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	<title>STMicroelectronics News Release</title>
	<link>https://www.st.com/content/st_com/en/press-rss.html</link>
	<description>A Collection of STMicroelectronics News Release</description>
	<language>en</language>
	<lastBuildDate>Fri, 5 Jun 2026 23:10:19 +0200</lastBuildDate>
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	<title><![CDATA[STMicroelectronics and the LEO opportunity]]></title>
	<description><![CDATA[By Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group. A new space economy is taking shape The space industry can be seen as evolving along two broad paths. Traditional space includes geostationary and medium Earth orbit systems used for established applications such as broadcasting, meteorology, and GNSS. These programs are mission-critical, but they are characterized by large satellites, long development cycles, and highly predictable service models. Low Earth orbit (LEO) is different. It is built around smaller satellites, much faster deployment, lower latency, and business models designed for mass adoption. This shift is not just about orbit altitude; it is about economics. LEO opens the door to broader connectivity, higher deployment volumes, and stronger semiconductor content per system. That change has been enabled by three major technology inflections. First, launch costs have fallen dramatically thanks to reusable rockets. Second, satellites have become lighter, more standardized, and more digital, with software-defined payloads and inter-satellite optical links increasingly common. Third, user terminals have evolved from traditional parabolic antennas into electronically steered phased arrays capable of tracking fast-moving satellites with precision and reliability. Together, these shifts have created an ecosystem where silicon content matters more than ever. ST’s position: from early participation to market leadership ST has been active in space for more than 45 years, with a long track record across both traditional and new space programs. In LEO, the company was involved from the beginning and has since become the leading semiconductor player in the market. That leadership is already visible in the numbers. ST’s LEO-related revenue reached approximately $600 million in 2025, up from about $175 million in 2021, representing a CAGR of roughly 36%. This is an impressive starting point, but the opportunity is still in its early innings. The market is expanding quickly, the customer base is broadening, and the underlying technology roadmap continues to deepen semiconductor content across satellites, gateways, and user terminals. Why LEO is scaling so fast The economics of LEO are being transformed by scale. Gartner estimates that LEO services spending will approach $15 billion globally in 2026. The growth is continuing across three major service categories: broadband, direct-to-cell, and eventually orbital data centers. Broadband is the largest opportunity today. LEO constellations can connect underserved regions, improve resilience for corporate and government users, and provide connectivity for mobility applications such as aviation, maritime, and eventually automotive. In a world where almost 3 billion people remain on the wrong side of the digital divide, the importance of global broadband access is difficult to overstate. The second growth engine is direct-to-cell, which enables phones and IoT devices to connect directly to satellites acting as cell towers in space. This expands connectivity into previously unreachable areas and opens growth in roaming-free services and asset tracking. The third frontier is orbital data centers. While still early, the concept is gaining traction as the cost of launch per kilogram is reduced and the economics of putting compute in orbit become more credible. A highly semiconductor-intensive ecosystem Over the next five years, LEO will scale rapidly into a true communications ecosystem. Space-based downlink capacity is expected to grow around 10x by 2030, gateway infrastructure will expand by estimated 1.6x, and subscribers could rise from about 10 million today to more than 200 million. LEO is not just a communications market. It is a semiconductor market. ST’s opportunity spans all three layers of the ecosystem: • Satellites • Gateways • User terminals Each layer has different technical requirements, but all rely on advanced silicon content. A key factor is the scale: the market is shipping thousands of satellites per year, thousands of gateways, and millions, eventually tens of millions, of user terminals. That combination creates a very large addressable market. Based on our current view, we estimate that LEO broadband electronics SAM was around $650 million in 2025, growing to roughly $2 billion in 2028 and close to $3 billion by 2030, excluding additional upside from orbital data centers. Technology differentiation: where ST wins ST’s competitive strength in LEO comes from the combination of our process technologies, packaging capabilities, and manufacturing scale. FD-SOI for satellites and microcontrollers: ST’s Fully Depleted Silicon On Insulator, or FD-SOI, supplied from our 300 mm fab in France and through foundry partnerships, is a key enabler for ASICs and microcontrollers in space systems. It offers a combination of performance, power efficiency, radiation robustness, and embedded memory capabilities. This matters because satellites need electronics that are reliable, efficient, and resilient in harsh conditions. In LEO, where platforms must be lighter and more integrated, these attributes are essential. BiCMOS for user terminals: For user terminals, BiCMOS is the best technology on the planet for front-end modules. These modules perform signal amplification, transmit and receive switching, filtering, and phase shifting for beamforming. They are central to the cost, performance, and scalability of phased-array antennas. ST’s BiCMOS platform is especially strong in Ku-band cost-optimized designs and Ka-band performance designs, both served from our French manufacturing base. Panel-Level Packaging: On the back end, ST’s Panel-Level Packaging, or PLP, is a genuine differentiator. Unlike traditional round-wafer packaging, PLP uses large rectangular panels, enabling high-volume production, strong RF and thermal performance, and miniaturization. The combination of BiCMOS and PLP is particularly powerful. Neither technology alone would be as compelling as the two together. This is a classic example of how our IDM model delivers technology excellence plus manufacturing execution. ST employee holding a BiCMOS PLP panel Starlink as proof of scale The clearest proof point for ST’s LEO capability is our long-standing collaboration with SpaceX. The relationship spans more than a decade and has involved co-development across key technologies for satellites and user terminals. So far, we have delivered more than 7.5 billion ICs into the program, with active silicon covering roughly 20,000 square meters, or the equivalent of four American football fields. The scale is extraordinary, and it demonstrates that ST can support industrial-grade space programs at very high volume. Economics, scale, and customer concentration Today the LEO market remains relatively concentrated. In the next five years, more players may emerge with the scale and capital intensity to matter, including Amazon Leo (formerly ‘Project Kuiper’), Terawave, OneWeb, European projects, and new emerging constellations. This concentration creates both opportunity and discipline. We believe we can sustain a leading position because of our process integration, packaging capabilities, and manufacturing independence. Product life cycles in user terminals are also short, around 18 months per generation, which reinforces the importance of our IDM model with the capability for industrial scale, rapid ramp-up, and tight execution. This is precisely the kind of environment where our manufacturing model creates advantage. The long-term ambition Our message is straightforward. We expect space to become a major growth driver, with an ambition to generate well above €3 billion in cumulative revenue from space over the 2026 to 2028 period. On the LEO side specifically, this includes broadband and direct-to-cell, with orbital data centers as potential upside. The broader significance is that ST is building a leadership position in a market that is only beginning to expand. LEO is no longer a niche space project. It is becoming a communications infrastructure layer, and eventually perhaps a compute layer, for the planet. For ST, the opportunity is not just about serving satellites. It is about supplying the technologies that make the new space economy scalable, efficient, and economically viable. Presentation: ST: The LEO Opportunity]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0021.html</link>
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	<pubDate>Thu, 4 Jun 2026 07:00:47 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics high-performance vibration sensor with in-sensor AI offers a compelling alternative to piezosensor to fast-growing industrial condition-monitoring market]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an intelligent vibration sensor designed for industrial condition monitoring applications that require high accuracy, reliability, and energy efficiency. Built using ST MEMS (Micro Electromechanical Systems) technology, the IIS3DWB10IS vibration sensor with intelligent sensor processing unit (ISPU 2.0) brings advanced digital signal processing and AI inference closer to the sensing element. The result is a compact, rugged device that measures vibrations and shocks up to 200g at frequencies of 10 kHz and above. Combining digital precision and ease of use with a wide temperature range, up to 125°C, to withstand harsh environments, the vibration sensor is engineered to help customers improve equipment uptime, reduce unplanned downtime, and support predictive maintenance strategies across industrial environments. Vibration analysis is the dominant segment in condition monitoring, as many industries use rotating and oscillating machinery for cutting, shaping, moving, cooling, and other processes. The ability to prevent equipment stoppages through early detection of issues, such as predicting bearing failures in advance, helps companies across all sectors, including automotive and other manufacturing activities to optimize production flow. “Our industrial MEMS vibration sensor delivers the dynamic range and bandwidth needed for high-end applications and extends the advantages of ST in-sensor digital processing. Integrating the ISPU 2.0, with its new hardware accelerators for fast signal processing and AI inference, sharpens equipment-wear recognition while reducing latency and power consumption,“ said Simone Ferri, APMS executive VP MEMS sub-group. “Industries can expect a new generation of condition monitoring sensors, the first compelling alternative to piezosensor, that is lightweight, easy to fit and design, ultra-accurate, and energy efficient enough for battery-powered operations.” “The IIS3DWB10IS delivers unique properties for our target markets and environments. Its high dynamic range, wide bandwidth, and high-temperature capability, combined with ease of adoption and a cost-effective, simplified circuit design, allowed us to replace the incumbent piezosensor technology. Moreover, the integrated ISPU 2.0 processor positions complex signal processing and rapid AI inference close to the sensing element, enabling smarter system responses,” said Andrea Torcelli, Chief Technology Officer at Bonfiglioli S.P.A. By enabling predictive and prioritized maintenance, remote condition monitoring allows companies to improve equipment uptime and operating efficiency while eliminating unexpected failures and enhancing safety. Fortune Business Insights states the global market for this technology will exceed $5 billion by 2032, growing at over 9% CAGR[1] . [1] https://www.fortunebusinessinsights.com/machine-condition-monitoring-market-112654 Further technical information: The IIS3DWB10IS vibration sensor is the first digital sensor with wide bandwidth and embedded processing to deliver performance meeting the needs of high-end industrial condition monitoring applications offering a compelling alternative to piezoelectric sensors. Accurate measurement of vibrations above 10 kHz, with a large dynamic range up to 200g, combines with a noise floor as low as 35 µg/sqrt(Hz). This is comparable to the noise performance of piezoelectric sensors. Moreover, the IIS3DWB10IS delivers equivalent accuracy and sensitivity, adding digital-sensing advantages including smaller size, lower power consumption, simplified electrical and mechanical design, and greater flexibility in the computational partitioning. ISPU 2.0 (Intelligent Sensor Processing Unit) introduces new hardware accelerators to perform real-time signal processing and AI at the edge. These hardware accelerators make frequently used functions faster and more power efficient. The core is C-programmable and contains on-chip program and data RAM. The supporting ecosystem provides software libraries that facilitate executing typical vibration monitoring algorithms in the ISPU, including FFT, filtering, envelope, velocity severity, and anomaly detection. With 40 MIPS and 40 MFLOPS digital signal processing, the ISPU 2.0 delivers up to four times the processing performance of the previous generation. In addition, the ISPU 2.0 sensor interface supports six times faster data transfer with the MEMS circuitry. The IIS3DWB10IS also contains a 2048x80-bit FIFO register and an accurate temperature sensor. The sensor’s rugged MEMS-based design supports operation up to 125°C. The IIS3DWB10IS is supported in ST’s 10-year industrial longevity program. The IIS3DWB10IS is packaged as a 4.5 mm x 4.5 mm x 1.5 mm 16-lead LGA package with wettable flanks that facilitate automatic optical inspection in high-quality surface-mount assembly processes. The product is scheduled to be available by July 2026 from $25 for orders of 1000 pieces. Please visit https://www.st.com/IIS3DWB10IS for more information. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4778.html</link>
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	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Wed, 3 Jun 2026 07:00:58 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics raises its revenue ambition for Data Centers amidst continued strong demand for AI infrastructure]]></title>
	<description><![CDATA[In light of continued strong AI infrastructure-led demand and based on recent progress made on capacity ramp-up, STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is raising its revenue ambition for Data Centers. Data center revenues are now expected at about $1 billion in 2026 (compared to “nicely above $500 million” expected previously). Assuming the current dynamic continues and with the current engagements we have, revenues could double in 2027 (compared to “well above $1 billion” expected previously). Forward-looking Information Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors: changes in global trade policies, including the continuation, adoption and expansion of tariffs and trade barriers and sanctions, that are affecting and could further affect the macro-economic environment and are adversely impacting and could further adversely impact the demand for our products; uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which are impacting and may further impact production capacity and end-market demand for our products; customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all; the ability to design, manufacture and sell innovative products in a rapidly changing technological environment; changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities; unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our research and development and manufacturing programs, which benefit from public funding; financial difficulties with any of our major distributors or significant curtailment of purchases by key customers; the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers; availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation); the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology; theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation; the impact of intellectual property claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions; changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets; variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations; the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant; product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts; natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate; increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027; epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results; industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations; and individual customer use of certain products, which may differ from the anticipated uses of such products and result in differences in performance, including energy consumption, may lead to a failure to achieve our disclosed emission-reduction goals, adverse legal action or additional research costs. Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions. Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2025 as filed with the Securities and Exchange Commission (“SEC”) on February 26, 2026. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances. Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our SEC filings, could have a material adverse effect on our business and/or financial condition. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3396.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 2 Jun 2026 07:01:57 +0200</pubDate>

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	<title><![CDATA[Water stewardship in action]]></title>
	<description><![CDATA[This article from our sustainability magazine Amplify highlights how our teams are enhancing water recycling in Kirkop (Malta) and strengthening collaborative water stewardship in Shenzhen (China). Water stewardship in action Chip production relies heavily on water, especially ultrapure water, which is needed to manufacture them. This dependency challenges semiconductor makers to optimize their use of water. By prioritizing water recycling and efficient usage, companies can reduce environmental impact while supporting the industry’s growth and resilience. At ST, we have developed a clear and practical approach to water stewardship focused on monitoring, risk management, and innovative solutions. This includes water stress assessments, conservation programs, water efficiency improvements, and wastewater treatment initiatives. Putting this approach into practice means implementing effective solutions at our sites. In Kirkop (Malta), our team introduced an advanced water recycling system that treats and reuses both production and facility wastewater. This system helps conserve valuable water resources while supporting our manufacturing needs. To better understand how this innovative system works, let’s take a closer look at the water treatment process step by step. 01 / EQUALIZATION TANK Water from production, domestic, and other facility sources is collected and mixed in the equalization tank. Here, the pH is carefully adjusted to create an optimal environment for beneficial bacteria to thrive. 02 / OXIDATION TANK The water flows into the oxidation tank, where tiny air bubbles promote natural breakdown of pollutants by bacteria. Nutrients such as glucose, urea, and phosphorus are added in precise amounts to support this process. Bioflocculation occurs here, causing bacteria and particles to clump together, which helps separate solids and improve water quality. 03 / MICRO BIOREACTOR (MBR) MEMBRANE FILTRATION The water then passes through the MBR membrane, an advanced filtration system that uses pressure to produce clean, high-quality water within a compact footprint. A 24/7 online monitoring system continuously tracks water quality, ensuring the treated water meets ultrapure standards and is ready for reuse. 04 / SLUDGE MANAGEMENT AND DECANTING To maintain system efficiency, sludge is regularly removed. A decanter extracts water from the sludge, leaving solid waste that is safely managed, completing a carefully controlled cycle of treatment and reuse. The need for collaboration We recognize that managing water responsibly means more than just focusing on our own sites. Water is a shared resource, and effective stewardship requires collaboration. We work with suppliers and industry groups, such as the Responsible Business Alliance, to share knowledge and advance water systems. Since joining the Alliance for Water Stewardship (AWS) in 2023, we have strengthened our approach to water stewardship. AWS stands out for its broad focus on water challenges and its thorough look at local water contexts beyond individual site operations. This encourages collaboration among many stakeholders to address shared water issues. Our Shenzhen site (China), has led the way in putting these ideas into action. In December 2024, it became the first ST site to be AWS certified, achieving Platinum ranking. The project involved several teams across the site, including Environmental, Health and Safety (EHS), Operations, Facilities, Quality Management, and Corporate Sustainability. Their main goal was to complete AWS certification within one year while establishing new ways to engage with stakeholders such as suppliers, neighboring businesses, NGOs, and local communities. Among the key initiatives was a pilot project to reuse reclaimed water for municipal uses like road cleaning and landscaping irrigation. This reduced wastewater discharge and conserved tap water. In partnership with Hitachi Global Storage Technologies, the team improved industrial wastewater treatment and built infrastructure that can supply reclaimed water to the community with a capacity of 4,000 cubic meters per day. In addition, the team conducted a supply chain water risk assessment by distributing questionnaires and analyzing responses from several suppliers. This helped identify water risks and indirect water use across the supply chain, providing valuable insights for future action. This article is one of many featured in our new sustainability magazine. Explore the full issue to discover more initiatives, insights, and perspectives from across ST at st-sustainability-magazine-amplify-vol1-en.pdf]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0020.html</link>
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	<pubDate>Mon, 1 Jun 2026 12:59:52 +0200</pubDate>

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	<title><![CDATA[Statement from the Supervisory Board of STMicroelectronics]]></title>
	<description><![CDATA[Following the conclusion of STMicroelectronics N.V. (NYSE: STM) Annual General Meeting of Shareholders, which took place today in Amsterdam (the Netherlands), the members of the Supervisory Board of ST appointed Mr. Armando Varricchio as the Chairman and Mr. Nicolas Dufourcq as the Vice-Chairman of the Supervisory Board, respectively, for a 3-year term to expire at the end of the 2029 AGM. The biographies of Messrs. Varricchio and Dufourcq are available on the Company’s website (www.st.com). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3395.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 27 May 2026 11:50:59 +0200</pubDate>

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	<title><![CDATA[All resolutions approved at the 2026 STMicroelectronics’ Annual General Meeting of Shareholders]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the results related to the voting items of its 2026 Annual General Meeting of Shareholders (the “2026 AGM”), which was held today in Amsterdam, the Netherlands. The press release is available as a PDF here.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3394.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 27 May 2026 11:40:39 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications from AI servers to robotics]]></title>
	<description><![CDATA[New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications that support electrification. The 700V PowerGaN devices in the STPOWER portfolio address challenges such as rising AI server power consumption and the need for higher-performance power conversion beyond the limits of conventional silicon technologies. ST’s new PowerGaN devices deliver high efficiency and power density to high-voltage power supplies. Engineered for a 700V operating rating, they support reliable high-power operation and higher-frequency topologies. PowerGaN’s inherent advantages, including low conduction losses, very low switching loss at high operating frequencies, and zero reverse-recovery charge, enable reduced system size, weight, and operating temperature. These attributes are important for power semiconductors used in robotics, industrial power supplies, and smart-grid converters for energy generation, distribution, and storage. “Broadening our PowerGaN portfolio with new 700V devices extends the benefits of gallium-nitride technology into medium-power and high-power applications,” said Mario Aleo, Executive Vice President, Power & Discrete Sub-Group, STMicroelectronics. “We will continue to expand the portfolio with additional voltage ratings and features, reinforcing our commitment to GaN for tomorrow’s AI servers, humanoid robotics, industrial power, and advanced consumer power applications including home appliances.” Technical Notes to Editors: The seven new GaN enhancement-mode transistors (HEMTs) now joining ST’s 700V PowerGaN series cover a wide range of continuous current ratings, from 6 A to 29 A, and typical RDS(on) from 53 mΩ to 270 mΩ. Also featuring ultra-low internal capacitances and low gate charge, inherent in GaN wide-bandgap technology, each has a Qg x RDS(on) figure of merit (FoM) significantly ahead of traditional silicon devices. Qualified to ST’s reliability standards, the 700V devices broaden choices and ensure leading‑edge performance and efficiency. They can drop into power‑conversion circuits as a replacement for MOSFETs, or enable new, higher‑frequency topologies. Their capability to operate at elevated switching frequencies reduces the size of magnetics and passives, enabling a more compact power stage and higher power density. The devices are housed in DPAK, TO-LL, and PowerFLAT surface-mount packages that are proven in practice and widely supported by major electronic design automation libraries and toolchains. The TO-LL and PowerFLAT devices provide a Kelvin source connection that separates the gate-control circuit from the main power path to maximize noise immunity, protect the gate driver, and preserve timing margin. The devices introduced are: • SGT350R70GTK (6 A, 270 mΩ*) in 6.10 mm x 6.60 mm 3-pin DPAK with solderable tab. • SGT070R70HTO (26 A, 53 mΩ*) in leadless TO-LL with thermally efficient drain and source connections. • SGT080R70ILB (29 A, 60 mΩ*), SGT105R70ILB (21.7 A, 80 mΩ*), SGT140R70ILB (17 A, 106 mΩ*), SGT190R70ILB (11.5 A, 138 mΩ*), SGT240R70ILB (10 A, 165 mΩ*) in PowerFLAT 8x8 with solderable source pad for enhanced thermal performance. (*) typical RDS(on) The new 700V PowerGaN transistors are in production now and available from the eSTore or through distributors, from $0.63 to $2.25 for orders of 1000 pieces. Please visit https://www.st.com/new-700v-powergan]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/n4776.html</link>
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	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 26 May 2026 14:00:02 +0200</pubDate>

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	<title><![CDATA[How ST’s intelligent sensing is enabling Physical AI]]></title>
	<description><![CDATA[By Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group, Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office. From factory floors and operating rooms to self-driving cars and smart homes, artificial intelligence is taking on tasks that require it to understand and respond to the real world in real time. This is the era of Physical AI: systems that don\'t just process data, but perceive, decide, and act. For AI to operate safely and reliably in dynamic environments, it needs a continuous, accurate feed of physical-world information from temperature to motion, pressure, proximity and orientation, interpreted fast enough to matter. This sensing layer is the foundation on which every downstream decision rests. STMicroelectronics sits at the heart of this challenge. With a technology portfolio spanning MEMS and optical sensing, microcontrollers, edge AI processing, and wide bandgap semiconductors for power delivery, ST provides the full signal chain from first sensor contact to final actuator command. The ability to filter, classify, and act on physical data before it ever reaches a central processor is critical. Intelligent sensing is becoming a defining enabler of Physical AI, and ST\'s approach is shaping what machines can know, and do, about the world around them. Why Physical AI needs more than data Most AI innovation of the past decade has been driven by algorithms trained in data centers and deployed via the cloud. But as AI migrates into cars, factories, hospitals, and homes, its performance is constrained by the quality, fidelity, and timeliness of its inputs. Sensing is at the heart of making good decisions. But the dominant sensing architecture today is still fundamentally passive: sensors stream raw data to centralized processors, which derive context and issue commands. This creates three structural problems that become increasingly untenable as AI takes on safety-critical roles. Latency is the most immediate. Autonomous vehicles, industrial robots, and human-machine interfaces cannot wait for a round trip to a remote processor. Decisions must be made in milliseconds, at the point of perception. Power and bandwidth are next. Continuous transmission of raw sensor data is expensive in energy and network resources. Physical AI requires millions of devices, many running on battery to scale. Safety and reliability are the most consequential. Noisy signals, dropped data, or misinterpreted data in systems that operate near people pose risks. The closer AI gets to the physical world, the higher the cost of a perceptual failure. The shift underway is therefore not about deploying more sensors but about using more intelligent ones. ST\'s answer: sensors that sense and think STMicroelectronics is addressing this challenge by moving intelligence as close as possible to where data originates. Rather than treating sensors as passive data sources, ST\'s intelligent sensing solutions extract context locally, filter and interpret raw signals at the edge, and transmit only the information that matters. The result is lower latency, reduced power consumption, lighter network load, and stronger privacy, because most data never needs to leave the device. ST pursues this through two complementary and increasingly converging pillars. Firstly, Edge AI combines ST\'s sensors with STM32 microcontrollers and dedicated AI accelerators to enable analytics and inference directly on the device. This delivers fast, deterministic responses without dependence on cloud connectivity, a critical capability in automotive systems, industrial controls, and smart infrastructure where network availability cannot be assumed and response times are measured in microseconds. Secondly, in-sensor AI pushes intelligence further still, inside the sensor itself. Through embedded cores such as the Intelligent Sensor Processing Unit (ISPU) and on-sensor machine learning engines, ST devices can process raw sensing data in real time, execute ML algorithms at ultralow power, and output high-level information using a classified gesture, a detected anomaly, a recognized motion pattern, rather than a raw data stream. This matters enormously in wearables, robotics, and personal electronics, where responsiveness and battery life are fundamental requirements. Together, these pillars define a new sensing paradigm with sensors that understand what they perceive. ST’s full-stack advantage What distinguishes ST\'s position in intelligent sensing is not any single technology, but the coherence of the stack behind it. ST brings together leadership in MEMS motion, pressure, and environmental sensing; advanced imaging capabilities including 2D, 3D, and Time-of-Flight; STM32 microcontrollers with neural processing units; and the software tools to integrate them. Crucially, ST controls this stack from research and design through to manufacturing, including 300 mm fabs in Europe. This integration means ST can engineer the interfaces between sensing, processing, and actuation as a coherent system, rather than optimizing each layer in isolation. For Physical AI architectures, where the interaction between sensing and decision-making is the performance-critical variable, this is a genuine differentiator. ST\'s technology and product breadth positions the company to serve both consumer and high-value automotive and industrial applications simultaneously. From consumer to mission-critical ST has long been a trusted sensing partner for consumer electronics, enabling the motion awareness, environmental responsiveness, and biometrics that have become standard in smartphones, wearables, and gaming devices. That consumer heritage built on volume, miniaturization, and power efficiency, provides a strong foundation for the more demanding environments ST is increasingly serving. Intelligent sensing is becoming foundational infrastructure for the most significant structural shifts of the coming decade: the energy transition, remote and continuous healthcare, smart cities, next-generation consumer devices, and the continued automation of industry. Across all of them, the sensor is no longer a passive input device. It is an intelligent agent at the frontier between the digital and physical worlds. In automotive, ST\'s intelligent sensing is enabling driver and in-cabin monitoring, advanced driver assistance systems (ADAS), and autonomous driving. In industrial settings, it underpins collaborative robotics, predictive maintenance, and condition monitoring on factory floors. In smart infrastructure, it supports continuous, low-power monitoring of buildings, energy systems, and urban environments. In imaging, ST is concentrating on high-growth segments where precise, robust perception is essential for future mobility, automation, and smart environments. What intelligent sensing enables: the capability map Across every domain where Physical AI is taking hold, ST\'s intelligent sensing portfolio is unlocking a consistent set of strategic capabilities: Immediate responsiveness. Robots, vehicles, and autonomous devices can react to people and changing conditions in real time, enabling interactions that feel natural rather than mechanical. Operational safety. Continuous, high-fidelity perception and motion awareness are prerequisites for systems that share space with humans whether on a factory floor, a public road, or in a domestic environment. Edge independence. Local processing reduces dependence on network connectivity, increases system resilience, and cuts the energy and bandwidth cost of large-scale deployment. System simplicity. Higher integration and embedded intelligence reduce external component counts, lowering both system complexity and bill-of-materials cost. Predictive maintenance and uptime. Low-power continuous monitoring enables condition-based maintenance strategies that extend asset life and reduce unplanned downtime. Privacy and trustworthiness. Sensitive data processed on-device never traverses a network. Combined with in-house manufacturing and a robust supply chain, this supports secure, auditable deployment at scale. The humanoid robot test case No application illustrates the demands of Physical AI more vividly than humanoid robotics. A humanoid robot must sense its environment continuously and accurately, understand human presence and intention, maintain dynamic balance, navigate unpredictable spaces, and manipulate objects, often in close proximity to people, in real time, without fail. It is, in effect, a walking proof of concept for every challenge Physical AI must solve. ST estimates that a typical humanoid robot contains approximately $600 of addressable semiconductor content. ST is already working with multiple humanoid robot developers worldwide, providing the sensing and edge computing capabilities that allow these systems to perceive, move, and interact safely in human environments. As the humanoid market scales from research platforms to deployed systems, the quality of sensing will be among the most important variables. That awareness is what Physical AI requires. And sensing is where it begins. Conclusion Physical AI is already being designed into products that will define the next generation of mobility, manufacturing, healthcare, and infrastructure. By embedding intelligence at the point of perception ST is helping customers build machines that are not merely connected to the world, but genuinely aware of it.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0019.html</link>
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	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 26 May 2026 07:00:46 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics President and CEO Jean-Marc Chery to speak at BNP Paribas Exane CEO conference]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) President and Chief Executive Officer Jean-Marc Chery will speak at the BNP Paribas Exane CEO conference in Paris on June 2, 2026 at 11 A.M. Central European Time. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay until June 16, 2026. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3393.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 25 May 2026 07:00:50 +0200</pubDate>

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	<title><![CDATA[ST and quantum: bringing industrial scale to a new compute frontier]]></title>
	<description><![CDATA[ST is bringing its industrial semiconductor expertise to quantum computing, helping advance silicon-based quantum processors toward commercial viability, with the quality, scalability, and cost discipline required for real-world deployment. With its integrated device manufacturer (IDM) model, 300 mm manufacturing leadership in its Fab in Crolles/France, and fully depleted silicon-on-insulator (FD-SOI) technology platform, ST is well positioned to address one of quantum computing’s central challenges: industrialization. Why quantum computing now? Quantum computing is a major frontier in advanced computing, with the potential to address problem classes that are increasingly difficult for classical systems. For ST, the opportunity lies in helping turn that scientific progress into manufacturable, scalable, and reliable technology. Our industrial semiconductor expertise, with our 300 mm manufacturing capabilities in Crolles/France, is highly relevant to this next phase of quantum computing, where success will depend as much on industrialization as on physics. Where is the field today? Quantum computing is entering a phase where industrial requirements matter more than ever. The next step is not only to prove that a device works, but also to build systems that are manufacturable, stable, and scalable. From ST’s perspective, the future of quantum will depend on the same disciplines that have shaped advanced semiconductor technologies: process control, integration, quality, and platform maturity. Industrializing those breakthroughs is what will make quantum relevant for real-world compute environments, including future applications powered by high-performance computing. What qualifies ST for the quantum industry? ST is an industrial enabler of quantum computing. As a global IDM, we bring deep manufacturing expertise and proven technology development capabilities to a field that must move from laboratory demonstrations to scalable hardware. Our role is to help bridging the gap between quantum potential and industrial deployment, because quantum computing will only become broadly relevant if it can be produced with the consistency, integration, and quality expected from advanced semiconductor technologies. Why does ST believe silicon / FD-SOI will help industrialize quantum computing? ST believes that silicon-based approaches are especially promising because they build on the semiconductor industry’s strengths and investment for high-volume manufacturing, thus offering a faster path to industrialization. FD-SOI is particularly relevant because it combines strong power-performance, excellent variability control and high integration potential, capabilities that are critical for quantum architectures, where stability, precision, and reproducibility matter. Together, these attributes help move quantum hardware from experimental concepts to manufacturable quantum hardware. What must happen for quantum to scale? ST brings the industrial foundations needed to help quantum hardware scale. As a global IDM, we have end-to-end control from technology development to manufacturing execution, and our 300 mm manufacturing leadership provides the process maturity, consistency, and scalability required for industrial deployment. We also bring deep expertise in FD-SOI, a technology platform particularly well suited to applications where power efficiency, variability control, and integration are essential. How does this fit into the broader compute landscape? ST sees quantum computing and HPC as complementary parts of a broader advanced computing landscape. HPC will remain essential for large-scale simulation, classical workloads, and data-intensive applications while quantum computing may one day accelerate specific classes of highly complex problems where classical computing becomes less efficient. The future is likely to be heterogeneous, with quantum and classical systems working together and ST’s role is to provide the semiconductor foundations that support this evolution.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0018.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Thu, 21 May 2026 07:00:13 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics brings always-on vision to next-generation personal electronics with new ultralow-power image sensors]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB color) sensors, part of the ST BrightSense portfolio, are now available to early adopters, enabling customers to start designing their next generation of smart, ultralow-power vision devices today. Designed for the next wave of personal electronics and smart devices, the new sensors serve applications including wearables, AR/VR and XR headsets, smart home appliances and medical devices. They are engineered to deliver rich visual context and AI-ready data under tight constraints on power, size, and cost. The sensors combine an ultralow-power detect-and-wake architecture with a very small global-shutter optical format and interfaces optimized for low-power microcontrollers and cost-effective systems on chips (SoCs). “Always‑on vision is becoming essential for the next generation of personal electronics, from smart glasses and AR/VR headsets to intelligent home appliances and medical devices. With VD55G4 and VD65G4, we are bringing this capability to smaller, lighter products that must run for a long time on a tiny battery. These new sensors help our customers create more intuitive and responsive experiences, extend battery life, and bring embedded vision and edge AI into everyday devices,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. From wearables and AR/VR to smart appliances VD55G4 and VD65G4 bring always‑on vision to products that must stay small, light, and extremely power‑efficient. Building on the ST BrightSense family, they add a color option, faster response for interactive use cases, and simple connectivity to low‑power microcontrollers, making it easier to add vision to space‑ and cost‑constrained designs. In wearables, the sensors enable all‑day, always‑aware features such as glance detection, presence sensing, and contextual alerts, while fitting into very compact designs and working directly with microcontroller‑based platforms. For AR/VR and XR headsets, they combine low power and high‑quality capture to support accurate tracking and spatial awareness, helping extend battery life without compromising comfort. In smart home appliances, IoT devices, and medical products, the sensors allow more intelligence to run locally on the device itself, reducing cloud dependence and standby power. Their tiny size and energy efficiency also make them well suited to solar‑ or energy‑harvesting‑powered vision nodes. Ultralow‑power design that consumes up to 10x less Thanks to an optimized sensor architecture and dedicated always‑on mode, VD55G4 and VD65G4 can consume up to 10 times less power than conventional global‑shutter sensors. They can watch for changes in a scene and wake up the main processor only when needed, shifting from continuous streaming to event‑driven operation. This enables all‑day, always‑on experiences, longer battery life, and practical vision systems powered by small batteries or energy harvesting. Their very small footprint and integrated image processing simplify design and reduce system cost, while supporting responsive, AI‑ready vision features in a wide range of edge devices. Growing design ecosystem The VD55G4 (monochrome) and VD65G4 (RGB color) image sensors are produced on 300 mm wafers using a 3D‑stacked 65 nm / 40 nm architecture and in-house process and manufactured in ST Crolles plant. ST is also offering the full companion ecosystem with multiple tools and resources, including: • development boards for platforms such as STM32 and Raspberry Pi, • turnkey camera modules, • evaluation software, platform drivers, • a software development kit to accelerate embedded vision projects. These upcoming public resources will help designers quickly prototype and deploy always-on vision solutions with these new sensors. Pricing information and sample requests are available from STMicroelectronics sales offices. Learn more about ST BrightSense portfolio at: www.st.com/industrial-consumer-cmos-image-sensors About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/p4772.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/04/P4772D-Apr-28-2026-New-BrightSense-image-sensors_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Tue, 28 Apr 2026 07:01:57 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics to host investor call on the LEO opportunity]]></title>
	<description><![CDATA[STMicroelectronics N.V. (NYSE: STM) will host a webcast for investors and analysts on May 4, 2026, on the LEO opportunity, hosted by Remi El-Ouazzane, President of ST’s Microcontrollers, Digital ICs and RF products Group. The presentation, starting at 3.30pm CET / 9.30am ET, will be followed by a Q&A session. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3391.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 23 Apr 2026 14:01:53 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics Reports Q1 2026 Financial Results]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the first quarter ended March 28, 2026. This press release also contains non-U.S. GAAP measures (see Appendix for additional information). ST reported first quarter net revenues of $3.10 billion, gross margin of 33.8%, operating income of $70 million, and net income of $37 million or $0.04 diluted earnings per share (non-U.S. GAAP1 gross margin of 34.1%, non-U.S. GAAP1 operating income of $171 million, and non-U.S. GAAP1 net income of $122 million or $0.13 diluted earnings per share). Jean-Marc Chery, ST President & CEO, commented: “Q1 net revenues, excluding the contribution of our acquisition of NXP’s MEMS sensor business, came above the mid-point of our business outlook range, driven mainly by higher revenues in our engaged customer programs in Personal electronics and CECP. Gross margin was above the mid-point of our business outlook range mainly due to better product mix.” “On a year-over-year basis, Q1 net revenues increased 23.0%; excluding the contribution of our acquisition of NXP’s MEMS sensor business, they increased 21.4%. Q1 gross margin was 33.8%, operating margin was 2.3% and net income was $37 million. On a non-U.S. GAAP basis gross margin was 34.1%, operating margin was 5.5% and net income was $122 million.” “In Q1, despite the macroeconomic uncertainty, we saw improving demand with strong booking and normalized inventory in distribution.” “Our second quarter business outlook, at the mid-point, is for net revenues of $3.45 billion, increasing 11.6% sequentially and 24.9% year-over-year. Gross margin is expected to be about 34.8%, including about 100 basis points of unused capacity charges. Non-U.S. GAAP1 gross margin is expected to be about 35.2%.” “ST is now strategically positioned to capture upside from new AI driven programs, leveraging specialized technologies to enable the evolving AI infrastructure, confirming our datacenters revenue expectation to be nicely above $500 million for 2026 and well above $1 billion for 2027.” The press release is available as a PDF here. 1 Non-U.S. GAAP. See Appendix for reconciliation to U.S. GAAP and information explaining why the Company believes these measures are important.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3392.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 23 Apr 2026 06:01:29 +0200</pubDate>

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	<title><![CDATA[ST advances towards 2027 carbon neutrality goal]]></title>
	<description><![CDATA[Jean Louis Champseix, Group Vice President Corporate Sustainability at STMicroelectronics, shares our 2025 sustainability results, marking the second year of reporting under the Corporate Sustainability Reporting Directive (CSRD). Using 2024 as a baseline, the 2025 Annual Report provides an updated view of our trajectory towards carbon neutrality by 2027 and our broader environmental and social ambitions. In 2025, we continued to advance our sustainability journey within the company, building on the second year of CSRD reporting and staying on track toward carbon neutrality by 2027. The results below highlight progress across our key environmental and social priorities, reflecting the collective commitment of our teams and partners. Some of our key results in 2025: Climate adverse process gases abated: 83% (up from 76% in 2024), keeping ST on track to reach 90% abatement by 2030. Waste diverted from disposal: 97%, as in 2024, and above the goal to recycle, recover and prepare for reuse at least 95% of waste each year. Water recycled or reused: 51%, slightly down from 53% in 2024. ST has projects underway to reach 60% by 2035. Safety total recordable case rate: 0.47 (using CSRD methodology), compared to 0.65 in 2024 and, better than the goal of <0.75. Labor and human rights: 10 of 11 manufacturing sites with Responsible Business Alliance (RBA) platinum recognition as in 2024. Women in management: 22%, up from 21% in 2024, progressing towards 25% by 2035. These indicators are examples of the progress achieved on some environmental and social topics identified as material in ST’s double materiality assessment and contribute to addressing both the Company’s impacts and the issues that matter to our stakeholders. Status of ST’s carbon neutrality goal We remain on track to achieve carbon neutrality by the end of 2027 for our direct and indirect emissions (Scopes 1 and 2) and product transportation, business travel, and employee commuting emissions (Scope3). In 2025, we achieved our two strategic milestones endorsed by the Science Based Targets initiative (SBTi): 50% reduction of absolute Scope 1 and 2 GHG market-based emissions versus 2018 80% renewable electricity sourcing with ST going further by sourcing 86% renewable electricity in 2025 This achievement reflects energy actions including new power purchase agreements (PPAs) in France and Italy, purchase of energy attribute certificates and where possible, onsite installations for renewable energy production. A key project in 2025 was the start of operations of Singapore’s largest industrial district cooling system at our Ang Mo Kio TechnoPark, developed with our partner SP Group. This system is designed to reduce carbon emissions by up to 120,000 tons per year and cut cooling related electricity use by 20%. Importantly, it also frees up space for additional abatement equipment, supporting ST’s goal to reach 90% process gas abatement by 2030. As part of our 2027 carbon neutrality plan, we are preparing to address residual emissions. In 2025, a roadmap for offsetting residual emissions was defined, identifying carbon credit suppliers that support credible projects and are aligned with recognized quality standards. This work will allow ST to start offsetting residual emissions from 2026, alongside its continued focus on reducing emissions across its own operations and upstream value chain. Embedding sustainability through collaboration Delivering our sustainability ambitions requires them to be embedded into how we run the Company. Over the past year, we strengthened our governance and ways of working, with collaboration at the core. A revised approach to program management has increased cooperation across organizations and functions on shared priorities. Dedicated boards and cross functional workstreams focus on areas such as data digitalization and stakeholder engagement, supporting operational roadmaps and risk management aligned with ST’s double materiality assessment and sustainability strategy. Our employees play a central role. We encourage everyone to contribute to sustainability in their day-to-day activities, acting with shared vigilance and as role models in safety and inclusion. Our strong safety performance in 2025 and steady progress on gender balance in management roles reflect this collective effort. Externally, we are deepening collaboration in our value chain, with a strong focus on decarbonization and responsible business practices. We work closely with suppliers to help reduce upstream emissions and to strengthen social, labor, human rights, and environmental standards. In 2025, we shared a decarbonization charter with our top 50 most GHG emissive suppliers. Industry and multistakeholder collaborations are another important lever. ST has been a member of the Responsible Business Alliance (RBA) since 2005 and joined the Alliance for Water Stewardship (AWS) in 2023. In 2024, our Shenzhen site in China achieved AWS certification, marking the start of our goal to certify our manufacturing sites under the AWS standard by 2035. After more than three decades of commitment, sustainability is firmly integrated into how we run our operations and make business decisions. At ST, employees are given the opportunity to be sustainability actors and to actively contribute to the Company sustainability strategy. By working together with our employees and partners, we strive to create long-term value for all our stakeholders. For further information about our approach to sustainability see: https://www.st.com/sustainability]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0017.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 16 Apr 2026 10:34:23 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics Announces Timing for First Quarter 2026 Earnings Release and Conference Call]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release first quarter 2026 earnings before the opening of trading on the European Stock Exchanges on April 23, 2026. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its first quarter 2026 financial results and current business outlook on April 23, 2026 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until May 8, 2026. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3390.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Fri, 3 Apr 2026 07:00:23 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics Reports on Resolutions to be Proposed at the 2026 Annual General Meeting of Shareholders]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the resolutions to be submitted for adoption at the Annual General Meeting of Shareholders (AGM) which will be held in Amsterdam, the Netherlands, on May 27, 2026. The press release is available as a PDF here.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3389.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 26 Mar 2026 22:46:38 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics China-manufactured STM32 microcontrollers begin volume production]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announces the start of general-purpose STM32 microcontroller deliveries manufactured in China. The first batch of STM32 wafers fully produced in China by Huahong for ST is now being delivered to customers in China. This milestone is a major step forward in ST global supply chain strategy, with additional STM32 families, including performance-oriented, secure, and entry-level microcontroller series, planned for local volume production in 2026. \"Bringing STM32 MCUs to mass production in China is a core commitment of ST to its Chinese customers. In collaboration with Huahong, ST is bringing the very same market-leading products to customers with a secure, reliable, and resilient local microcontroller supply chain. ST will continue to respond to the needs of its Chinese customers with greater speed and precision,” said Henry Cao, Executive Vice President, Sales & Marketing, China Region, STMicroelectronics. Through this collaboration, STMicroelectronics has become the industry\'s first global semiconductor company with a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China. The company has established a fully localized STM32 supply chain, covering all stages from wafer manufacturing to chip packaging and testing. In front-end wafer manufacturing, ST has strengthened its 15-year partnership with Huahong, leveraging the identical 40 nm embedded non-volatile memory (eNVM) technology and quality control standard as in ST\'s global fabs, to ensure seamless compatibility of China-manufactured products with ST’s global quality standards. The packaging and testing are handled by ST\'s Shenzhen fab and local semiconductor assembly and test (OSAT) partners. This manufacturing model offers customers in China a unique dual-supply choice between MCUs manufactured locally and those produced outside China, while maintaining globally consistent quality and compatibility. Product availability (2026-2027) First product with a China for China supply chain STM32H7 series Mature, high-performance general-purpose series, for industrial systems smart home systems with more advanced graphical displays, personal electronics, and medical applications. Status: mass production has begun for initial product models of the H7 series, with additional product models scheduled to enter mass production by end of 2026. Next products STM32H5 series Performance-oriented general-purpose series boosts performance and security, with applications including pluggable optics modules in datacenters as well as a broad range of consumer and industrial systems including air conditioners, home appliances, security systems, pumps, lighting, power conversion, PC peripherals, and smartphone accessories. Status: Mass production planned by end of 2026. STM32C5 series Entry-level microcontroller series targeting applications such as industrial automation, home appliances, motor control, digital power, medical, and consumer applications such as gaming and wearables. Status: Mass production planned by end of 2026. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4767.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/stm32-china-PR_IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Manufacturing]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 23 Mar 2026 07:01:19 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics expands 800 VDC AI datacenter power conversion portfolio with new 12V and 6V architectures in collaboration with NVIDIA]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the expansion of its 800 VDC power conversion portfolio with two new advanced architectures: 800 VDC to 12V and 800 VDC to 6V. Developed according to the NVIDIA 800 VDC reference design, these new power conversion stages complement the previously introduced 800 VDC to 50V solution. The rapidly emerging 800 VDC data center architecture enables higher energy efficiency, reduces power losses, and supports more scalable, high compute density, infrastructure for hyperscalers and AI compute. “As AI infrastructure compute scale continues to expand fast, it requires higher voltage distribution and greater density, which can only be achieved with system-level innovation for each of the different AI server form factors,” said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office at STMicroelectronics. “With these new converters for 800 VDC power distribution, ST brings a complete set of solutions to support the deployment of gigawatt-scale compute infrastructure with more efficient, scalable, and sustainable power architectures.” A complete 800 VDC ecosystem for the different AI server form factors The expansion to 12V and 6V output stages reflects the industry move toward different server architectures requiring different power delivery topologies depending on GPU generation, server height, form factor, and thermal envelope for large-scale training clusters, inference farms, and high-density AI infrastructures. The 50V, 12V, and 6V intermediate DC buses will all coexist in AI data centers depending on rack density, GPU configuration, and cooling strategy. The new 800 VDC to 12V converter enables high-efficiency distribution from rack-level power shelves directly to the voltage domains that feed advanced AI accelerators. The new 800 VDC to 6V path allows OEMs to reduce the number of conversion stages and move the 6V bus closer to the GPU. This reduces copper usage, minimizes resistive losses, and improves transient performance, a critical differentiator for large-scale training clusters. Back in October 2025, STMicroelectronics introduced a fully integrated prototype power‑delivery system showcasing a compact GaN‑based LLC converter operating directly from 800 V at 1 MHz with over 98% efficiency and exceptional power density in a smartphone‑sized footprint exceeding 2,600 W/in³ at 50 V. The three solutions combine ST technologies across power semiconductors (silicon, SiC, GaN), analog and mixed-signal, and microcontrollers. Technical highlights of the new 12V and 6V architectures Direct 800 VDC to 12V high-efficiency conversion: ● Eliminates the traditional 54V intermediate stage, reducing conversion steps and system-level losses. ● Enables higher rack-level efficiency, lower copper usage, and simplified integration for future GPU generations. ● Includes newly developed high-density power delivery board (PDB) achieving efficiency targets exceeding the sum of previous two-stage conversion paths. 800 VDC to 6V architecture for GPU-nearing conversion: ● Is designed for system builders who require power stages closer to the GPU, minimizing IR drop and improving response under fast load transients. ● Completes the topology portfolio for servers with ultra dense GPU configurations. Additional technical information at https://blog.st.com/800-v-hvdc-data-center/ About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4766.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/T4766D-Mar-17-2026-ST-expands-800-VDC-AI-datacenter-power-conversion_PR-IMAGE.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Tue, 17 Mar 2026 08:01:26 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module]]></title>
	<description><![CDATA[STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, 3D scene-mapping, and motion sensing with the NVIDIA Holoscan Sensor Bridge technology, the module integrates natively with NVIDIA Jetson and NVIDIA Isaac open robot development platform, simplifying and accelerating vision system design within the size, weight, and power constraints of humanoid robots. “Humanoid robotics is moving beyond research projects and demonstrations to deliver powerful new machines for a wide range of roles in manufacturing and automotive factories, logistics and warehousing, as well as retail and customer service,” said Marco Angelici, Vice-President of Marketing and Application for Analog Power MEMS and Sensors, at STMicroelectronics. “Our collaboration with Leopard Imaging brings market-leading ST sensors and actuators, seamlessly integrated into the NVIDIA robotics ecosystem, to accelerate the deployment of physical AI applications with human-like awareness.” “Accessing to ST sensors and actuators directly within the ecosystem has allowed us to standardize and streamline data acquisition and logging for humanoid robot vision across the HSB interface,” said Bill Pu, CEO of Leopard Imaging. “Robot builders can use our multi-sensing vision module with Isaac tools to accelerate learning and quickly bridge the ‘sim-to-real’ gap.” Powered by the NVIDIA Holoscan Sensor Bridge, the new module integrates seamlessly with NVIDIA Jetson over ethernet for real-time sensor data ingestion and NVIDIA Isaac open robot development platform, which offers open AI models, simulation frameworks and libraries for developers. The new module includes a build system and application programming interfaces (APIs), artificial intelligence (AI) algorithms curated for mobile robots, sample applications, domain randomization, and a simulation environment containing sensor models. ST continues to integrate its sensors, drivers, actuators, controllers, and development tools into the NVIDIA robotics ecosystem as a key NVIDIA robotics and edge AI partner, including high-fidelity models and proof-of-concept modules. Technical information The Leopard Imaging Systems vision module incorporates: For vision-based sensing, the ST VB1940 automotive-grade RGB-IR 5.1-megapixel image sensor with combined rolling shutter and global shutter modes. ST has also released a mass market and industrial version V**943, part of the ST BrightSense product family, existing in monochrome or RGB-IR, in die or packaged sensor. For motion sensing, the LSM6DSV16X 6-axis inertial measurement unit (IMU) embeds ST machine-learning core (MLC) for AI in the edge, sensor-fusion low-power (SFLP), and Qvar electrostatic sensing for user-interface detection. For 3D depth sensing, the VL53L9CX dToF all-in-one LiDAR module, part of the ST FlightSense product family, provides 3D depth sensing with accurate ranging up to 9 meters. With its resolution of 54 x 42 zones (near 2,300 zones) combined with a wide 55°x42° FoV providing 1° angular resolution, short and long-distance measurements and small objects detection are achievable at up to 100 fps. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com. About Leopard Imaging Inc. Headquartered in Silicon Valley and founded in 2008, Leopard Imaging is a global leader in AI vision innovation, advancing computational imaging performance across autonomous machines, smart drones, AI-enabled IoT, robotics, automation, and medical technologies. Additional information is available at www.leopardimaging.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4765.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/pr2602Leopard_s.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 16 Mar 2026 22:31:57 +0100</pubDate>

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	<title><![CDATA[STMicroelectronics accelerates global adoption and market growth of Physical AI with NVIDIA]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the acceleration of global development and adoption of physical AI systems, including humanoid, industrial, service and healthcare robots. ST is integrating its comprehensive portfolio for advanced robotics, into the reference set of components compatible with the NVIDIA Holoscan Sensor Bridge (HSB). In parallel, high-fidelity NVIDIA Isaac Sim models of ST components are being integrated into both companies’ robotics ecosystems to support faster, more accurate sim-to-real research and development. The first deliverables available to developers today include the integration of Leopard’s depth camera enabled by ST with the NVIDIA HSB and the high-fidelity model of an ST IMU into NVIDIA’s Isaac Sim ecosystem. “ST is well engaged within the robotics community, providing robust support and a well-established ecosystem,\" said Rino Peruzzi, Executive Vice President, Sales & Marketing, Americas & Global Key Account Organization at STMicroelectronics. \"Our collaboration with NVIDIA aims to unleash the next wave of cutting-edge robotics innovation with developer and customer experience streamlined at every step, from the inception of AI algorithms to the seamless integration of sensors and actuators. This will accelerate the evolution of sophisticated AI-driven physical platforms.” “Accelerating the development of next-generation autonomous systems requires high-fidelity simulation and seamless hardware integration to bridge the gap between virtual training and real-world deployment,” said Deepu Talla, Vice President of Robotics and Edge AI at NVIDIA. “The integration of STMicroelectronics’ sensor and actuator technologies with NVIDIA Isaac Sim, Holoscan Sensor Bridge and Jetson platforms provides developers with a unified foundation to build, simulate and deploy physical AI at scale.” Simplifying sensor and actuator integration with the Holoscan Sensor Bridge With the NVIDIA HSB, developers can unify, standardize, synchronize, and streamline data acquisition and logging from multiple ST sensors and actuators, a critical foundation for building high fidelity NVIDIA Isaac models, accelerating learning, and minimizing the sim to real gap. The goal is to simplify the process of connecting ST sensors and actuators to NVIDIA Jetson platforms through pre-integrated solutions for the combination of STM32 MCUs, advanced sensors (including IMUs, imagers, and ToF devices) and motor‑control solutions, particularly for humanoid robot designs. Leopard Imaging’s stereo depth camera for robots is the perfect example. Using ST imaging, depth and motion-sensing technologies, it is expected to support a broad wave of designs across Physical AI OEMs, academic research groups and the industrial robotics community. Reducing cost, complexity challenges with high-fidelity modeling for Omniverse Isaac Advanced robotics developers face high development costs, in addition to modeling challenges. High‑fidelity simulations with extensive randomization demand substantial GPU and CPU resources and large datasets. Selecting which parameters to randomize, and over what ranges, requires deep domain expertise. Poor choices can result in unrealistic scenarios or inefficient training. Finally, excessive variability can confuse models, slow convergence, and degrade real‑world performance when randomization no longer reflects plausible conditions. ST and NVIDIA’s objective is to provide accurate, hardware-calibrated models for the comprehensive portfolio of ST components matching the requirements of advanced robotics. Following the availability of the first model of an IMU, ST is working to bring developers models of ToF sensors, actuators and other ICs derived from benchmark data collected on real ST hardware, using ST tools to capture accurate parameters and realistic behavior, resulting in models optimized to NVIDIA’s Isaac Sim ecosystem. NVIDIA HSB is being integrated into ST’s toolchain collaboratively. As a result, ST and NVIDIA envision that more accurate models will significantly improve robot learning. With models that closely mirror real-world device behavior, robots can learn from simulations that better reflect actual conditions, shortening training cycles and lowering the cost of building and refining humanoid robotics applications. More information on NVIDIA Holoscan Sensor Bridge (HSB) is accessible here. More information on ST solutions to accelerate physical AI development with NVIDIA is accessible here. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/t4764.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/03/PR2603Robot-small.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Mon, 16 Mar 2026 22:01:21 +0100</pubDate>

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