Overview
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
eDesignSuite
Get Started
Partner products
Sales Briefcase
  • The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.

    This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.

    Key Features

    • Very low profile
    • High RF performance
    • PCB space saving
    • Efficient manufacturability
    • LGA footprint compatible
    • Low thickness ≤ 450 µm

Recommended for you

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BAL-UWB-01E3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BAL-UWB-01E3
Active
FLIP CHIP BUMPLESS CSPG Industrial Ecopack2

BAL-UWB-01E3

Package:

FLIP CHIP BUMPLESS CSPG

Material Declaration**:

PDF XML

Marketing Status

Active

Package

FLIP CHIP BUMPLESS CSPG

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
More info
min
max
BAL-UWB-01E3 Available at 2 distributors

Distributor availability ofBAL-UWB-01E3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 4990 1 Order Now
Farnell Element14 EUROPE 5000 1 Order Now

Distributor reported inventory date: 2020-11-24

Distributor Name

DIGIKEY

Stock

4990

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

5000

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2020-11-24

Active
EAR99 NEC Tape And Reel FLIP CHIP BUMPLESS CSPG -40 105 5000
MORE INFO

Unit Price (US$):

-

Country of Origin:

CHINA

BAL-UWB-01E3

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

Distributor availability ofBAL-UWB-01E3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 4990 1 Order Now
Farnell Element14 EUROPE 5000 1 Order Now

Distributor reported inventory date: 2020-11-24

Distributor Name

DIGIKEY

Stock

4990

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

5000

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2020-11-24

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

FLIP CHIP BUMPLESS CSPG

Operating Temperature (°C)

(min)

-40

(max)

105

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

Country of Origin

CHINA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors