers build their Aliro-compliant devices.   The X-CUBE-ALIRO package provides a reference software implementation of CSA Aliro 1.0 protocol for reader devices, compliant with technical and interoperability requirements defined by the standard, envisioning also the integration in Matter for provisioning. Completing the Aliro-enablement toolset for reader makers, the reference design including the board layout is proven and tested, documented with CAD files and bill of materials, and can be customized if required.   ST’s microcontroller and wireless connectivity portfolio including ST25 NFC readers, multiple types of STM32 microcontrollers including Bluetooth-enabled devices, and ultra-wideband (UWB) ICs, offers a one-stop-shop for Aliro-ready devices to support all the specified wireless technology configurations. The Aliro offer from ST also includes the STSAFE-A embedded secure element for digital key storage.   ST’s engineering package connects developers with support and resources, including the reference design, software package, and hardware. In addition to easing design and overcoming known RF-system design challenges such as board layout through SoC integration, ST hardware and software tools ease end product testing for compliance and interoperability, enabling developers to rapidly certify their new products.   ** At embedded world 2026, Nuki Home Solutions will showcase a complete solution for Aliro, based on ST’s reference design and software package on the ST booth. “The Aliro protocol and ST’s associated developer package enable smart door locks to deliver a seamless, secure unlock experience. Our mission is to adapt these global technologies to the specific needs of European doors, ensuring that future residential access solutions deliver peak performance,” said Jürgen Pansi, Chief Innovation Officer, Nuki Home Solutions.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/n4755.html</link>
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	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Fri, 27 Feb 2026 09:00:11 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics Publishes its 2025 Annual Report Form 20-F]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, published its Annual Report on Form 20-F for the year ended December 31, 2025 and filed it with the United States Securities and Exchange Commission (SEC). The Company’s Form 20-F based on U.S. GAAP and complete audited financial statements is available at www.st.com and will be available at www.sec.gov.   A hard copy version of the report is available free of charge from ST’s Investor Relations Department: +41 22 929 5920 or investors.st.com.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3387.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 26 Feb 2026 22:56:02 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics President and CEO Jean-Marc Chery to speak at Morgan Stanley investor conference]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) President and Chief Executive Officer Jean-Marc Chery will speak at the Morgan Stanley Technology, Media and Telecom Conference in San Francisco on March 4, 2026 at 12.20pm U.S. Pacific Time / 9.20pm Central European Time.   A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay until March 19, 2026.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3386.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 25 Feb 2026 08:00:04 +0100</pubDate>

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	<title><![CDATA[Path to 100% renewable electricity]]></title>
	<description><![CDATA[Sustainability is at the heart of how ST operates. Our new sustainability magazine, Amplify, shines a spotlight on the people behind our progress and the wide range of sustainability topics we’re working on across ST, from decarbonizing our operations to supporting the communities around our sites.   This article explores how we are transforming our electricity supply to support our carbon neutrality goal, and the strategy, partnerships and teams making it possible.   Path to 100% renewable electricity   Renewable electricity procurement is gaining attention worldwide and behind each announcement is an exciting journey that demands strong commitment to build a credible, company-wide approach. Here, we take a behind-the-scenes look at how we developed a procurement strategy that champions credibility, additionality, and drives meaningful long-term impact.   The power of choice   Sourcing 100% renewable electricity is a cornerstone of our carbon neutrality goal. With operations worldwide, we need a truly global approach that avoids quick fixes or easy solutions in favor of a strategy that works reliably, credibly, and effectively across all locations.   We began with a concept known as the ‘credibility hierarchy’ of renewable energy procurement. This industry-wide model ranks different methods of renewable energy procurement according to the environmental value they deliver. At the top is on-site generation – think solar panels on rooftops or solar arrays in adjacent fields. Next comes off-site generation through Power Purchase Agreements (PPAs), followed by green tariffs and unbundled renewable energy attribute certificates (EACs).   Our strategy prioritizes the most impactful options whenever possible: on-site generation where feasible, PPAs for major electricity needs, and EACs for remaining consumption. This balanced portfolio approach supports our ambitious goal of sourcing 100% renewable electricity by 2027.   Our PPA journey   In reality, relatively few industrial sites can support enough on-site generation to meet their needs. For this reason, we focus on the next best procurement method – PPAs.   So, what exactly is a PPA? Simply put, a PPA is a contract between a corporate buyer (called the ‘off-taker’) and a power producer to purchase electricity at a certain price for a defined period. The electricity can be supplied by existing renewable energy assets or new-build projects, usually a wind or solar farm. A key point here is that the long-term agreement with a guaranteed buyer allows power producers to secure financing for renewable energy projects, enabling investment in additional generating capacity. In other words, PPAs can enable a new source of renewable electricity to be created.   Since signing our first PPA for our Bouskoura site in Morocco in 2021, we have expanded our portfolio with PPAs in Italy, Malaysia, and France. Each new contract builds on lessons learned from previous negotiations, with the most recent agreements in France and Italy representing significant milestones.   The French agreement with Total Energies, which started in January 2025, is particularly notable. It’s a 15-year contract representing 1.5 TWh of electricity, and includes structuration services to transform intermittent production into a constant volume (‘baseload’) of renewable electricity, making it the first PPA of its kind in France.     True team effort   Anyone who’s been involved in the PPA process knows it’s not for the faint-hearted. From initial concept to signed contract, it can take two years or more. For our French PPA, discussions began in October 2022, with operations beginning in January 2025. This process involved setting the project criteria, releasing the tender, selecting partners, and finalizing agreements.   With negotiations involving multiple parties and a high-stakes outcome, they can be complex and require a depth and breadth of expertise from across the company. These complex contracts require input from many departments: Corporate Sustainability, Procurement, Legal, Finance, Tax, Treasury, Manufacturing, and Communications, not to mention buy-in from top leadership.     Additionality in action   What makes these agreements especially meaningful is their ‘additionality’ – the fact that many of these renewable energy projects might not exist without our investment. By committing to purchase power over long periods at agreed prices, we are helping to make these projects financially viable.   For the team members who devoted countless hours to bringing these agreements to life, there’s a profound sense of accomplishment in seeing the actual renewable energy projects in operation. Site visits to the wind farms now supplying our operations with renewable energy, make the impact tangible, allowing team members to witness firsthand the results of their efforts and celebrate with the colleagues and partners who helped make it possible.   Our PPA strategy is a vivid demonstration of our belief that renewable energy procurement isn’t about meeting targets or signaling our virtue – it’s about creating lasting partnerships, enabling new renewable energy projects, and bringing together diverse teams across the company to tackle one of business’s most pressing challenges. It’s a journey that’s transforming not just how we power our operations, but how we secure our future as a truly sustainable business.   This article is one of many featured in our new sustainability magazine. Explore the full issue to discover more initiatives, insights, and perspectives from across ST. st-sustainability-magazine-amplify-vol1-en.pdf]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0016.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 17 Feb 2026 09:44:57 +0100</pubDate>

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	<title><![CDATA[意法半导体发布首款集成AI加速器的汽车微控制器，赋能边缘智能]]></title>
	<description><![CDATA[意法半导体（ST）发布了Stellar P3E，这是首款集成AI加速器、专为汽车边缘智能设计的汽车微控制器（MCU）。Stellar P3E面向未来软件定义汽车开发，可简化 “X合一” 电控单元（ECU）的多功能集成，从而降低系统成本、重量和复杂度。   意法半导体通用和汽车微控制器事业部副总裁兼总经理Luca Rodeschini表示：“Stellar P3E将高性能实时控制与边缘AI技术集成于单一芯片，并满足最高汽车安全等级，为汽车电气化树立了新标杆。其增强的处理能力、AI加速、大容量可扩展存储器、丰富模拟功能、智能传感能力和智能电源管理功能支持虚拟传感器等创新应用，助力汽车制造商打造更安全、更高效、响应更迅速的驾乘体验。”   章鱼博士智能技术（上海）有限公司总经理张建彪表示：“凭借相变存储器闪存技术和边缘AI神经网络加速器（Neural-ART）等先进特性，Stellar P3E是一款卓越的产品，完美契合新能源汽车应用日益增长的需求。”   Stellar P3E的标志性特性是集成ST Neural-ART加速器™，实现实时AI效率——使其成为汽车行业首款嵌入神经网络加速器的MCU。该专用神经网络处理单元采用面向AI工作负载的先进数据流架构，结合丰富的传感能力，可实现智能传感，为虚拟传感器等新应用开辟道路。   这使得P3E能够以微秒级速度完成推理处理，效率较传统MCU核心处理器提升高达30倍。Stellar P3E支持始终在线、低功耗的人工智能（AI），可实现预测性维护和智能传感等实时功能，为广泛应用带来显著优势。例如，这些能力可提升电动汽车的充电速度与效率，并支持在工厂或现场快速部署新功能。原始设备制造商（OEM）可通过不同AI模型引入新功能和更直观的行为，减少额外传感器、模块、布线和集成工作。   Counterpoint Research副总监Greg Basich表示： “将神经处理从集中式枢纽转移至车辆边缘，可实现亚毫秒级决策，这对下一代车载智能至关重要。在MCU层面集成AI硬件加速，使OEM能够提供预测性维护车辆性能和虚拟传感器智能传感等先进功能，实现极低延迟的传感、驱动控制及其他复杂特性，同时避免全规格SoC的成本和热管理负担。”   随着汽车行业向软件定义汽车（SDV）转型，Stellar P3E集成的xMemory（基于意法半导体的相变存储技术）提供了必要的可扩展性与灵活性。该可扩展存储解决方案的密度是传统嵌入式闪存的二倍，且符合汽车环境认证，可动态扩展软件存储空间以适配新功能和更新，无需任何硬件重新设计。   P3E在ST Edge AI Suite中获得全面支持，这是一个面向数据科学家和嵌入式工程师、覆盖从数据集创建到设备部署全流程的完整边缘人工智能生态系统。作为该套件的一部分，NanoEdge AI Studio工具现已支持全系Stellar MCU产品。此外，Stellar P3E已集成至Stellar Studio——意法半导体为汽车工程师量身打造的一体化开发环境中。这些工具共同构建了稳健的硬件与软件生态，旨在优化复杂边缘人工智能解决方案在严苛汽车环境中的部署流程。   预计Stellar P3E将于2026年第四季度投入量产。   技术亮点：   • 500 MHz Arm® Cortex®-R52+内核，其CoreMark评分在同类型产品中位居榜首——超过8,000分 • 分核-锁步架构使设计人员能够优化功能安全与峰值性能的平衡 • 开放的Arm架构，依托庞大的全球开发者社区加速创新 • 丰富的I/O和模拟功能支持多样化应用，包括提升车辆动态性能的先进电机控制   关于意法半导体 意法半导体拥有48,000名半导体技术的创造者和创新者，掌握半导体供应链和先进的制造设备。作为 一家半导体垂直整合制造商(IDM)，意法半导体与二十多万家客户、成千上万名合作伙伴一起研发 产品和解决方案，共同构建生态系统，帮助他们更好地应对各种挑战和新机遇，满足世界对可持 续发展的更高需求。意法半导体的技术让人们的出行更智能，让电源和能源管理更高效，让云连接的自主化设备应用更广泛。我们正按计划在所有直接和间接排放（包括范围1和范围2）、产品运输、商务旅行以及员工通勤排放（重点关注的范围3）方面实现碳中和，并在2027年底前实现 100%使用可再生电力的目标。 详情请浏览意法半导体公司网站：www.st.com.cn]]></description>
	<link>https://newsroom.st.com/zh/media-center/press-item.html/p4749c.html</link>
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	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 12 Feb 2026 14:07:17 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics introduces the first automotive microcontroller with AI acceleration for edge intelligence]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the Stellar P3E, the first automotive microcontroller (MCU) with built-in AI acceleration for automotive edge intelligence. Designed for future software-defined vehicles, the Stellar P3E simplifies multi-function integration for X-in-1 Electronic Control Units (ECUs) that reduce system cost, weight, and complexity.   “Stellar P3E sets a new benchmark for automotive electrification by combining high-performance real-time control and edge AI in a single device that meets the highest automotive safety levels,” said Luca Rodeschini, Group Vice President and General Purpose and Automotive Microcontrollers Division General Manager, STMicroelectronics. “Its increased processing power, AI acceleration, large and extensible memory, rich analogue content, smart sensing capabilities, and intelligent power management functions support new applications such as virtual sensors. This better enables automakers with the tools to create safer, more efficient and more responsive driving experiences.”   A defining feature of the Stellar P3E is its integrated ST Neural-ART Accelerator™ for real-time AI efficiency —making it the first MCU with an embedded neural network accelerator for the automotive industry. Powered by this dedicated neural processing unit (NPU) with an advanced data-flow architecture for AI workloads, and combined with its rich sensing capabilities, the P3E enables smart sensing that opens the door to new applications such as virtual sensors.   The P3E delivers inference processing at microsecond speeds, achieving up to 30x greater efficiency compared to traditional MCU core processors. This enables always-on, low-power artificial intelligence (AI) that can support real-time functions, including predictive maintenance and smart sensing, delivering significant benefits across a wide range of applications. For example, these capabilities can enhance charging speed and efficiency in electric vehicles and enable rapid deployment of new features, whether in the factory or in the field. Original equipment manufacturers (OEMs) can introduce new functions and more intuitive behaviors through different AI models, reducing the need for additional sensors, modules, wiring, and integration effort.   “Shifting neural processing from centralized hubs to the edge of the vehicle enables sub millisecond-level decision-making, which is essential for the next generation of in-vehicle intelligence. Integrating AI hardware acceleration at the MCU level allows OEMs to deliver advanced capabilities, such as predictive maintenance for vehicle performance and smart sensing with virtual sensor applications. This enables very low latency sensing, actuation control, and other sophisticated features, without the cost and thermal burden of a full-scale SoC,” said Greg Basich, Associate Director, Counterpoint Research.   As the automotive industry embraces the shift toward software-defined vehicles (SDVs), Stellar P3E’s integrated xMemory, ST’s proprietary non-volatile memory based on phase-change memory (PCM), provides the essential scalability and flexibility needed. Offering twice the density of traditional embedded flash memory and qualified for automotive environments, this extensible memory solution enables dynamic expansion of software storage to accommodate new features and updates without requiring any hardware redesign.   The P3E is fully supported within the ST Edge AI Suite, a comprehensive edge-AI ecosystem that spans from dataset creation to on-device deployment for data scientists and embedded engineers. As part of this suite, NanoEdge AI Studio tool is now available for the entire Stellar MCU family. In addition, the Stellar P3E is already integrated into Stellar Studio, ST’s all-in-one development environment tailored for automotive engineers. Together they reinforce a robust hardware and software ecosystem designed to streamline the deployment of sophisticated edge AI solutions in demanding automotive environments.   The start of production of the Stellar P3E is planned in the fourth quarter of 2026.   Key technical highlights:   • 500 MHz Arm® Cortex®-R52+ cores delivering the highest CoreMark score in its class - exceeding 8,000 points. • Split-lock architecture enabling designers to optimize the balance between functional safety and peak performance. • Open Arm architecture, leveraging a vast global developer community for accelerated innovation. • Rich I/O and analog capabilities support diverse functions, including advanced motor control for enhanced vehicle dynamics.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4749.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/02/stellar-home-page-image-lores.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Tue, 10 Feb 2026 08:00:11 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics expands strategic engagement with Amazon Web Services to enable new high performance compute infrastructure for cloud and AI data centers]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement serving several product categories. The collaboration establishes ST as a strategic supplier of advanced semiconductor technologies and products that AWS integrates into its compute infrastructure, enabling AWS to provide customers with new high performance compute instances, reduced operational costs, and the ability to scale compute-intensive workloads more effectively.   Commercial Agreement This engagement covers a broad range of semiconductor solutions leveraging ST\'s portfolio of proprietary technologies. ST will supply specialized capabilities across high-bandwidth connectivity, including high-performance mixed-signal processing, advanced microcontrollers for intelligent infrastructure management, as well as analog and power ICs that deliver the energy efficiency required for hyperscale data center operations.   The collaboration will help customers reduce total cost of ownership and bring products to market faster. ST\'s specialized technologies help AWS address the increasing demands for compute performance, efficiency, and data throughput required to support growing AI and cloud workloads.   Jean-Marc Chery, ST President & CEO, commented: \"This strategic engagement establishes ST as an important supplier to AWS and validates the strength of our innovation, proprietary technology portfolio, and proven manufacturing-at-scale capabilities. Our advanced semiconductor solutions will directly power AWS\'s next-generation infrastructure, enabling their customers to push the boundaries of AI, high-performance computing, and digital connectivity. This collaboration positions us ideally for further scale-up across multiple market segments, from data center infrastructure to AI connectivity, positioning ST at the center of the AI revolution.\"   As part of this expanded relationship, ST will work with AWS to optimize electronic design automation (EDA) workloads in the cloud. AWS\'s scalable compute power enables silicon design acceleration, parallelizes design tasks, and gives engineering teams the flexibility to handle dynamic compute demands and speed products to market.   ST has issued warrants to AWS for the acquisition of up to 24.8 million ordinary shares of ST. The warrants will vest in tranches over the term of the agreement, with vesting substantially tied to payments for ST products and services purchased by AWS and its affiliates. AWS may exercise the warrants in one or more transactions over a seven-year period from the issue date at an initial exercise price of $28.38.   Forward-looking Information Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:   • changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and directly or indirectly adversely impact the demand for our products; • uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products; • customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all; • the ability to design, manufacture and sell innovative products in a rapidly changing technological environment; • changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities; • unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding; • financial difficulties with any of our major distributors or significant curtailment of purchases by key customers; • the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers; • availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation); • the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology; • theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation; • the impact of IP claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions; • changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets; • variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations; • the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant; • product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts; • natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate; • increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027; • epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results; • industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; • the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and • individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action or additional research costs.   Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.   Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2024 as filed with the Securities and Exchange Commission (“SEC”) on February 27, 2025. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.   Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our SEC filings, could have a material adverse effect on our business and/or financial condition.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3385.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 9 Feb 2026 07:02:32 +0100</pubDate>

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	<title><![CDATA[Intelligent Sensors: Q&A with Marco Cassis]]></title>
	<description><![CDATA[Marco Cassis, President APMS, explains the importance of sensing technologies for artificial intelligence (AI) and how STMicroelectronics’ acquisition of NXP’s microelectromechanical systems (MEMS) sensors business will help broaden ST’s sensor portfolio to embed more intelligence in new applications and use cases.   Why are intelligent sensors crucial for AI development and emerging physical AI systems?   AI relies on data, and intelligent sensors are the entry points that capture and process this data. For scalable and sustainable AI, sensors must do more than collect information: they need to embed intelligence to enable faster responses, energy efficiency, and privacy protection. This “sense and process” paradigm is a significant opportunity for companies like ST, which lead in both sensing and processing technologies.   Data is the oil that powers the digital economy, and sensors are the engines that extract it from the physical world. ST’s vision is to enable smarter, more efficient devices by integrating AI capabilities directly into sensors. This approach allows sensors not only gather precise data but also analyze it locally, enabling applications across automotive, industrial, consumer electronics, and robotics. The goal is to make sensing more intelligent, efficient and privacy-preserving through edge processing.   How does ST position itself as a leader in sensing?   ST is unique in mastering both MEMS and imaging sensors. The company pioneered these fields over 30 years ago and has shipped more than 30 billion sensors worldwide. MEMS sensors, initially focused on consumer electronics, are now rapidly expanding into automotive and industrial markets due to their compact size, cost-effectiveness, and performance, with increasing intelligence embedded in products. In imaging, STMicroelectronics leads in Time-of-Flight and specialized CMOS sensors. Beyond hardware, the company provides a comprehensive development ecosystem compatible with the STM32 platform and ST Edge AI Suite, supporting customers from design to deployment.   What are MEMS sensors and why do they matter?   MEMS sensors are tiny devices combining mechanical and electronic components to detect physical phenomena like motion, pressure, or temperature. They serve as the bridge between the physical and digital worlds, enabling devices to perceive and interact with their environment. This is critical for applications ranging from smartphones and wearables to industrial machine monitoring, vehicles, and robotics. MEMS sensors uniquely integrate mechanical movement on chip, to provide accurate measurements for parameters such as acceleration, pressure, temperature, vibration, and angular rate. This capability is essential for a wide range of applications, including stabilizing a smartphone camera, detecting complex gestures in a wearable device, monitoring machine health in industrial settings, and enabling a humanoid robot to work in a factory. MEMS sensors are key to creating AI-driven, smarter, safer, and more responsive systems.   Why did ST acquire NXP’s MEMS sensor business?   ST and NXP’s MEMS portfolios complement each other, creating a balanced offering across automotive, industrial, and consumer sectors. This strengthens ST’s R&D, IP, and product roadmap, especially for automotive safety applications with inertial and pressure sensors, which are growing rapidly. It also broadens the company’s footprint in the industrial market, adding pressure sensors and accelerometers. The strong complementarity of technologies, products, and end markets will enable ST to better serve customers.   The enhanced R&D scale and complementary technologies create significant growth opportunities by meeting customer needs for new applications with innovative MEMS solutions. As industries move toward smarter, more connected systems, MEMS sensors enable better predictive maintenance, process optimization, and environmental monitoring.   How does this acquisition specifically strengthen ST\'s automotive position?   The automotive industry is rapidly shifting as traditional cars evolve into software-defined vehicles (SDVs) powered by hundreds or thousands of sensors acting as the vehicle’s nervous system. These sensors collect and process ultra-low latency, high-fidelity data to enable safer, more efficient, and autonomous mobility. MEMS sensors serve as the vehicle’s sensory organs—detecting acceleration, pressure, vibration, and angular rate—while imaging and environmental sensors enhance perception for real-time, software defined control.   The acquisition of NXP’s MEMS sensor business strengthens ST automotive position by expanding its portfolio of inertial, pressure, imaging, and environmental sensors. These devices feed edge AI and central processors to support faster decision making and actions such as braking, steering, and power management.   What benefits does ST’s integrated model bring to the development of MEMS?   ST’s integrated device manufacturer (IDM) approach, covering R&D, design, manufacturing, marketing and sales under one roof, is key to delivering differentiated, high-volume MEMS products. This IDM model integrates the entire semiconductor value chain, from research and development to design, manufacturing, marketing and sales, enabling ST to maintain full control over the process. This model allows for rapid innovation, as seen in ST\'s history of groundbreaking MEMS designs, such as the development of a robust single-pillar structure.   The company’s device manufacturing uses a mix of 300 and 200mm high-volume MEMS-specific and digital fabs: in Agrate, near Milan, Italy, and Crolles, near Grenoble, and Rousset, near Aix-en-Provence, France. While 300mm is the state of the art for the digital part of the sensors, the complexity of MEMS manufacturing means that 200mm is still state-of-the-art today.   STMicroelectronics’ activities in the Milano area, which include advanced research, development, and manufacturing of MEMS technologies and support the company’s leadership in sensor innovation and integration, form a worldwide hub for MEMS. We expect that volumes in ST’s MEMS fab in Agrate will grow in the coming years, durably supporting the loading.   Additionally, ST collaborates on MEMS R&D with top academic and research institutions globally including a new agreement with Politecnico di Milano, on research center for advanced sensor and the world’s first “Lab-in-Fab” to advance adoption of Piezoelectric MEMS in Singapore in partnership with A*STAR and ULVAC.   How does ST plan to lead this evolving landscape of intelligent sensing and AI integration?   We believe that ST’s expertise in both MEMS and imaging sensors, combined with its IDM model, positions the company uniquely to be a leader in innovative sensing technologies. The strategic acquisition of NXP’s MEMS business further strengthens this position. Our integrated approach ensures rapid development, high-volume manufacturing, and a broad, complementary product portfolio that addresses the evolving needs of smarter, connected systems.   Intelligent sensing contributes to advancements in AI either by embedding intelligence directly within the sensor or by enabling intelligent behavior in systems through data input. Each form plays a unique role in enhancing AI capabilities. The market opportunity is huge as devices from consumer electronics, to cars, and industrial environments become increasingly intelligent. Intelligent sensors are not just data collectors but active enablers of the AI revolution, and ST is at the forefront of this exciting journey.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0015.html</link>
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	<pubDate>Mon, 2 Feb 2026 22:10:57 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics expands sensors capabilities with closing of acquisition of NXP’s MEMS business]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today completed the acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business. Announced in July 2025 and now fully approved by regulators, this transaction, focused on automotive safety and non-safety products and sensors for industrial applications, expands ST’s global sensors capabilities.   Based on our initial assessment, we expect the acquired business to contribute in the mid forties million dollars range to ST’s revenues in the first quarter of 2026.   About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.   Forward-looking Information Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:   • changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and directly or indirectly adversely impact the demand for our products; • uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products; • customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all; • the ability to design, manufacture and sell innovative products in a rapidly changing technological environment; • changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities; • unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding; • financial difficulties with any of our major distributors or significant curtailment of purchases by key customers; • the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers; • availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation); • the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology; • theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation; • the impact of IP claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions; • changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets; • variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations; • the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant; • product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts; • natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate; • increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027; • epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results; • industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; • the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and • individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action or additional research costs.   Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.   Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2024 as filed with the Securities and Exchange Commission (“SEC”) on February 27, 2025. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.   Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our SEC filings, could have a material adverse effect on our business and/or financial condition.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3384.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 2 Feb 2026 22:00:45 +0100</pubDate>

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</channel>
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