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	<title>STMicroelectronics News Release</title>
	<link>https://www.st.com/content/st_com/en/press-rss.html</link>
	<description>A Collection of STMicroelectronics News Release</description>
	<language>en</language>
	<lastBuildDate>Fri, 26 Jun 2026 00:10:05 +0200</lastBuildDate>
<item>
	<title><![CDATA[STMicroelectronics unveils world’s first ST54M secure mobile chip with post-quantum cryptography for next-generation connected services]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services. ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC), combined with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys. Future-proof protection for expanding mobile use cases As mobile devices increasingly serve as trusted platforms for financial transactions, identity credentials, operator services, and secure access, product developers need solutions that combine multiple functions without compromising security, performance, or convenience. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC. The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that preserve a stable and familiar user experience while meeting stronger long-term security expectations. Arriving now, ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030. “With ST54M, we are extending our mobile-convergence platform to help customers address evolving security challenges while supporting the rich set of services users now expect from their devices,” said David Richetto, Connected Security Group VP, Division General Manager, STMicroelectronics. “By combining a PQC hardware accelerator with NFC, embedded secure element, and embedded SIM capabilities, ST54M gives device makers a secure path to start preparing next-generation mobile experiences.” Engineered for security, integration, and RF performance ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers. In addition to its security architecture, the device integrates large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications. ST54M sampling is available for customers, with production and certification targeted for July 2026. Pricing information and sample requests are available from local ST sales offices. Further technical information is available here: www.st.com/st54m About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4784.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/P4784S-June-24-2026-ST54M-secure-mobile-chip_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Wed, 24 Jun 2026 07:00:01 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to compact edge AI systems with industry-leading resolution and performance]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare. “VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.” “3D sensing demand accelerates across robotics, industrial automation, XR, and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption(1),” said Anas Chalak, Market & Technology Analyst at Yole Group. ST FlightSense™ VL53L9 is designed for multiple industry use cases: - Robotics: enhanced small object detection, SLAM (simultaneous localization and mapping) and obstacle avoidance for autonomous navigation. - Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management. - Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy. - AR/VR and consumer electronics: advanced gesture recognition, body tracking and finger skeleton for immersive user experiences. - Healthcare: fall detection and monitoring solutions for eldercare and patient safety. Technical Information Enhancing 3D sensing with precision and efficiency The VL53L9 offers an unprecedented 2,268 resolution zones (54x42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second. All-in-one sensing data for edge AI and easy integration The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. Compared to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity. Compact form factor Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users. Availability ST FlightSense™ VL53L9 in mass production in early July 2026 with samples and volume shipments available to customers globally. For more information, visit the VL53L9 product page: https://www.st.com/vl53l9cx (1) 2025 – 2030 period; Source: 3D Imaging & Sensing 2025 report, Yole Group About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4783.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/P4783D-Jun-22-2026-VL53L9-ToF-3D-LiDAR-module_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Mon, 22 Jun 2026 07:00:49 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics prices a US$1.5 billion dual-tranche offering of New Convertible Bonds]]></title>
	<description><![CDATA[Not for release, publication or distribution directly or indirectly, in whole or in part, in or into the United States, Australia, Canada, Japan or South Africa or in any other jurisdiction in which offers or sales would be prohibited by applicable law. This announcement is not an offer to sell or a solicitation to buy securities in any jurisdiction, including the United States, Australia, Canada, Japan or South Africa. Neither this announcement nor anything contained herein shall form the basis of, or be relied upon in connection with, any offer or commitment whatsoever in any jurisdiction. STMicroelectronics N.V. (the “Company” or “ST”) announces today the pricing of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of ST (the “Shares”) (the “New Convertible Bonds”). The New Convertible Bonds will be issued in two tranches, one of US$750 million with a maturity of 5 years (the “2031 Convertible Bonds”) and one of US$750 million with a maturity of 7 years (the “2033 Convertible Bonds”). The terms of the New Convertible Bonds contain customary provisions which will allow the Company to satisfy conversion rights on the New Convertible Bonds with a combination of cash and Shares, or cash or Shares only including, unless the Company elects otherwise, by way of net share settlement. The offering proceeds, net of costs, will be used by ST for general corporate purposes, including the early redemption of the outstanding US$750 million Zero Coupon Convertible Bonds due 2027 (ISIN: XS2211997239) announced earlier today. Offering of New Convertible Bonds The Company will issue the dual-tranche New Convertible Bonds as follows: The 2031 Convertible Bonds will not bear interest, will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2031, unless previously redeemed, converted or purchased and cancelled; and The 2033 Convertible Bonds will bear interest at an annual rate of 0.625%, payable semi-annually in arrear. The 2033 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2033, unless previously redeemed, converted or purchased and cancelled. The initial conversion price for the New Convertible Bonds has been set: In relation to the 2031 Convertible Bonds, at US$ 119.9813, representing a premium of 55%; and In relation to the 2033 Convertible Bonds, at US$ 121.9165, representing a premium of 57.5%, in each case over the volume-weighted average price of a Share between opening of trading today and pricing of the offering on the Euronext Milan Market, organised and managed by Borsa Italiana S.p.A., converted into US dollars at the prevailing exchange rate at the time of pricing. Settlement of the New Convertible Bonds is expected to take place on or about June 23rd, 2026. Application will be made for the New Convertible Bonds to be admitted to trading on the Open Market (Freiverkehr) segment of the Frankfurt Stock Exchange within 90 days of settlement. In the context of the offering of the New Convertible Bonds, the Company has committed to a lock-up period from (and including) the pricing date to (and including) 90 days after closing in respect of the Shares and related securities. The issuance of the New Convertible Bonds has been approved by the managing board and the supervisory board of the Company. BNP PARIBAS and J.P. Morgan acted as Joint Global Coordinators and Joint Bookrunners and Citigroup, Goldman Sachs Bank Europe SE, Intesa Sanpaolo, Morgan Stanley Europe SE, Natixis, Société Générale and UniCredit acted as Joint Bookrunners in respect of the offering. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com. * * * * * Issuer’s LEI: 213800Z8NOHIKRI42W10 * * * * * Inside information This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of the Market Abuse Regulation (EU) 596/2014 (“MAR”). * * * * * IMPORTANT NOTICE IN RELATION TO THE BONDS NO ACTION HAS BEEN TAKEN BY THE ISSUER, THE JOINT BOOKRUNNERS OR ANY OF THEIR RESPECTIVE AFFILIATES THAT WOULD PERMIT AN OFFERING OF THE BONDS OR POSSESSION OR DISTRIBUTION OF THIS PRESS RELEASE OR ANY OFFERING OR PUBLICITY MATERIAL RELATING TO THE BONDS IN ANY JURISDICTION WHERE ACTION FOR THAT PURPOSE IS REQUIRED. PERSONS INTO WHOSE POSSESSION THIS PRESS RELEASE COMES ARE REQUIRED BY THE ISSUER AND THE JOINT BOOKRUNNERS TO INFORM THEMSELVES ABOUT, AND TO OBSERVE, ANY SUCH RESTRICTIONS. THIS PRESS RELEASE IS NOT FOR DISTRIBUTION, DIRECTLY OR INDIRECTLY IN OR INTO THE UNITED STATES OR TO U.S. PERSONS (AS DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT OF 1933, AS AMENDED) (THE “U.S. SECURITIES ACT”). THIS PRESS RELEASE IS NOT AN OFFER TO SELL SECURITIES OR THE SOLICITATION OF ANY OFFER TO BUY SECURITIES, NOR SHALL THERE BE ANY OFFER OF SECURITIES IN ANY JURISDICTION IN WHICH SUCH OFFER OR SALE WOULD BE UNLAWFUL. THE BONDS AND THE SHARES TO BE DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS HAVE NOT BEEN AND WILL NOT BE REGISTERED UNDER THE U.S. SECURITIES ACT AND MAY NOT BE OFFERED, SOLD OR DELIVERED WITHIN THE UNITED STATES OR TO, OR FOR THE ACCOUNT OR BENEFIT OF, U.S. PERSONS (AS SUCH TERMS ARE DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT) ABSENT REGISTRATION OR AN EXEMPTION FROM THE APPLICABLE REGISTRATION REQUIREMENTS UNDER THE U.S. SECURITIES ACT. THERE WILL BE NO PUBLIC OFFER OF THE BONDS IN THE UNITED STATES. THE OFFERING WHEN MADE, ANY OFFERING DOCUMENTATION RELATING TO THE OFFERING AND THIS PRESS RELEASE ARE ONLY ADDRESSED TO, AND DIRECTED IN THE UNITED KINGDOM (“UK”) AND MEMBER STATES OF THE EUROPEAN ECONOMIC AREA (THE “EEA”) AT PERSONS WHO ARE “QUALIFIED INVESTORS” WITHIN THE MEANING OF THE PROSPECTUS REGULATION IN RESPECT OF EACH MEMBER STATE OF THE EEA, AND THE POATRs IN RESPECT OF THE UNITED KINGDOM, RESPECTIVELY (“QUALIFIED INVESTORS”) AND HAVE BEEN PREPARED ON THE BASIS THAT (I) ANY OFFER OF NEW CONVERTIBLE BONDS IN ANY MEMBER STATE OF THE EEA WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE PROSPECTUS REGULATION FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS AND (II) ANY OFFER OF NEW CONVERTIBLE BONDS IN THE UK WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE POATRs FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS. THE EXPRESSION \"PROSPECTUS REGULATION\" MEANS REGULATION (EU) 2017/1129 (AS AMENDED OR SUPERSEDED) AND THE EXPRESSION “POATRs” MEANS THE PUBLIC OFFERS AND ADMISSIONS TO TRADING REGULATIONS 2024. SOLELY FOR THE PURPOSES OF THE PRODUCT GOVERNANCE REQUIREMENTS CONTAINED WITHIN: (A) EU DIRECTIVE 2014/65/EU ON MARKETS IN FINANCIAL INSTRUMENTS, AS AMENDED (“MIFID II”); (B) ARTICLES 9 AND 10 OF COMMISSION DELEGATED DIRECTIVE (EU) 2017/593 SUPPLEMENTING MIFID II; (C) LOCAL IMPLEMENTING MEASURES IN THE EEA; (D) REGULATION (EU) NO 600/2014 AS IT FORMS PART OF UNITED KINGDOM DOMESTIC LAW BY VIRTUE OF THE EUROPEAN UNION (WITHDRAWAL) ACT 2018 (“EUWA”) (“UK MIFIR”); AND (E) THE FCA HANDBOOK PRODUCT INTERVENTION AND PRODUCT GOVERNANCE SOURCEBOOK (TOGETHER, THE “PRODUCT GOVERNANCE REQUIREMENTS”), AND DISCLAIMING ALL AND ANY LIABILITY, WHETHER ARISING IN TORT, CONTRACT OR OTHERWISE, WHICH ANY “MANUFACTURER” (FOR THE PURPOSES OF THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS) MAY OTHERWISE HAVE WITH RESPECT THERETO, THE BONDS HAVE BEEN SUBJECT TO A PRODUCT APPROVAL PROCESS, WHICH HAS DETERMINED THAT: (I) THE TARGET MARKET FOR THE BONDS IS (A) IN THE EEA, ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ONLY, EACH AS DEFINED IN MIFID II AND (B) IN THE UNITED KINGDOM, ELIGIBLE COUNTERPARTIES (AS DEFINED IN THE FCA HANDBOOK CONDUCT OF BUSINESS SOURCEBOOK) AND PROFESSIONAL CLIENTS (AS DEFINED IN UK MIFIR); AND/OR (II) ALL CHANNELS FOR DISTRIBUTION OF THE BONDS TO ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ARE APPROPRIATE AS PERMITTED BY MIFID II (THE “TARGET MARKET ASSESSMENT”). ANY PERSON SUBSEQUENTLY OFFERING, SELLING OR RECOMMENDING THE BONDS (A \"DISTRIBUTOR\") SHOULD TAKE INTO CONSIDERATION THE MANUFACTURERS’ TARGET MARKET ASSESSMENT; HOWEVER, A DISTRIBUTOR SUBJECT TO THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS IS RESPONSIBLE FOR UNDERTAKING ITS OWN TARGET MARKET ASSESSMENT IN RESPECT OF THE BONDS (BY EITHER ADOPTING OR REFINING THE MANUFACTURERS’ TARGET MARKET ASSESSMENT) AND DETERMINING APPROPRIATE DISTRIBUTION CHANNELS. THE TARGET MARKET ASSESSMENT IS WITHOUT PREJUDICE TO THE REQUIREMENTS OF ANY CONTRACTUAL OR LEGAL SELLING RESTRICTIONS IN RELATION TO ANY OFFERING OF THE BONDS. FOR THE AVOIDANCE OF DOUBT, THE TARGET MARKET ASSESSMENT DOES NOT CONSTITUTE: (A) AN ASSESSMENT OF SUITABILITY OR APPROPRIATENESS FOR THE PURPOSES OF MIFID II OR UK MIFIR; OR (B) A RECOMMENDATION TO ANY INVESTOR OR GROUP OF INVESTORS TO INVEST IN, OR PURCHASE, OR TAKE ANY OTHER ACTION WHATSOEVER WITH RESPECT TO THE BONDS. THE BONDS ARE NOT INTENDED TO BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO AND SHOULD NOT BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA OR THE UNITED KINGDOM. FOR THESE PURPOSES, A RETAIL INVESTOR (A) IN THE EEA, MEANS A PERSON WHO IS ONE (OR MORE) OF: (I) A RETAIL CLIENT AS DEFINED IN POINT (11) OF ARTICLE 4(1) OF MIFID II; OR (II) A CUSTOMER WITHIN THE MEANING OF DIRECTIVE (EU) 2016/97 (AS AMENDED), WHERE THAT CUSTOMER WOULD NOT QUALIFY AS A PROFESSIONAL CLIENT AS DEFINED IN POINT (10) OF ARTICLE 4(1) OF MIFID II AND (B) IN THE UK, MEANS A PERSON WHO IS NOT A PROFESSIONAL CLIENT, AS DEFINED IN POINT (8) OF ARTICLE 2(1) OF REGULATION (EU) NO 600/2014 AS IT FORMS PART OF DOMESTIC LAW BY VIRTUE OF THE EUWA. CONSEQUENTLY, (I) NO KEY INFORMATION DOCUMENT REQUIRED BY REGULATION (EU) NO 1286/2014, AS AMENDED (THE “PRIIPS REGULATION”) FOR OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE EEA HAS BEEN PREPARED AND THEREFORE OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA MAY BE UNLAWFUL UNDER THE PRIIPS REGULATION AND (II) NO DISCLOSURE DOCUMENT REQUIRED BY THE FCA PRODUCT DISCLOSURE SOURCEBOOK (“DISC”) FOR OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE UNITED KINGDOM HAS BEEN PREPARED AND THEREFORE OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE UNITED KINGDOM MAY BE UNLAWFUL UNDER DISC AND THE CONSUMER COMPOSITE INVESTMENTS (DESIGNATED ACTIVITIES) REGULATIONS 2024. IN ADDITION, THIS PRESS RELEASE IS FOR DISTRIBUTION ONLY TO PERSONS WHO (I) HAVE PROFESSIONAL EXPERIENCE IN MATTERS RELATING TO INVESTMENTS FALLING WITHIN ARTICLE 19(5) OF THE FINANCIAL SERVICES AND MARKETS ACT 2000 (FINANCIAL PROMOTION) ORDER 2005 (AS AMENDED THE “FINANCIAL PROMOTION ORDER”), (II) ARE PERSONS FALLING WITHIN ARTICLE 49(2)(A) TO (D) (“HIGH NET WORTH COMPANIES, UNINCORPORATED ASSOCIATIONS ETC.\") OF THE FINANCIAL PROMOTION ORDER, (III) ARE OUTSIDE THE UNITED KINGDOM, OR (IV) ARE PERSONS TO WHOM AN INVITATION OR INDUCEMENT TO ENGAGE IN INVESTMENT ACTIVITY (WITHIN THE MEANING OF SECTION 21 OF THE FINANCIAL SERVICES AND MARKETS ACT 2000) IN CONNECTION WITH THE ISSUE OR SALE OF ANY SECURITIES MAY OTHERWISE LAWFULLY BE COMMUNICATED OR CAUSED TO BE COMMUNICATED (ALL SUCH PERSONS TOGETHER BEING REFERRED TO AS “RELEVANT PERSONS”). THIS PRESS RELEASE IS DIRECTED ONLY AT RELEVANT PERSONS AND MUST NOT BE ACTED ON OR RELIED ON BY PERSONS WHO ARE NOT RELEVANT PERSONS. ANY INVESTMENT OR INVESTMENT ACTIVITY TO WHICH THIS PRESS RELEASE RELATES IS AVAILABLE ONLY TO RELEVANT PERSONS AND WILL BE ENGAGED IN ONLY WITH RELEVANT PERSONS. ANY DECISION TO PURCHASE ANY OF THE BONDS SHOULD ONLY BE MADE ON THE BASIS OF AN INDEPENDENT REVIEW BY A PROSPECTIVE INVESTOR OF THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. NEITHER THE JOINT BOOKRUNNERS NOR ANY OF THEIR RESPECTIVE AFFILIATES ACCEPT ANY LIABILITY ARISING FROM THE USE OF, OR MAKE ANY REPRESENTATION AS TO THE ACCURACY OR COMPLETENESS OF, THIS PRESS RELEASE OR THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. THE INFORMATION CONTAINED IN THIS PRESS RELEASE IS SUBJECT TO CHANGE IN ITS ENTIRETY WITHOUT NOTICE UP TO THE SETTLEMENT DATE. EACH PROSPECTIVE INVESTOR SHOULD PROCEED ON THE ASSUMPTION THAT IT MUST BEAR THE ECONOMIC RISK OF AN INVESTMENT IN THE BONDS OR THE SHARES TO BE ISSUED OR TRANSFERRED AND DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS (TOGETHER WITH THE BONDS, THE “SECURITIES”). NONE OF THE ISSUER OR THE JOINT BOOKRUNNERS MAKE ANY REPRESENTATION AS TO (I) THE SUITABILITY OF THE SECURITIES FOR ANY PARTICULAR INVESTOR, (II) THE APPROPRIATE ACCOUNTING TREATMENT AND POTENTIAL TAX CONSEQUENCES OF INVESTING IN THE SECURITIES OR (III) THE FUTURE PERFORMANCE OF THE SECURITIES EITHER IN ABSOLUTE TERMS OR RELATIVE TO COMPETING INVESTMENTS. THE JOINT BOOKRUNNERS ARE ACTING ON BEHALF OF THE ISSUER AND NO ONE ELSE IN CONNECTION WITH THE BONDS AND WILL NOT BE RESPONSIBLE TO ANY OTHER PERSON FOR PROVIDING THE PROTECTIONS AFFORDED TO CLIENTS OF THE JOINT BOOKRUNNERS OR FOR PROVIDING ADVICE IN RELATION TO THE SECURITIES. EACH OF THE ISSUER, THE JOINT BOOKRUNNERS AND THEIR RESPECTIVE AFFILIATES EXPRESSLY DISCLAIMS ANY OBLIGATION OR UNDERTAKING TO UPDATE, REVIEW OR REVISE ANY STATEMENT CONTAINED IN THIS PRESS RELEASE WHETHER AS A RESULT OF NEW INFORMATION, FUTURE DEVELOPMENTS OR OTHERWISE.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/3398.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 16 Jun 2026 17:22:50 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces (i) a US$1.5 billion dual-tranche offering of New Convertible Bonds and (ii) the early redemption of its 2027 Convertible Bonds]]></title>
	<description><![CDATA[Not for release, publication or distribution directly or indirectly, in whole or in part, in or into the United States, Australia, Canada, Japan or South Africa or in any other jurisdiction in which offers or sales would be prohibited by applicable law. This announcement is not an offer to sell or a solicitation to buy securities in any jurisdiction, including the United States, Australia, Canada, Japan or South Africa. Neither this announcement nor anything contained herein shall form the basis of, or be relied upon in connection with, any offer or commitment whatsoever in any jurisdiction. STMicroelectronics N.V. (the “Company” or “ST”) announces today the launch of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of ST (the “Shares”) (the “New Convertible Bonds”) and the early redemption of the outstanding US$750 million Zero Coupon Convertible Bonds due 2027 (ISIN: XS2211997239, the “2027 Convertible Bonds”). The New Convertible Bonds will be offered in two tranches (with a minimum size of US$500 million per tranche) with a maturity of 5 years (the “2031 Convertible Bonds”) and 7 years (the “2033 Convertible Bonds”), respectively. The terms of the New Convertible Bonds are expected to contain customary provisions which will allow the Company to satisfy conversion rights on the New Convertible Bonds with a combination of cash and Shares, or cash or Shares only including, unless the Company elects otherwise, by way of net share settlement. The offering proceeds, net of costs, will be used by ST for general corporate purposes, including the early redemption of the 2027 Convertible Bonds. Offering of New Convertible Bonds The Company proposes to issue the dual-tranche New Convertible Bonds as follows: The 2031 Convertible Bonds will bear interest at an annual rate between 0.00% and 0.50%, payable semi-annually in arrear. The 2031 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2031, unless previously redeemed, converted or purchased and cancelled; and The 2033 Convertible Bonds will bear interest at an annual rate between 0.625% and 1.125%, payable semi-annually in arrear. The 2033 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2033, unless previously redeemed, converted or purchased and cancelled. The initial conversion price for the New Convertible Bonds is expected to be set: In relation to the 2031 Convertible Bonds, at a premium between 47.5% – 52.5%; and In relation to the 2033 Convertible Bonds, at a premium between 50% – 55%, in each case over the volume-weighted average price of a Share between opening of trading today and pricing of the offering on the Euronext Milan Market, organised and managed by Borsa Italiana S.p.A., converted into US dollars at the prevailing exchange rate at the time of pricing. The final terms of the New Convertible Bonds are expected to be determined and announced later today and settlement is expected to take place on or about June 23rd, 2026. Application will be made for the New Convertible Bonds to be admitted to trading on the Open Market (Freiverkehr) segment of the Frankfurt Stock Exchange within 90 days of settlement. In the context of the offering of the New Convertible Bonds, the Company will commit to a lock-up period from (and including) the pricing date to (and including) 90 days after closing in respect of the Shares and related securities. The issuance of the New Convertible Bonds has been approved by the managing board and the supervisory board of the Company. BNP PARIBAS and J.P. Morgan are acting as Joint Global Coordinators and Joint Bookrunners and Citigroup, Goldman Sachs Bank Europe SE, Intesa Sanpaolo, Morgan Stanley Europe SE, Natixis, Société Générale and UniCredit are acting as Joint Bookrunners in respect of the offering. Early redemption of the 2027 Convertible Bonds The Company will today give notice to the holders of the 2027 Convertible Bonds to redeem all of the 2027 Convertible Bonds on July 16th, 2026, at their principal amount in accordance with Condition 7(b)(i) of the Terms and Conditions of the 2027 Convertible Bonds. Holders of the 2027 Convertible Bonds are entitled to exercise their right to convert their 2027 Convertible Bonds into Shares, cash or a combination of Shares and cash by reference to the prevailing conversion price, currently US$45.10 per Share, subject to the relevant Conversion Date occurring on or before July 1st, 2026 in accordance with Condition 6(a)(i) of the Terms and Conditions of the 2027 Convertible Bonds. If holders of such 2027 Convertible Bonds exercise their conversion right, the Company may decide to settle such exercise through the payment of cash and delivery of Shares pursuant to the Net Share Settlement provisions of Condition 6(a)(iii) of the Terms and Conditions of the 2027 Convertible Bonds. * * * * * Issuer’s LEI: 213800Z8NOHIKRI42W10 * * * * * Inside information This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of the Market Abuse Regulation (EU) 596/2014 (“MAR”). * * * * * IMPORTANT NOTICE IN RELATION TO THE BONDS NO ACTION HAS BEEN TAKEN BY THE ISSUER, THE JOINT BOOKRUNNERS OR ANY OF THEIR RESPECTIVE AFFILIATES THAT WOULD PERMIT AN OFFERING OF THE BONDS OR POSSESSION OR DISTRIBUTION OF THIS PRESS RELEASE OR ANY OFFERING OR PUBLICITY MATERIAL RELATING TO THE BONDS IN ANY JURISDICTION WHERE ACTION FOR THAT PURPOSE IS REQUIRED. PERSONS INTO WHOSE POSSESSION THIS PRESS RELEASE COMES ARE REQUIRED BY THE ISSUER AND THE JOINT BOOKRUNNERS TO INFORM THEMSELVES ABOUT, AND TO OBSERVE, ANY SUCH RESTRICTIONS. THIS PRESS RELEASE IS NOT FOR DISTRIBUTION, DIRECTLY OR INDIRECTLY IN OR INTO THE UNITED STATES OR TO U.S. PERSONS (AS DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT OF 1933., AS AMENDED) (THE “U.S. SECURITIES ACT”).). THIS PRESS RELEASE IS NOT AN OFFER TO SELL SECURITIES OR THE SOLICITATION OF ANY OFFER TO BUY SECURITIES, NOR SHALL THERE BE ANY OFFER OF SECURITIES IN ANY JURISDICTION IN WHICH SUCH OFFER OR SALE WOULD BE UNLAWFUL. THE BONDS AND THE SHARES TO BE DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS HAVE NOT BEEN AND WILL NOT BE REGISTERED UNDER THE U.S. SECURITIES ACT AND MAY NOT BE OFFERED, SOLD OR DELIVERED WITHIN THE UNITED STATES OR TO, OR FOR THE ACCOUNT OR BENEFIT OF, U.S. PERSONS (AS SUCH TERMS ARE DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT) ABSENT REGISTRATION OR AN EXEMPTION FROM THE APPLICABLE REGISTRATION REQUIREMENTS UNDER THE U.S. SECURITIES ACT. THERE WILL BE NO PUBLIC OFFER OF THE BONDS IN THE UNITED STATES. THE OFFERING WHEN MADE, ANY OFFERING DOCUMENTATION RELATING TO THE OFFERING AND THIS PRESS RELEASE ARE ONLY ADDRESSED TO, AND DIRECTED IN THE UNITED KINGDOM (“UK”) AND MEMBER STATES OF THE EUROPEAN ECONOMIC AREA (THE “EEA”) AT PERSONS WHO ARE “QUALIFIED INVESTORS” WITHIN THE MEANING OF THE PROSPECTUS REGULATION IN RESPECT OF EACH MEMBER STATE OF THE EEA, AND THE POATRs IN RESPECT OF THE UNITED KINGDOM, RESPECTIVELY (“QUALIFIED INVESTORS”) AND HAVE BEEN PREPARED ON THE BASIS THAT (I) ANY OFFER OF NEW CONVERTIBLE BONDS IN ANY MEMBER STATE OF THE EEA WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE PROSPECTUS REGULATION FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS AND (II) ANY OFFER OF NEW CONVERTIBLE BONDS IN THE UK WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE POATRs FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS. THE EXPRESSION \"PROSPECTUS REGULATION\" MEANS REGULATION (EU) 2017/1129 (AS AMENDED OR SUPERSEDED) AND THE EXPRESSION “POATRs” MEANS THE PUBLIC OFFERS AND ADMISSIONS TO TRADING REGULATIONS 2024. SOLELY FOR THE PURPOSES OF THE PRODUCT GOVERNANCE REQUIREMENTS CONTAINED WITHIN: (A) EU DIRECTIVE 2014/65/EU ON MARKETS IN FINANCIAL INSTRUMENTS, AS AMENDED (“MIFID II”); (B) ARTICLES 9 AND 10 OF COMMISSION DELEGATED DIRECTIVE (EU) 2017/593 SUPPLEMENTING MIFID II; (C) LOCAL IMPLEMENTING MEASURES IN THE EEA; (D) REGULATION (EU) NO 600/2014 AS IT FORMS PART OF UNITED KINGDOM DOMESTIC LAW BY VIRTUE OF THE EUROPEAN UNION (WITHDRAWAL) ACT 2018 (“EUWA”) (“UK MIFIR”); AND (E) THE FCA HANDBOOK PRODUCT INTERVENTION AND PRODUCT GOVERNANCE SOURCEBOOK (TOGETHER, THE “PRODUCT GOVERNANCE REQUIREMENTS”), AND DISCLAIMING ALL AND ANY LIABILITY, WHETHER ARISING IN TORT, CONTRACT OR OTHERWISE, WHICH ANY “MANUFACTURER” (FOR THE PURPOSES OF THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS) MAY OTHERWISE HAVE WITH RESPECT THERETO, THE BONDS HAVE BEEN SUBJECT TO A PRODUCT APPROVAL PROCESS, WHICH HAS DETERMINED THAT: (I) THE TARGET MARKET FOR THE BONDS IS (A) IN THE EEA, ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ONLY, EACH AS DEFINED IN MIFID II AND (B) IN THE UNITED KINGDOM, ELIGIBLE COUNTERPARTIES (AS DEFINED IN THE FCA HANDBOOK CONDUCT OF BUSINESS SOURCEBOOK) AND PROFESSIONAL CLIENTS (AS DEFINED IN UK MIFIR); AND/OR (II) ALL CHANNELS FOR DISTRIBUTION OF THE BONDS TO ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ARE APPROPRIATE AS PERMITTED BY MIFID II (THE “TARGET MARKET ASSESSMENT”). ANY PERSON SUBSEQUENTLY OFFERING, SELLING OR RECOMMENDING THE BONDS (A \"DISTRIBUTOR\") SHOULD TAKE INTO CONSIDERATION THE MANUFACTURERS’ TARGET MARKET ASSESSMENT; HOWEVER, A DISTRIBUTOR SUBJECT TO THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS IS RESPONSIBLE FOR UNDERTAKING ITS OWN TARGET MARKET ASSESSMENT IN RESPECT OF THE BONDS (BY EITHER ADOPTING OR REFINING THE MANUFACTURERS’ TARGET MARKET ASSESSMENT) AND DETERMINING APPROPRIATE DISTRIBUTION CHANNELS. THE TARGET MARKET ASSESSMENT IS WITHOUT PREJUDICE TO THE REQUIREMENTS OF ANY CONTRACTUAL OR LEGAL SELLING RESTRICTIONS IN RELATION TO ANY OFFERING OF THE BONDS. FOR THE AVOIDANCE OF DOUBT, THE TARGET MARKET ASSESSMENT DOES NOT CONSTITUTE: (A) AN ASSESSMENT OF SUITABILITY OR APPROPRIATENESS FOR THE PURPOSES OF MIFID II OR UK MIFIR; OR (B) A RECOMMENDATION TO ANY INVESTOR OR GROUP OF INVESTORS TO INVEST IN, OR PURCHASE, OR TAKE ANY OTHER ACTION WHATSOEVER WITH RESPECT TO THE BONDS. THE BONDS ARE NOT INTENDED TO BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO AND SHOULD NOT BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA OR THE UNITED KINGDOM. FOR THESE PURPOSES, A RETAIL INVESTOR (A) IN THE EEA, MEANS A PERSON WHO IS ONE (OR MORE) OF: (I) A RETAIL CLIENT AS DEFINED IN POINT (11) OF ARTICLE 4(1) OF MIFID II; OR (II) A CUSTOMER WITHIN THE MEANING OF DIRECTIVE (EU) 2016/97 (AS AMENDED), WHERE THAT CUSTOMER WOULD NOT QUALIFY AS A PROFESSIONAL CLIENT AS DEFINED IN POINT (10) OF ARTICLE 4(1) OF MIFID II AND (B) IN THE UK, MEANS A PERSON WHO IS NOT A PROFESSIONAL CLIENT, AS DEFINED IN POINT (8) OF ARTICLE 2(1) OF REGULATION (EU) NO 600/2014 AS IT FORMS PART OF DOMESTIC LAW BY VIRTUE OF THE EUWA. CONSEQUENTLY, (I) NO KEY INFORMATION DOCUMENT REQUIRED BY REGULATION (EU) NO 1286/2014, AS AMENDED (THE “PRIIPS REGULATION”) FOR OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE EEA HAS BEEN PREPARED AND THEREFORE OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA MAY BE UNLAWFUL UNDER THE PRIIPS REGULATION AND (II) NO DISCLOSURE DOCUMENT REQUIRED BY THE FCA PRODUCT DISCLOSURE SOURCEBOOK (“DISC”) FOR OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE UNITED KINGDOM HAS BEEN PREPARED AND THEREFORE OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE UNITED KINGDOM MAY BE UNLAWFUL UNDER DISC AND THE CONSUMER COMPOSITE INVESTMENTS (DESIGNATED ACTIVITIES) REGULATIONS 2024. IN ADDITION, THIS PRESS RELEASE IS FOR DISTRIBUTION ONLY TO PERSONS WHO (I) HAVE PROFESSIONAL EXPERIENCE IN MATTERS RELATING TO INVESTMENTS FALLING WITHIN ARTICLE 19(5) OF THE FINANCIAL SERVICES AND MARKETS ACT 2000 (FINANCIAL PROMOTION) ORDER 2005 (AS AMENDED THE “FINANCIAL PROMOTION ORDER”), (II) ARE PERSONS FALLING WITHIN ARTICLE 49(2)(A) TO (D) (“HIGH NET WORTH COMPANIES, UNINCORPORATED ASSOCIATIONS ETC.\") OF THE FINANCIAL PROMOTION ORDER, (III) ARE OUTSIDE THE UNITED KINGDOM, OR (IV) ARE PERSONS TO WHOM AN INVITATION OR INDUCEMENT TO ENGAGE IN INVESTMENT ACTIVITY (WITHIN THE MEANING OF SECTION 21 OF THE FINANCIAL SERVICES AND MARKETS ACT 2000) IN CONNECTION WITH THE ISSUE OR SALE OF ANY SECURITIES MAY OTHERWISE LAWFULLY BE COMMUNICATED OR CAUSED TO BE COMMUNICATED (ALL SUCH PERSONS TOGETHER BEING REFERRED TO AS “RELEVANT PERSONS”). THIS PRESS RELEASE IS DIRECTED ONLY AT RELEVANT PERSONS AND MUST NOT BE ACTED ON OR RELIED ON BY PERSONS WHO ARE NOT RELEVANT PERSONS. ANY INVESTMENT OR INVESTMENT ACTIVITY TO WHICH THIS PRESS RELEASE RELATES IS AVAILABLE ONLY TO RELEVANT PERSONS AND WILL BE ENGAGED IN ONLY WITH RELEVANT PERSONS. ANY DECISION TO PURCHASE ANY OF THE BONDS SHOULD ONLY BE MADE ON THE BASIS OF AN INDEPENDENT REVIEW BY A PROSPECTIVE INVESTOR OF THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. NEITHER THE JOINT BOOKRUNNERS NOR ANY OF THEIR RESPECTIVE AFFILIATES ACCEPT ANY LIABILITY ARISING FROM THE USE OF, OR MAKE ANY REPRESENTATION AS TO THE ACCURACY OR COMPLETENESS OF, THIS PRESS RELEASE OR THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. THE INFORMATION CONTAINED IN THIS PRESS RELEASE IS SUBJECT TO CHANGE IN ITS ENTIRETY WITHOUT NOTICE UP TO THE SETTLEMENT DATE. EACH PROSPECTIVE INVESTOR SHOULD PROCEED ON THE ASSUMPTION THAT IT MUST BEAR THE ECONOMIC RISK OF AN INVESTMENT IN THE BONDS OR THE SHARES TO BE ISSUED OR TRANSFERRED AND DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS (TOGETHER WITH THE BONDS, THE “SECURITIES”). NONE OF THE ISSUER OR THE JOINT BOOKRUNNERS MAKE ANY REPRESENTATION AS TO (I) THE SUITABILITY OF THE SECURITIES FOR ANY PARTICULAR INVESTOR, (II) THE APPROPRIATE ACCOUNTING TREATMENT AND POTENTIAL TAX CONSEQUENCES OF INVESTING IN THE SECURITIES OR (III) THE FUTURE PERFORMANCE OF THE SECURITIES EITHER IN ABSOLUTE TERMS OR RELATIVE TO COMPETING INVESTMENTS. THE JOINT BOOKRUNNERS ARE ACTING ON BEHALF OF THE ISSUER AND NO ONE ELSE IN CONNECTION WITH THE BONDS AND WILL NOT BE RESPONSIBLE TO ANY OTHER PERSON FOR PROVIDING THE PROTECTIONS AFFORDED TO CLIENTS OF THE JOINT BOOKRUNNERS OR FOR PROVIDING ADVICE IN RELATION TO THE SECURITIES. EACH OF THE ISSUER, THE JOINT BOOKRUNNERS AND THEIR RESPECTIVE AFFILIATES EXPRESSLY DISCLAIMS ANY OBLIGATION OR UNDERTAKING TO UPDATE, REVIEW OR REVISE ANY STATEMENT CONTAINED IN THIS PRESS RELEASE WHETHER AS A RESULT OF NEW INFORMATION, FUTURE DEVELOPMENTS OR OTHERWISE. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3397.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 16 Jun 2026 06:19:19 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics expands ST87M01 NB-IoT module platform with certifications for North America and Brazil]]></title>
	<description><![CDATA[STMicroelectronics has completed certification of ST87M01 NB-IoT modules in North America and Brazil, letting IoT projects in both regions leverage the modules’ 5G-ready connectivity, optional extra features, and supply-chain advantages. The approved modules for the USA and Canada markets, FCC, PTCRB and ISED certified, include NB-IoT Release 15 cellular connectivity and additional options of GNSS and Wi-Fi positioning for outdoor and indoor localization and asset tracking. ST is working with Onomondo — a global IoT network operator trusted by enterprises worldwide — to bring these certified modules to market with a ready-to-use connectivity layer, giving customers an accelerated and fully managed path to deployment across North America. \"With FCC, PTCRB, and ISED certification now in place, the ST87M01 is fully ready to power IoT deployments across the USA and Canada. Our collaboration with Onomondo adds a further dimension to this — giving customers a proven global connectivity platform to deploy, manage, and scale their applications across North America with speed and confidence,\" said Domenico Arrigo, General Manager, Application Specific Product Division, STMicroelectronics. Wanig Le Pennec, Director of Global Partnerships at Onomondo, added, “Our work with ST brings energy-efficient, compact modules and global connectivity into one certified solution, giving teams across North America a faster route into these markets, with full visibility into every device and the control to optimize performance and manage costs as their fleet grows.\" The ST87M01 module platform has also achieved Anatel certification in Brazil, further expanding its global footprint. With NB-IoT connectivity and optional GNSS/Wi-Fi positioning, the ST87M01 unlocks the full potential of Brazil\'s fastest-growing IoT verticals — smart metering, smart street lighting, monitoring livestock and agriculture sensors, and asset tracking. Customers can now bring to market compact, energy-efficient, and highly scalable solutions that are fully aligned with the demands of Brazil\'s evolving connected infrastructure. ST’s Domenico Arrigo commented, \"Brazil represents one of the most dynamic and fast-growing IoT markets in Latin America, driven by strong government initiatives and a thriving enterprise ecosystem. With Anatel certification now secured, the ST87M01 brings its geolocation capabilities, outstanding energy efficiency, and large-scale deployment simplicity to customers who are ready to realize those opportunities.” The modules available for each market are: • Region-specific part numbers for USA and Canada: ST87M01-2001 with NB-IoT connectivity; ST87M01-2301 with NB-IoT and GNSS/Wi-Fi positioning. • Anatel -certified modules in Brazil: ST87M01-1000 with NB-IoT; ST87M01-1100 and ST87M01-1101 with NB-IoT and GNSS/Wi-Fi positioning. Close integration of all features in one device saves integration engineering challenges and costs. Further information for editors ST87M01 modules are already widely deployed in utility metering, smart city, and industrial IoT solutions including smart meters, asset trackers, remote monitoring, smart buildings, and smart factories throughout Europe, Middle East, and Africa (EMEA). The modules comply with the European Radio Equipment Directive, including Section 3.3 cybersecurity requirements. They are also certified by the Global Certification Forum (GCF), including multiple GSM bands and 3GPP test specifications for NB-IoT, RSP, UICC, and ETSI USIM. All ST87M01 modules are entirely designed, built, and supported by ST, giving customers peace of mind regarding production, shipping, and security. Building IoT devices using ST87M01 modules lets developers access ST’s extensive ecosystem that includes development tools, hardware kits, reference designs, software libraries, application examples, and antenna-design assistance. The resources available for developers include ST87M01 firmware, ST’s Easy Connect software library, a Windows-PC graphical tool for configuring module settings and downloading firmware images. The tools provide a console to send commands, as well as panels for monitoring network and radio connections, managing positioning services, and debugging. Developers can leverage these tools to integrate the ST87M01 with their host-system microcontroller or embed firmware directly in the ST87M01 for simple applications and use-cases. Dedicated evaluation kits are available for the new region-specific modules. Drawing less than 0.5µA in standby, and less than 1.2µA while operating in power-saving mode (PSM), the modules meet typical market demands for low power consumption and extended battery life in the field. ST87M01 modules are in production now in a compact 10.6mm x 12.8mm package just 2.4 mm high. Information about samples and pricing requests is available through local ST sales offices worldwide. Visit https://www.st.com/st87m01 for more information.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/n4781.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/N4781D-Jun-10-2026-ST87M01-NB-IoT-for-AME-markets_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Wed, 10 Jun 2026 14:00:32 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics and the LEO opportunity]]></title>
	<description><![CDATA[By Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group. A new space economy is taking shape The space industry can be seen as evolving along two broad paths. Traditional space includes geostationary and medium Earth orbit systems used for established applications such as broadcasting, meteorology, and GNSS. These programs are mission-critical, but they are characterized by large satellites, long development cycles, and highly predictable service models. Low Earth orbit (LEO) is different. It is built around smaller satellites, much faster deployment, lower latency, and business models designed for mass adoption. This shift is not just about orbit altitude; it is about economics. LEO opens the door to broader connectivity, higher deployment volumes, and stronger semiconductor content per system. That change has been enabled by three major technology inflections. First, launch costs have fallen dramatically thanks to reusable rockets. Second, satellites have become lighter, more standardized, and more digital, with software-defined payloads and inter-satellite optical links increasingly common. Third, user terminals have evolved from traditional parabolic antennas into electronically steered phased arrays capable of tracking fast-moving satellites with precision and reliability. Together, these shifts have created an ecosystem where silicon content matters more than ever. ST’s position: from early participation to market leadership ST has been active in space for more than 45 years, with a long track record across both traditional and new space programs. In LEO, the company was involved from the beginning and has since become the leading semiconductor player in the market. That leadership is already visible in the numbers. ST’s LEO-related revenue reached approximately $600 million in 2025, up from about $175 million in 2021, representing a CAGR of roughly 36%. This is an impressive starting point, but the opportunity is still in its early innings. The market is expanding quickly, the customer base is broadening, and the underlying technology roadmap continues to deepen semiconductor content across satellites, gateways, and user terminals. Why LEO is scaling so fast The economics of LEO are being transformed by scale. Gartner estimates that LEO services spending will approach $15 billion globally in 2026. The growth is continuing across three major service categories: broadband, direct-to-cell, and eventually orbital data centers. Broadband is the largest opportunity today. LEO constellations can connect underserved regions, improve resilience for corporate and government users, and provide connectivity for mobility applications such as aviation, maritime, and eventually automotive. In a world where almost 3 billion people remain on the wrong side of the digital divide, the importance of global broadband access is difficult to overstate. The second growth engine is direct-to-cell, which enables phones and IoT devices to connect directly to satellites acting as cell towers in space. This expands connectivity into previously unreachable areas and opens growth in roaming-free services and asset tracking. The third frontier is orbital data centers. While still early, the concept is gaining traction as the cost of launch per kilogram is reduced and the economics of putting compute in orbit become more credible. A highly semiconductor-intensive ecosystem Over the next five years, LEO will scale rapidly into a true communications ecosystem. Space-based downlink capacity is expected to grow around 10x by 2030, gateway infrastructure will expand by estimated 1.6x, and subscribers could rise from about 10 million today to more than 200 million. LEO is not just a communications market. It is a semiconductor market. ST’s opportunity spans all three layers of the ecosystem: • Satellites • Gateways • User terminals Each layer has different technical requirements, but all rely on advanced silicon content. A key factor is the scale: the market is shipping thousands of satellites per year, thousands of gateways, and millions, eventually tens of millions, of user terminals. That combination creates a very large addressable market. Based on our current view, we estimate that LEO broadband electronics SAM was around $650 million in 2025, growing to roughly $2 billion in 2028 and close to $3 billion by 2030, excluding additional upside from orbital data centers. Technology differentiation: where ST wins ST’s competitive strength in LEO comes from the combination of our process technologies, packaging capabilities, and manufacturing scale. FD-SOI for satellites and microcontrollers: ST’s Fully Depleted Silicon On Insulator, or FD-SOI, supplied from our 300 mm fab in France and through foundry partnerships, is a key enabler for ASICs and microcontrollers in space systems. It offers a combination of performance, power efficiency, radiation robustness, and embedded memory capabilities. This matters because satellites need electronics that are reliable, efficient, and resilient in harsh conditions. In LEO, where platforms must be lighter and more integrated, these attributes are essential. BiCMOS for user terminals: For user terminals, BiCMOS is the best technology on the planet for front-end modules. These modules perform signal amplification, transmit and receive switching, filtering, and phase shifting for beamforming. They are central to the cost, performance, and scalability of phased-array antennas. ST’s BiCMOS platform is especially strong in Ku-band cost-optimized designs and Ka-band performance designs, both served from our French manufacturing base. Panel-Level Packaging: On the back end, ST’s Panel-Level Packaging, or PLP, is a genuine differentiator. Unlike traditional round-wafer packaging, PLP uses large rectangular panels, enabling high-volume production, strong RF and thermal performance, and miniaturization. The combination of BiCMOS and PLP is particularly powerful. Neither technology alone would be as compelling as the two together. This is a classic example of how our IDM model delivers technology excellence plus manufacturing execution. ST employee holding a BiCMOS PLP panel Starlink as proof of scale The clearest proof point for ST’s LEO capability is our long-standing collaboration with SpaceX. The relationship spans more than a decade and has involved co-development across key technologies for satellites and user terminals. So far, we have delivered more than 7.5 billion ICs into the program, with active silicon covering roughly 20,000 square meters, or the equivalent of four American football fields. The scale is extraordinary, and it demonstrates that ST can support industrial-grade space programs at very high volume. Economics, scale, and customer concentration Today the LEO market remains relatively concentrated. In the next five years, more players may emerge with the scale and capital intensity to matter, including Amazon Leo (formerly ‘Project Kuiper’), Terawave, OneWeb, European projects, and new emerging constellations. This concentration creates both opportunity and discipline. We believe we can sustain a leading position because of our process integration, packaging capabilities, and manufacturing independence. Product life cycles in user terminals are also short, around 18 months per generation, which reinforces the importance of our IDM model with the capability for industrial scale, rapid ramp-up, and tight execution. This is precisely the kind of environment where our manufacturing model creates advantage. The long-term ambition Our message is straightforward. We expect space to become a major growth driver, with an ambition to generate well above €3 billion in cumulative revenue from space over the 2026 to 2028 period. On the LEO side specifically, this includes broadband and direct-to-cell, with orbital data centers as potential upside. The broader significance is that ST is building a leadership position in a market that is only beginning to expand. LEO is no longer a niche space project. It is becoming a communications infrastructure layer, and eventually perhaps a compute layer, for the planet. For ST, the opportunity is not just about serving satellites. It is about supplying the technologies that make the new space economy scalable, efficient, and economically viable. Presentation: ST: The LEO Opportunity]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0021.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 4 Jun 2026 07:00:47 +0200</pubDate>

</item>
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	<title><![CDATA[STMicroelectronics high-performance vibration sensor with in-sensor AI offers a compelling alternative to piezosensor to fast-growing industrial condition-monitoring market]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an intelligent vibration sensor designed for industrial condition monitoring applications that require high accuracy, reliability, and energy efficiency. Built using ST MEMS (Micro Electromechanical Systems) technology, the IIS3DWB10IS vibration sensor with intelligent sensor processing unit (ISPU 2.0) brings advanced digital signal processing and AI inference closer to the sensing element. The result is a compact, rugged device that measures vibrations and shocks up to 200g at frequencies of 10 kHz and above. Combining digital precision and ease of use with a wide temperature range, up to 125°C, to withstand harsh environments, the vibration sensor is engineered to help customers improve equipment uptime, reduce unplanned downtime, and support predictive maintenance strategies across industrial environments. Vibration analysis is the dominant segment in condition monitoring, as many industries use rotating and oscillating machinery for cutting, shaping, moving, cooling, and other processes. The ability to prevent equipment stoppages through early detection of issues, such as predicting bearing failures in advance, helps companies across all sectors, including automotive and other manufacturing activities to optimize production flow. “Our industrial MEMS vibration sensor delivers the dynamic range and bandwidth needed for high-end applications and extends the advantages of ST in-sensor digital processing. Integrating the ISPU 2.0, with its new hardware accelerators for fast signal processing and AI inference, sharpens equipment-wear recognition while reducing latency and power consumption,“ said Simone Ferri, APMS executive VP MEMS sub-group. “Industries can expect a new generation of condition monitoring sensors, the first compelling alternative to piezosensor, that is lightweight, easy to fit and design, ultra-accurate, and energy efficient enough for battery-powered operations.” “The IIS3DWB10IS delivers unique properties for our target markets and environments. Its high dynamic range, wide bandwidth, and high-temperature capability, combined with ease of adoption and a cost-effective, simplified circuit design, allowed us to replace the incumbent piezosensor technology. Moreover, the integrated ISPU 2.0 processor positions complex signal processing and rapid AI inference close to the sensing element, enabling smarter system responses,” said Andrea Torcelli, Chief Technology Officer at Bonfiglioli S.P.A. By enabling predictive and prioritized maintenance, remote condition monitoring allows companies to improve equipment uptime and operating efficiency while eliminating unexpected failures and enhancing safety. Fortune Business Insights states the global market for this technology will exceed $5 billion by 2032, growing at over 9% CAGR[1] . [1] https://www.fortunebusinessinsights.com/machine-condition-monitoring-market-112654 Further technical information: The IIS3DWB10IS vibration sensor is the first digital sensor with wide bandwidth and embedded processing to deliver performance meeting the needs of high-end industrial condition monitoring applications offering a compelling alternative to piezoelectric sensors. Accurate measurement of vibrations above 10 kHz, with a large dynamic range up to 200g, combines with a noise floor as low as 35 µg/sqrt(Hz). This is comparable to the noise performance of piezoelectric sensors. Moreover, the IIS3DWB10IS delivers equivalent accuracy and sensitivity, adding digital-sensing advantages including smaller size, lower power consumption, simplified electrical and mechanical design, and greater flexibility in the computational partitioning. ISPU 2.0 (Intelligent Sensor Processing Unit) introduces new hardware accelerators to perform real-time signal processing and AI at the edge. These hardware accelerators make frequently used functions faster and more power efficient. The core is C-programmable and contains on-chip program and data RAM. The supporting ecosystem provides software libraries that facilitate executing typical vibration monitoring algorithms in the ISPU, including FFT, filtering, envelope, velocity severity, and anomaly detection. With 40 MIPS and 40 MFLOPS digital signal processing, the ISPU 2.0 delivers up to four times the processing performance of the previous generation. In addition, the ISPU 2.0 sensor interface supports six times faster data transfer with the MEMS circuitry. The IIS3DWB10IS also contains a 2048x80-bit FIFO register and an accurate temperature sensor. The sensor’s rugged MEMS-based design supports operation up to 125°C. The IIS3DWB10IS is supported in ST’s 10-year industrial longevity program. The IIS3DWB10IS is packaged as a 4.5 mm x 4.5 mm x 1.5 mm 16-lead LGA package with wettable flanks that facilitate automatic optical inspection in high-quality surface-mount assembly processes. The product is scheduled to be available by July 2026 from $25 for orders of 1000 pieces. Please visit https://www.st.com/IIS3DWB10IS for more information. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4778.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/P4778D-Jun-3-2026-IIS3DWB10IS-smart-vibrometer_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Wed, 3 Jun 2026 07:00:58 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics raises its revenue ambition for Data Centers amidst continued strong demand for AI infrastructure]]></title>
	<description><![CDATA[In light of continued strong AI infrastructure-led demand and based on recent progress made on capacity ramp-up, STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is raising its revenue ambition for Data Centers. Data center revenues are now expected at about $1 billion in 2026 (compared to “nicely above $500 million” expected previously). Assuming the current dynamic continues and with the current engagements we have, revenues could double in 2027 (compared to “well above $1 billion” expected previously). Forward-looking Information Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors: changes in global trade policies, including the continuation, adoption and expansion of tariffs and trade barriers and sanctions, that are affecting and could further affect the macro-economic environment and are adversely impacting and could further adversely impact the demand for our products; uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which are impacting and may further impact production capacity and end-market demand for our products; customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all; the ability to design, manufacture and sell innovative products in a rapidly changing technological environment; changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities; unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our research and development and manufacturing programs, which benefit from public funding; financial difficulties with any of our major distributors or significant curtailment of purchases by key customers; the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers; availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation); the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology; theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation; the impact of intellectual property claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions; changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets; variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations; the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant; product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts; natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate; increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027; epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results; industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action or additional research costs. Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions. Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2025 as filed with the Securities and Exchange Commission (“SEC”) on February 26, 2026. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances. Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our SEC filings, could have a material adverse effect on our business and/or financial condition. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3396.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 2 Jun 2026 07:01:57 +0200</pubDate>

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	<title><![CDATA[Water stewardship in action]]></title>
	<description><![CDATA[This article from our sustainability magazine Amplify highlights how our teams are enhancing water recycling in Kirkop (Malta) and strengthening collaborative water stewardship in Shenzhen (China). Water stewardship in action Chip production relies heavily on water, especially ultrapure water, which is needed to manufacture them. This dependency challenges semiconductor makers to optimize their use of water. By prioritizing water recycling and efficient usage, companies can reduce environmental impact while supporting the industry’s growth and resilience. At ST, we have developed a clear and practical approach to water stewardship focused on monitoring, risk management, and innovative solutions. This includes water stress assessments, conservation programs, water efficiency improvements, and wastewater treatment initiatives. Putting this approach into practice means implementing effective solutions at our sites. In Kirkop (Malta), our team introduced an advanced water recycling system that treats and reuses both production and facility wastewater. This system helps conserve valuable water resources while supporting our manufacturing needs. To better understand how this innovative system works, let’s take a closer look at the water treatment process step by step. 01 / EQUALIZATION TANK Water from production, domestic, and other facility sources is collected and mixed in the equalization tank. Here, the pH is carefully adjusted to create an optimal environment for beneficial bacteria to thrive. 02 / OXIDATION TANK The water flows into the oxidation tank, where tiny air bubbles promote natural breakdown of pollutants by bacteria. Nutrients such as glucose, urea, and phosphorus are added in precise amounts to support this process. Bioflocculation occurs here, causing bacteria and particles to clump together, which helps separate solids and improve water quality. 03 / MICRO BIOREACTOR (MBR) MEMBRANE FILTRATION The water then passes through the MBR membrane, an advanced filtration system that uses pressure to produce clean, high-quality water within a compact footprint. A 24/7 online monitoring system continuously tracks water quality, ensuring the treated water meets ultrapure standards and is ready for reuse. 04 / SLUDGE MANAGEMENT AND DECANTING To maintain system efficiency, sludge is regularly removed. A decanter extracts water from the sludge, leaving solid waste that is safely managed, completing a carefully controlled cycle of treatment and reuse. The need for collaboration We recognize that managing water responsibly means more than just focusing on our own sites. Water is a shared resource, and effective stewardship requires collaboration. We work with suppliers and industry groups, such as the Responsible Business Alliance, to share knowledge and advance water systems. Since joining the Alliance for Water Stewardship (AWS) in 2023, we have strengthened our approach to water stewardship. AWS stands out for its broad focus on water challenges and its thorough look at local water contexts beyond individual site operations. This encourages collaboration among many stakeholders to address shared water issues. Our Shenzhen site (China), has led the way in putting these ideas into action. In December 2024, it became the first ST site to be AWS certified, achieving Platinum ranking. The project involved several teams across the site, including Environmental, Health and Safety (EHS), Operations, Facilities, Quality Management, and Corporate Sustainability. Their main goal was to complete AWS certification within one year while establishing new ways to engage with stakeholders such as suppliers, neighboring businesses, NGOs, and local communities. Among the key initiatives was a pilot project to reuse reclaimed water for municipal uses like road cleaning and landscaping irrigation. This reduced wastewater discharge and conserved tap water. In partnership with Hitachi Global Storage Technologies, the team improved industrial wastewater treatment and built infrastructure that can supply reclaimed water to the community with a capacity of 4,000 cubic meters per day. In addition, the team conducted a supply chain water risk assessment by distributing questionnaires and analyzing responses from several suppliers. This helped identify water risks and indirect water use across the supply chain, providing valuable insights for future action. This article is one of many featured in our new sustainability magazine. Explore the full issue to discover more initiatives, insights, and perspectives from across ST at st-sustainability-magazine-amplify-vol1-en.pdf]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0020.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 1 Jun 2026 12:59:52 +0200</pubDate>

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	<title><![CDATA[Statement from the Supervisory Board of STMicroelectronics]]></title>
	<description><![CDATA[Following the conclusion of STMicroelectronics N.V. (NYSE: STM) Annual General Meeting of Shareholders, which took place today in Amsterdam (the Netherlands), the members of the Supervisory Board of ST appointed Mr. Armando Varricchio as the Chairman and Mr. Nicolas Dufourcq as the Vice-Chairman of the Supervisory Board, respectively, for a 3-year term to expire at the end of the 2029 AGM. The biographies of Messrs. Varricchio and Dufourcq are available on the Company’s website (www.st.com). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3395.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 27 May 2026 11:50:59 +0200</pubDate>

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	<title><![CDATA[All resolutions approved at the 2026 STMicroelectronics’ Annual General Meeting of Shareholders]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the results related to the voting items of its 2026 Annual General Meeting of Shareholders (the “2026 AGM”), which was held today in Amsterdam, the Netherlands. The press release is available as a PDF here.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3394.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 27 May 2026 11:40:39 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications from AI servers to robotics]]></title>
	<description><![CDATA[New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications that support electrification. The 700V PowerGaN devices in the STPOWER portfolio address challenges such as rising AI server power consumption and the need for higher-performance power conversion beyond the limits of conventional silicon technologies. ST’s new PowerGaN devices deliver high efficiency and power density to high-voltage power supplies. Engineered for a 700V operating rating, they support reliable high-power operation and higher-frequency topologies. PowerGaN’s inherent advantages, including low conduction losses, very low switching loss at high operating frequencies, and zero reverse-recovery charge, enable reduced system size, weight, and operating temperature. These attributes are important for power semiconductors used in robotics, industrial power supplies, and smart-grid converters for energy generation, distribution, and storage. “Broadening our PowerGaN portfolio with new 700V devices extends the benefits of gallium-nitride technology into medium-power and high-power applications,” said Mario Aleo, Executive Vice President, Power & Discrete Sub-Group, STMicroelectronics. “We will continue to expand the portfolio with additional voltage ratings and features, reinforcing our commitment to GaN for tomorrow’s AI servers, humanoid robotics, industrial power, and advanced consumer power applications including home appliances.” Technical Notes to Editors: The seven new GaN enhancement-mode transistors (HEMTs) now joining ST’s 700V PowerGaN series cover a wide range of continuous current ratings, from 6 A to 29 A, and typical RDS(on) from 53 mΩ to 270 mΩ. Also featuring ultra-low internal capacitances and low gate charge, inherent in GaN wide-bandgap technology, each has a Qg x RDS(on) figure of merit (FoM) significantly ahead of traditional silicon devices. Qualified to ST’s reliability standards, the 700V devices broaden choices and ensure leading‑edge performance and efficiency. They can drop into power‑conversion circuits as a replacement for MOSFETs, or enable new, higher‑frequency topologies. Their capability to operate at elevated switching frequencies reduces the size of magnetics and passives, enabling a more compact power stage and higher power density. The devices are housed in DPAK, TO-LL, and PowerFLAT surface-mount packages that are proven in practice and widely supported by major electronic design automation libraries and toolchains. The TO-LL and PowerFLAT devices provide a Kelvin source connection that separates the gate-control circuit from the main power path to maximize noise immunity, protect the gate driver, and preserve timing margin. The devices introduced are: • SGT350R70GTK (6 A, 270 mΩ*) in 6.10 mm x 6.60 mm 3-pin DPAK with solderable tab. • SGT070R70HTO (26 A, 53 mΩ*) in leadless TO-LL with thermally efficient drain and source connections. • SGT080R70ILB (29 A, 60 mΩ*), SGT105R70ILB (21.7 A, 80 mΩ*), SGT140R70ILB (17 A, 106 mΩ*), SGT190R70ILB (11.5 A, 138 mΩ*), SGT240R70ILB (10 A, 165 mΩ*) in PowerFLAT 8x8 with solderable source pad for enhanced thermal performance. (*) typical RDS(on) The new 700V PowerGaN transistors are in production now and available from the eSTore or through distributors, from $0.63 to $2.25 for orders of 1000 pieces. Please visit https://www.st.com/new-700v-powergan]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/n4776.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/05/N4776I-May-26-2026-PowerGaN_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 26 May 2026 14:00:02 +0200</pubDate>

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	<title><![CDATA[How ST’s intelligent sensing is enabling Physical AI]]></title>
	<description><![CDATA[By Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group, Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office. From factory floors and operating rooms to self-driving cars and smart homes, artificial intelligence is taking on tasks that require it to understand and respond to the real world in real time. This is the era of Physical AI: systems that don\'t just process data, but perceive, decide, and act. For AI to operate safely and reliably in dynamic environments, it needs a continuous, accurate feed of physical-world information from temperature to motion, pressure, proximity and orientation, interpreted fast enough to matter. This sensing layer is the foundation on which every downstream decision rests. STMicroelectronics sits at the heart of this challenge. With a technology portfolio spanning MEMS and optical sensing, microcontrollers, edge AI processing, and wide bandgap semiconductors for power delivery, ST provides the full signal chain from first sensor contact to final actuator command. The ability to filter, classify, and act on physical data before it ever reaches a central processor is critical. Intelligent sensing is becoming a defining enabler of Physical AI, and ST\'s approach is shaping what machines can know, and do, about the world around them. Why Physical AI needs more than data Most AI innovation of the past decade has been driven by algorithms trained in data centers and deployed via the cloud. But as AI migrates into cars, factories, hospitals, and homes, its performance is constrained by the quality, fidelity, and timeliness of its inputs. Sensing is at the heart of making good decisions. But the dominant sensing architecture today is still fundamentally passive: sensors stream raw data to centralized processors, which derive context and issue commands. This creates three structural problems that become increasingly untenable as AI takes on safety-critical roles. Latency is the most immediate. Autonomous vehicles, industrial robots, and human-machine interfaces cannot wait for a round trip to a remote processor. Decisions must be made in milliseconds, at the point of perception. Power and bandwidth are next. Continuous transmission of raw sensor data is expensive in energy and network resources. Physical AI requires millions of devices, many running on battery to scale. Safety and reliability are the most consequential. Noisy signals, dropped data, or misinterpreted data in systems that operate near people pose risks. The closer AI gets to the physical world, the higher the cost of a perceptual failure. The shift underway is therefore not about deploying more sensors but about using more intelligent ones. ST\'s answer: sensors that sense and think STMicroelectronics is addressing this challenge by moving intelligence as close as possible to where data originates. Rather than treating sensors as passive data sources, ST\'s intelligent sensing solutions extract context locally, filter and interpret raw signals at the edge, and transmit only the information that matters. The result is lower latency, reduced power consumption, lighter network load, and stronger privacy, because most data never needs to leave the device. ST pursues this through two complementary and increasingly converging pillars. Firstly, Edge AI combines ST\'s sensors with STM32 microcontrollers and dedicated AI accelerators to enable analytics and inference directly on the device. This delivers fast, deterministic responses without dependence on cloud connectivity, a critical capability in automotive systems, industrial controls, and smart infrastructure where network availability cannot be assumed and response times are measured in microseconds. Secondly, in-sensor AI pushes intelligence further still, inside the sensor itself. Through embedded cores such as the Intelligent Sensor Processing Unit (ISPU) and on-sensor machine learning engines, ST devices can process raw sensing data in real time, execute ML algorithms at ultralow power, and output high-level information using a classified gesture, a detected anomaly, a recognized motion pattern, rather than a raw data stream. This matters enormously in wearables, robotics, and personal electronics, where responsiveness and battery life are fundamental requirements. Together, these pillars define a new sensing paradigm with sensors that understand what they perceive. ST’s full-stack advantage What distinguishes ST\'s position in intelligent sensing is not any single technology, but the coherence of the stack behind it. ST brings together leadership in MEMS motion, pressure, and environmental sensing; advanced imaging capabilities including 2D, 3D, and Time-of-Flight; STM32 microcontrollers with neural processing units; and the software tools to integrate them. Crucially, ST controls this stack from research and design through to manufacturing, including 300 mm fabs in Europe. This integration means ST can engineer the interfaces between sensing, processing, and actuation as a coherent system, rather than optimizing each layer in isolation. For Physical AI architectures, where the interaction between sensing and decision-making is the performance-critical variable, this is a genuine differentiator. ST\'s technology and product breadth positions the company to serve both consumer and high-value automotive and industrial applications simultaneously. From consumer to mission-critical ST has long been a trusted sensing partner for consumer electronics, enabling the motion awareness, environmental responsiveness, and biometrics that have become standard in smartphones, wearables, and gaming devices. That consumer heritage built on volume, miniaturization, and power efficiency, provides a strong foundation for the more demanding environments ST is increasingly serving. Intelligent sensing is becoming foundational infrastructure for the most significant structural shifts of the coming decade: the energy transition, remote and continuous healthcare, smart cities, next-generation consumer devices, and the continued automation of industry. Across all of them, the sensor is no longer a passive input device. It is an intelligent agent at the frontier between the digital and physical worlds. In automotive, ST\'s intelligent sensing is enabling driver and in-cabin monitoring, advanced driver assistance systems (ADAS), and autonomous driving. In industrial settings, it underpins collaborative robotics, predictive maintenance, and condition monitoring on factory floors. In smart infrastructure, it supports continuous, low-power monitoring of buildings, energy systems, and urban environments. In imaging, ST is concentrating on high-growth segments where precise, robust perception is essential for future mobility, automation, and smart environments. What intelligent sensing enables: the capability map Across every domain where Physical AI is taking hold, ST\'s intelligent sensing portfolio is unlocking a consistent set of strategic capabilities: Immediate responsiveness. Robots, vehicles, and autonomous devices can react to people and changing conditions in real time, enabling interactions that feel natural rather than mechanical. Operational safety. Continuous, high-fidelity perception and motion awareness are prerequisites for systems that share space with humans whether on a factory floor, a public road, or in a domestic environment. Edge independence. Local processing reduces dependence on network connectivity, increases system resilience, and cuts the energy and bandwidth cost of large-scale deployment. System simplicity. Higher integration and embedded intelligence reduce external component counts, lowering both system complexity and bill-of-materials cost. Predictive maintenance and uptime. Low-power continuous monitoring enables condition-based maintenance strategies that extend asset life and reduce unplanned downtime. Privacy and trustworthiness. Sensitive data processed on-device never traverses a network. Combined with in-house manufacturing and a robust supply chain, this supports secure, auditable deployment at scale. The humanoid robot test case No application illustrates the demands of Physical AI more vividly than humanoid robotics. A humanoid robot must sense its environment continuously and accurately, understand human presence and intention, maintain dynamic balance, navigate unpredictable spaces, and manipulate objects, often in close proximity to people, in real time, without fail. It is, in effect, a walking proof of concept for every challenge Physical AI must solve. ST estimates that a typical humanoid robot contains approximately $600 of addressable semiconductor content. ST is already working with multiple humanoid robot developers worldwide, providing the sensing and edge computing capabilities that allow these systems to perceive, move, and interact safely in human environments. As the humanoid market scales from research platforms to deployed systems, the quality of sensing will be among the most important variables. That awareness is what Physical AI requires. And sensing is where it begins. Conclusion Physical AI is already being designed into products that will define the next generation of mobility, manufacturing, healthcare, and infrastructure. By embedding intelligence at the point of perception ST is helping customers build machines that are not merely connected to the world, but genuinely aware of it.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0019.html</link>
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	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 26 May 2026 07:00:46 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics President and CEO Jean-Marc Chery to speak at BNP Paribas Exane CEO conference]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) President and Chief Executive Officer Jean-Marc Chery will speak at the BNP Paribas Exane CEO conference in Paris on June 2, 2026 at 11 A.M. Central European Time. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay until June 16, 2026. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3393.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 25 May 2026 07:00:50 +0200</pubDate>

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	<title><![CDATA[ST and quantum: bringing industrial scale to a new compute frontier]]></title>
	<description><![CDATA[ST is bringing its industrial semiconductor expertise to quantum computing, helping advance silicon-based quantum processors toward commercial viability, with the quality, scalability, and cost discipline required for real-world deployment. With its integrated device manufacturer (IDM) model, 300 mm manufacturing leadership in its Fab in Crolles/France, and fully depleted silicon-on-insulator (FD-SOI) technology platform, ST is well positioned to address one of quantum computing’s central challenges: industrialization. Why quantum computing now? Quantum computing is a major frontier in advanced computing, with the potential to address problem classes that are increasingly difficult for classical systems. For ST, the opportunity lies in helping turn that scientific progress into manufacturable, scalable, and reliable technology. Our industrial semiconductor expertise, with our 300 mm manufacturing capabilities in Crolles/France, is highly relevant to this next phase of quantum computing, where success will depend as much on industrialization as on physics. Where is the field today? Quantum computing is entering a phase where industrial requirements matter more than ever. The next step is not only to prove that a device works, but also to build systems that are manufacturable, stable, and scalable. From ST’s perspective, the future of quantum will depend on the same disciplines that have shaped advanced semiconductor technologies: process control, integration, quality, and platform maturity. Industrializing those breakthroughs is what will make quantum relevant for real-world compute environments, including future applications powered by high-performance computing. What qualifies ST for the quantum industry? ST is an industrial enabler of quantum computing. As a global IDM, we bring deep manufacturing expertise and proven technology development capabilities to a field that must move from laboratory demonstrations to scalable hardware. Our role is to help bridging the gap between quantum potential and industrial deployment, because quantum computing will only become broadly relevant if it can be produced with the consistency, integration, and quality expected from advanced semiconductor technologies. Why does ST believe silicon / FD-SOI will help industrialize quantum computing? ST believes that silicon-based approaches are especially promising because they build on the semiconductor industry’s strengths and investment for high-volume manufacturing, thus offering a faster path to industrialization. FD-SOI is particularly relevant because it combines strong power-performance, excellent variability control and high integration potential, capabilities that are critical for quantum architectures, where stability, precision, and reproducibility matter. Together, these attributes help move quantum hardware from experimental concepts to manufacturable quantum hardware. What must happen for quantum to scale? ST brings the industrial foundations needed to help quantum hardware scale. As a global IDM, we have end-to-end control from technology development to manufacturing execution, and our 300 mm manufacturing leadership provides the process maturity, consistency, and scalability required for industrial deployment. We also bring deep expertise in FD-SOI, a technology platform particularly well suited to applications where power efficiency, variability control, and integration are essential. How does this fit into the broader compute landscape? ST sees quantum computing and HPC as complementary parts of a broader advanced computing landscape. HPC will remain essential for large-scale simulation, classical workloads, and data-intensive applications while quantum computing may one day accelerate specific classes of highly complex problems where classical computing becomes less efficient. The future is likely to be heterogeneous, with quantum and classical systems working together and ST’s role is to provide the semiconductor foundations that support this evolution.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0018.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Thu, 21 May 2026 07:00:13 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics brings always-on vision to next-generation personal electronics with new ultralow-power image sensors]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB color) sensors, part of the ST BrightSense portfolio, are now available to early adopters, enabling customers to start designing their next generation of smart, ultralow-power vision devices today. Designed for the next wave of personal electronics and smart devices, the new sensors serve applications including wearables, AR/VR and XR headsets, smart home appliances and medical devices. They are engineered to deliver rich visual context and AI-ready data under tight constraints on power, size, and cost. The sensors combine an ultralow-power detect-and-wake architecture with a very small global-shutter optical format and interfaces optimized for low-power microcontrollers and cost-effective systems on chips (SoCs). “Always‑on vision is becoming essential for the next generation of personal electronics, from smart glasses and AR/VR headsets to intelligent home appliances and medical devices. With VD55G4 and VD65G4, we are bringing this capability to smaller, lighter products that must run for a long time on a tiny battery. These new sensors help our customers create more intuitive and responsive experiences, extend battery life, and bring embedded vision and edge AI into everyday devices,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. From wearables and AR/VR to smart appliances VD55G4 and VD65G4 bring always‑on vision to products that must stay small, light, and extremely power‑efficient. Building on the ST BrightSense family, they add a color option, faster response for interactive use cases, and simple connectivity to low‑power microcontrollers, making it easier to add vision to space‑ and cost‑constrained designs. In wearables, the sensors enable all‑day, always‑aware features such as glance detection, presence sensing, and contextual alerts, while fitting into very compact designs and working directly with microcontroller‑based platforms. For AR/VR and XR headsets, they combine low power and high‑quality capture to support accurate tracking and spatial awareness, helping extend battery life without compromising comfort. In smart home appliances, IoT devices, and medical products, the sensors allow more intelligence to run locally on the device itself, reducing cloud dependence and standby power. Their tiny size and energy efficiency also make them well suited to solar‑ or energy‑harvesting‑powered vision nodes. Ultralow‑power design that consumes up to 10x less Thanks to an optimized sensor architecture and dedicated always‑on mode, VD55G4 and VD65G4 can consume up to 10 times less power than conventional global‑shutter sensors. They can watch for changes in a scene and wake up the main processor only when needed, shifting from continuous streaming to event‑driven operation. This enables all‑day, always‑on experiences, longer battery life, and practical vision systems powered by small batteries or energy harvesting. Their very small footprint and integrated image processing simplify design and reduce system cost, while supporting responsive, AI‑ready vision features in a wide range of edge devices. Growing design ecosystem The VD55G4 (monochrome) and VD65G4 (RGB color) image sensors are produced on 300 mm wafers using a 3D‑stacked 65 nm / 40 nm architecture and in-house process and manufactured in ST Crolles plant. ST is also offering the full companion ecosystem with multiple tools and resources, including: • development boards for platforms such as STM32 and Raspberry Pi, • turnkey camera modules, • evaluation software, platform drivers, • a software development kit to accelerate embedded vision projects. These upcoming public resources will help designers quickly prototype and deploy always-on vision solutions with these new sensors. Pricing information and sample requests are available from STMicroelectronics sales offices. Learn more about ST BrightSense portfolio at: www.st.com/industrial-consumer-cmos-image-sensors About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4772.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/04/P4772D-Apr-28-2026-New-BrightSense-image-sensors_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Tue, 28 Apr 2026 07:01:57 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics to host investor call on the LEO opportunity]]></title>
	<description><![CDATA[STMicroelectronics N.V. (NYSE: STM) will host a webcast for investors and analysts on May 4, 2026, on the LEO opportunity, hosted by Remi El-Ouazzane, President of ST’s Microcontrollers, Digital ICs and RF products Group. The presentation, starting at 3.30pm CET / 9.30am ET, will be followed by a Q&A session. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3391.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 23 Apr 2026 14:01:53 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics Reports Q1 2026 Financial Results]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the first quarter ended March 28, 2026. This press release also contains non-U.S. GAAP measures (see Appendix for additional information). ST reported first quarter net revenues of $3.10 billion, gross margin of 33.8%, operating income of $70 million, and net income of $37 million or $0.04 diluted earnings per share (non-U.S. GAAP1 gross margin of 34.1%, non-U.S. GAAP1 operating income of $171 million, and non-U.S. GAAP1 net income of $122 million or $0.13 diluted earnings per share). Jean-Marc Chery, ST President & CEO, commented: “Q1 net revenues, excluding the contribution of our acquisition of NXP’s MEMS sensor business, came above the mid-point of our business outlook range, driven mainly by higher revenues in our engaged customer programs in Personal electronics and CECP. Gross margin was above the mid-point of our business outlook range mainly due to better product mix.” “On a year-over-year basis, Q1 net revenues increased 23.0%; excluding the contribution of our acquisition of NXP’s MEMS sensor business, they increased 21.4%. Q1 gross margin was 33.8%, operating margin was 2.3% and net income was $37 million. On a non-U.S. GAAP basis gross margin was 34.1%, operating margin was 5.5% and net income was $122 million.” “In Q1, despite the macroeconomic uncertainty, we saw improving demand with strong booking and normalized inventory in distribution.” “Our second quarter business outlook, at the mid-point, is for net revenues of $3.45 billion, increasing 11.6% sequentially and 24.9% year-over-year. Gross margin is expected to be about 34.8%, including about 100 basis points of unused capacity charges. Non-U.S. GAAP1 gross margin is expected to be about 35.2%.” “ST is now strategically positioned to capture upside from new AI driven programs, leveraging specialized technologies to enable the evolving AI infrastructure, confirming our datacenters revenue expectation to be nicely above $500 million for 2026 and well above $1 billion for 2027.” The press release is available as a PDF here. 1 Non-U.S. GAAP. See Appendix for reconciliation to U.S. GAAP and information explaining why the Company believes these measures are important.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3392.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 23 Apr 2026 06:01:29 +0200</pubDate>

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	<title><![CDATA[ST advances towards 2027 carbon neutrality goal]]></title>
	<description><![CDATA[Jean Louis Champseix, Group Vice President Corporate Sustainability at STMicroelectronics, shares our 2025 sustainability results, marking the second year of reporting under the Corporate Sustainability Reporting Directive (CSRD). Using 2024 as a baseline, the 2025 Annual Report provides an updated view of our trajectory towards carbon neutrality by 2027 and our broader environmental and social ambitions. In 2025, we continued to advance our sustainability journey within the company, building on the second year of CSRD reporting and staying on track toward carbon neutrality by 2027. The results below highlight progress across our key environmental and social priorities, reflecting the collective commitment of our teams and partners. Some of our key results in 2025: Climate adverse process gases abated: 83% (up from 76% in 2024), keeping ST on track to reach 90% abatement by 2030. Waste diverted from disposal: 97%, as in 2024, and above the goal to recycle, recover and prepare for reuse at least 95% of waste each year. Water recycled or reused: 51%, slightly down from 53% in 2024. ST has projects underway to reach 60% by 2035. Safety total recordable case rate: 0.47 (using CSRD methodology), compared to 0.65 in 2024 and, better than the goal of <0.75. Labor and human rights: 10 of 11 manufacturing sites with Responsible Business Alliance (RBA) platinum recognition as in 2024. Women in management: 22%, up from 21% in 2024, progressing towards 25% by 2035. These indicators are examples of the progress achieved on some environmental and social topics identified as material in ST’s double materiality assessment and contribute to addressing both the Company’s impacts and the issues that matter to our stakeholders. Status of ST’s carbon neutrality goal We remain on track to achieve carbon neutrality by the end of 2027 for our direct and indirect emissions (Scopes 1 and 2) and product transportation, business travel, and employee commuting emissions (Scope3). In 2025, we achieved our two strategic milestones endorsed by the Science Based Targets initiative (SBTi): 50% reduction of absolute Scope 1 and 2 GHG market-based emissions versus 2018 80% renewable electricity sourcing with ST going further by sourcing 86% renewable electricity in 2025 This achievement reflects energy actions including new power purchase agreements (PPAs) in France and Italy, purchase of energy attribute certificates and where possible, onsite installations for renewable energy production. A key project in 2025 was the start of operations of Singapore’s largest industrial district cooling system at our Ang Mo Kio TechnoPark, developed with our partner SP Group. This system is designed to reduce carbon emissions by up to 120,000 tons per year and cut cooling related electricity use by 20%. Importantly, it also frees up space for additional abatement equipment, supporting ST’s goal to reach 90% process gas abatement by 2030. As part of our 2027 carbon neutrality plan, we are preparing to address residual emissions. In 2025, a roadmap for offsetting residual emissions was defined, identifying carbon credit suppliers that support credible projects and are aligned with recognized quality standards. This work will allow ST to start offsetting residual emissions from 2026, alongside its continued focus on reducing emissions across its own operations and upstream value chain. Embedding sustainability through collaboration Delivering our sustainability ambitions requires them to be embedded into how we run the Company. Over the past year, we strengthened our governance and ways of working, with collaboration at the core. A revised approach to program management has increased cooperation across organizations and functions on shared priorities. Dedicated boards and cross functional workstreams focus on areas such as data digitalization and stakeholder engagement, supporting operational roadmaps and risk management aligned with ST’s double materiality assessment and sustainability strategy. Our employees play a central role. We encourage everyone to contribute to sustainability in their day-to-day activities, acting with shared vigilance and as role models in safety and inclusion. Our strong safety performance in 2025 and steady progress on gender balance in management roles reflect this collective effort. Externally, we are deepening collaboration in our value chain, with a strong focus on decarbonization and responsible business practices. We work closely with suppliers to help reduce upstream emissions and to strengthen social, labor, human rights, and environmental standards. In 2025, we shared a decarbonization charter with our top 50 most GHG emissive suppliers. Industry and multistakeholder collaborations are another important lever. ST has been a member of the Responsible Business Alliance (RBA) since 2005 and joined the Alliance for Water Stewardship (AWS) in 2023. In 2024, our Shenzhen site in China achieved AWS certification, marking the start of our goal to certify our manufacturing sites under the AWS standard by 2035. After more than three decades of commitment, sustainability is firmly integrated into how we run our operations and make business decisions. At ST, employees are given the opportunity to be sustainability actors and to actively contribute to the Company sustainability strategy. By working together with our employees and partners, we strive to create long-term value for all our stakeholders. For further information about our approach to sustainability see: https://www.st.com/sustainability]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0017.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 16 Apr 2026 10:34:23 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics Announces Timing for First Quarter 2026 Earnings Release and Conference Call]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release first quarter 2026 earnings before the opening of trading on the European Stock Exchanges on April 23, 2026. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its first quarter 2026 financial results and current business outlook on April 23, 2026 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until May 8, 2026. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3390.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Fri, 3 Apr 2026 07:00:23 +0200</pubDate>

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